Sealed electronic packaging for environmental protection of active electronics

• US 5,739,463 A
• Filed: 03/02/1995
• Issued: 04/14/1998
• Est. Priority Date: 04/11/1994
• Status: Expired due to Term

• Current Assignee: CommScope Technologies, LLC (CommScope Holding Company, Inc.)
• Original Assignee: Raychem Corporation (TE Connectivity Limited)
• Inventors: Nakazato, Akira, Diaz, Steve, Lundquist, Peter, Lippe, Paul von der, Kulkarni, Narendra, Horsma, Dave, Shen, Nelson
• Primary Examiner(s): Ledynh, Bot L.
• Application Number:
  US08/397,600
• Time in Patent Office: 1,139 Days
• Field of Search: 174/35 R, 174/356 C, 174/35 MS, 361/816, 361/818, 428/242, 428/263, 428/285, 428/920, 428/175, 439/607-610
• US Class Current: 174/378
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 5/0039 having a tubular housing wherein the PCB is inserted longitudinally
• CPC Class Codes: H05K 5/068 having a pressure compensation device, e.g. membrane venting means H05K5/0213

Abstract

An environmentally sealed electronics assembly. The assembly includes a flexible envelope surrounding the active electronics board. The electronics board is insertable into the envelope and with subsequent sealing provides a reenterable but environmentally sealed active electronics package. Methods of manufacturing the assembly are also described.

Claims

1. A protection apparatus for an active electronics circuit board comprising:

a flexible environmental gas and liquid barrier envelope capable of accepting the active electronics circuit board, said envelope completely sealed around the entire said active electronics circuit board; and

an interconnection device sealed to said envelope which contains the active electronics circuit board and also permitting the connection of the active electronics circuit board into an electronics system outside said sealed envelope; and

wherein the interior of the envelope contains an infra red radiation absorbing black coating.

2. The apparatus according to claim 1 wherein the flexible envelope comprises at least two plastic layers and a central metal layer wherein the outermost plastic layers are about between 75 to about 200 microns, the interior plastic layers are from about 20 to 200 microns and the central metallic layer is from about 5 to 75 microns.

3. The apparatus according to claim 1 wherein the envelope comprises a sandwich construction of a layer of tear resistant plastic, on opposite sides of a metallic gas liquid barrier;

and

wherein the layer comprises top and bottom layers of a flexible plastic of about 80 microns thick of polyethylene and interior layers about 200 microns thick of a polyamide or polyester and a central metal layer about 20 microns thick.

4. The apparatus according to claim 3 wherein the metal is selected from the group consisting of aluminum, tin, alloys including aluminum, alloys including tin, and mixtures thereof.

5. A protection apparatus for an electronic circuit board comprising:

a flexible environmental gas and liquid barrier envelope capable of accepting the active electronics circuit board, said envelope completely sealed around said active electronics circuit board; and

an interconnection device sealed to said envelope which contains the active electronic printed circuit board and also permitting the connection of the active electronics circuit board into an electronics system; and

wherein the flexible envelope comprises at least two plastic layers and a central metal layer wherein the outermost plastic layers are about between 75 to about 200 microns, the interior plastic layers are from about 20 to 200 microns and the central metallic layer is from about 5 to 75 microns.

6. The apparatus according to claim 5 wherein the outer plastic is a low density polyethylene and the interior layer is selected from the group consisting of a polyamide or a polyester and the central metallic layer is selected from the group consisting of aluminum or alloys thereof.

7. The apparatus according to claim 6 further including a portion of the envelope not including the metallic layer so as to provide a visible window into the interior of the envelope.

8. The apparatus according to claim 7 wherein a transparent tin oxide or indium tin oxide layer is disposed between plastic layers to provide visible access to the board while maintaining a gas and liquid barrier.

9. The apparatus according to claim 7 wherein said interconnection device of said protection apparatus is at least partially filled with a gel sealant to provide for sealing of electrical contacts into the active electronics circuit board.

10. The apparatus according to claim 9 further including a gas scavenger/desiccant package within the interior of the envelope.

11. The apparatus according to claim 9 wherein the envelope is sized to provide slack volume over the range of desired operating conditions.

12. The apparatus according to claim 11 wherein the interconnection device and the portion of the envelope contacting the interconnection device are fabricated from fusion bondable materials.