Sealed electronic packaging for environmental protection of active electronics
First Claim
Patent Images
1. A protection apparatus for an active electronics circuit board comprising:
- a flexible environmental gas and liquid barrier envelope capable of accepting the active electronics circuit board, said envelope completely sealed around the entire said active electronics circuit board; and
an interconnection device sealed to said envelope which contains the active electronics circuit board and also permitting the connection of the active electronics circuit board into an electronics system outside said sealed envelope; and
wherein the interior of the envelope contains an infra red radiation absorbing black coating.
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Abstract
An environmentally sealed electronics assembly. The assembly includes a flexible envelope surrounding the active electronics board. The electronics board is insertable into the envelope and with subsequent sealing provides a reenterable but environmentally sealed active electronics package. Methods of manufacturing the assembly are also described.
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Citations
12 Claims
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1. A protection apparatus for an active electronics circuit board comprising:
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a flexible environmental gas and liquid barrier envelope capable of accepting the active electronics circuit board, said envelope completely sealed around the entire said active electronics circuit board; and
an interconnection device sealed to said envelope which contains the active electronics circuit board and also permitting the connection of the active electronics circuit board into an electronics system outside said sealed envelope; andwherein the interior of the envelope contains an infra red radiation absorbing black coating. - View Dependent Claims (2, 3, 4)
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5. A protection apparatus for an electronic circuit board comprising:
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a flexible environmental gas and liquid barrier envelope capable of accepting the active electronics circuit board, said envelope completely sealed around said active electronics circuit board; and
an interconnection device sealed to said envelope which contains the active electronic printed circuit board and also permitting the connection of the active electronics circuit board into an electronics system; andwherein the flexible envelope comprises at least two plastic layers and a central metal layer wherein the outermost plastic layers are about between 75 to about 200 microns, the interior plastic layers are from about 20 to 200 microns and the central metallic layer is from about 5 to 75 microns. - View Dependent Claims (6, 7, 8, 9, 10, 11, 12)
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Specification