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High density integrated circuit package assembly with a heatsink between stacked dies

  • US 5,739,581 A
  • Filed: 11/17/1995
  • Issued: 04/14/1998
  • Est. Priority Date: 11/17/1995
  • Status: Expired due to Term
First Claim
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1. An integrated circuit (IC) package assembly for supporting dies and providing access to dies, the package assembly comprising:

  • a substrate having a top surface, a bottom surface and a plurality of first traces from the top surface to the bottom surface;

    a first die disposed over the top surface of the substrate and electrically connected to the first traces at the top surface of the substrate;

    a heatsink having a top surface and a bottom surface, with the bottom surface of the heatsink disposed over the top surface of the substrate and over the first die;

    a leadframe having a plurality of leadframe leads, with the leadframe disposed over the top surface of the heatsink; and

    a second die disposed over the top surface of the heatsink and electrically connected to the leads of the leadframe.

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