High density integrated circuit package assembly with a heatsink between stacked dies
First Claim
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1. An integrated circuit (IC) package assembly for supporting dies and providing access to dies, the package assembly comprising:
- a substrate having a top surface, a bottom surface and a plurality of first traces from the top surface to the bottom surface;
a first die disposed over the top surface of the substrate and electrically connected to the first traces at the top surface of the substrate;
a heatsink having a top surface and a bottom surface, with the bottom surface of the heatsink disposed over the top surface of the substrate and over the first die;
a leadframe having a plurality of leadframe leads, with the leadframe disposed over the top surface of the heatsink; and
a second die disposed over the top surface of the heatsink and electrically connected to the leads of the leadframe.
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Abstract
An integrated circuit package assembly with a first die disposed over a first substrate having traces defined therein to provide electrical access to the first die. A heatsink is disposed over the substrate and the first die. A second die and a leadframe is disposed over the heatsink. The leadframe provides electrical access to the second die.
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Citations
35 Claims
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1. An integrated circuit (IC) package assembly for supporting dies and providing access to dies, the package assembly comprising:
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a substrate having a top surface, a bottom surface and a plurality of first traces from the top surface to the bottom surface; a first die disposed over the top surface of the substrate and electrically connected to the first traces at the top surface of the substrate; a heatsink having a top surface and a bottom surface, with the bottom surface of the heatsink disposed over the top surface of the substrate and over the first die; a leadframe having a plurality of leadframe leads, with the leadframe disposed over the top surface of the heatsink; and a second die disposed over the top surface of the heatsink and electrically connected to the leads of the leadframe. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31)
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32. An integrated circuit (IC) package assembly for supporting dies and providing access to dies, the package assembly comprising:
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a first substrate having a top surface, a bottom surface and a plurality of first traces from the top surface to the bottom surface; a first die disposed over the top surface of the first substrate and electrically connected to the first traces at the top surface of the first substrate; a heatsink having a top surface and a bottom surface, with the bottom surface of the heatsink disposed over the top surface of the first substrate and the first die; a second substrate having a top surface, a bottom surface, and a plurality of second traces, with the bottom surface of the second substrate disposed over the top surface of the heatsink; a leadframe electrically connected to the second traces; and a second die disposed on the top surface of the second substrate and electrically connected to the second traces.
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33. An integrated circuit (IC) package assembly for supporting dies and providing access to dies, the package assembly comprising:
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a first substrate having a top surface, a bottom surface and a plurality of traces from the top surface to the bottom surface; a first die disposed over the top surface of the first substrate and electrically connected to the first traces at the top surface of the first substrate; a heatsink having a top surface and a bottom surface, with the bottom surface of the heatsink disposed over the top surface of the first substrate and the first die; a second substrate having an integrated leadframe, a top surface and a bottom surface, with the bottom surface of the second substrate disposed over the top surface of the heatsink; and a second die disposed on the top surface of the second substrate and electrically connected to the second traces.
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34. An integrated circuit (IC) package assembly for supporting dies and providing access to dies, the package assembly comprising:
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a substrate having a top surface, a bottom surface and a plurality of first traces from the top surface to the bottom surface; a first die disposed on the top surface of the substrate and electrically connected to the first traces at the top surface of the substrate; a heatsink having a top surface and a bottom surface, and a plurality of second traces, with the bottom surface of the heatsink disposed over the top surface of the substrate and the first die; a second die disposed over the top surface of the heatsink and electrically connected to the second traces; and a leadframe electrically connected to the second traces. - View Dependent Claims (35)
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Specification