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Single piece package for semiconductor die

DC
  • US 5,739,585 A
  • Filed: 07/29/1996
  • Issued: 04/14/1998
  • Est. Priority Date: 11/27/1995
  • Status: Expired due to Term
First Claim
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1. A semiconductor package comprising:

  • a silicon package body, said package body comprising a first surface and a second surface, said second surface including a die mounting cavity;

    an opening in the package body, said opening extending from the first surface to the die mounting cavity;

    an electrically insulating layer formed on the first surface;

    a pattern of conductors formed on the insulating layer, said conductors comprising a metal layer having a thickness of from 500 Å

    to 10 μ

    m;

    a semiconductor die comprising a plurality of bond pads thereon, said die placed on the die mounting cavity with the bond pads aligned with the opening; and

    a plurality of electrical interconnections extending through the opening to place the bond pads and conductors in electrical communication.

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