Method of inspecting component placement accuracy for each first selected circuit board to be assembled of a batch

• US 5,739,846 A
• Filed: 02/05/1996
• Issued: 04/14/1998
• Est. Priority Date: 02/05/1996
• Status: Expired due to Term

• Current Assignee: UI Holding Company (UI Acquisition Holding Company)
• Original Assignee: Universal Instruments Corporation (Delta Electronics Incorporated)
• Inventors: Gieskes, Koen A.
• Primary Examiner(s): Chin, Tommy P.
• Assistant Examiner(s): RAO, ANAND SHASHIKANT
• Application Number:
  US08/596,499
• Time in Patent Office: 799 Days
• Field of Search: 348/87, 348/86, 348/94, 348/95, 348/125, 348/126, 348/129, 348/133
• US Class Current: 348/87
• CPC Class Codes: G01R 31/2813 Checking the presence, location, orientation or value, e.g. resistance, of components or conductors orientation of the DUT with respect to the test fixture G01R1/06705, G01R31/281
• CPC Class Codes: G01R 31/309 of printed or hybrid circuits or circuit substrates

Abstract

An improved method for inspecting assembled circuit boards utilizes an existing programmable placement machine having an associated downward looking camera, illumination source, and monitor. After assembling a first circuit board of a series with electrical components according to a program which is particular to that series, and prior to removing the assembled board from the machine, an inspection is performed by: (i) automatically repositioning the relative position of the camera and the assembled circuit board, according to a portion of that same particular program, in order to address each placement position in turn; (ii) automatically acquiring an image of each placement position when it is addressed, and furnishing the image to the monitor in order to provide a magnified image on the monitor screen; (iii) visually inspecting the magnified image on the monitor screen in order to ascertain the presence or absence of the component at each placement position, the deviation in X, Y, and θ of the component relative to the desired placement position and/or the accuracy of connection of component leads to their respective lands on the circuit board; and (iv) providing for human control of the time expended at each placement position during the inspecting and correcting the program with any ascertained deviation.

Claims

1. A method of inspecting a circuit board after completing assembly thereof by an assembly machine and verifying the presence, accuracy of placement, and correctness of each assembled component at each corresponding placement position of said circuit board, said circuit board having been assembled according to a particular program by sequentially addressing each said placement position with a pick and place spindle of said assembly machine and assembling each said component thereat by means of said spindle, said method comprising the steps of:

positioning a camera within said assembly machine after said assembly, said camera being capable of acquiring an image of each said assembled component and furnishing said image to a display screen on which said image is presentable in magnified form;

addressing each said placement position with its component assembled thereon sequentially with said camera, according to at least a portion of said program;

utilizing said camera for acquiring and furnishing an image of each said placement position and said assembled component thereat to said display screen so as to present thereon a magnified image; and

visually monitoring said display screen and performing said inspecting by observing each said magnified image, in turn.

2. The method as in claim 1, and further comprising the step of:

controlling, by a human inspector, a dwell time at each said placement position during said addressing so as to ensure adequate inspection.

3. The method as in claim 1, and further comprising the step of:

providing means for an inspector to indicate go or no-go accuracy status at each addressed placement position; and

automatically addressing a next placement position upon indication of said status being made.

4. The method as in claim 1, and further comprising the step of:

recording each fault with said assembled circuit board, as detected by a human inspector, for use after said inspecting is completed.

5. The method as in claim 1, and further comprising the steps of:

providing a template corresponding to each component to be inspected; and

comparing each said template and corresponding component in order to facilitate said inspection.

6. The method as in claim 5, and further comprising the step of:

providing each said template as a transparency with at least an outline of said corresponding component situated upon said transparency.

7. The method as in claim 6, and further comprising the step of:

displaying said template upon said screen in proper proportion to and as an overlay of said corresponding component in order to facilitate said comparing.

8. The method as in claim 7, and further comprising the step of:

providing that each said template also comprises at least an outline of portions of lands of a placement position corresponding to each placement position being addressed.

9. The method as in claim 1, and further comprising the step of:

providing means for a human inspector to determine any desired accuracy deviation in X, Y, and θ

for each said assembled component; and

correcting the particular program placement position of said assembled component according to the determined deviations in X, Y, and θ

.