Electrical circuit board and circuit board assembly

• US 5,740,066 A
• Filed: 07/03/1995
• Issued: 04/14/1998
• Est. Priority Date: 07/03/1995
• Status: Expired due to Fees

• Current Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Cook, John M., Liebman, Henry F., Suppelsa, Anthony J., Suppelsa, Anthony B.
• Primary Examiner(s): Trans, Vincent N.
• Application Number:
  US08/497,974
• Time in Patent Office: 1,016 Days
• Field of Search: 364/488, 364/481, 174/250, 361/748, 361/760, 361/761, 361/777
• US Class Current: 174/250
• CPC Class Codes: G06K 19/06018 one-dimensional coding
• CPC Class Codes: G06K 2019/06253 for a specific application
• CPC Class Codes: H05K 1/0266 Marks, test patterns or identification means
• CPC Class Codes: H05K 1/117 Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
• CPC Class Codes: H05K 2201/09781 Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
• CPC Class Codes: H05K 2201/09927 Machine readable code, e.g. bar code

Abstract

An electrical circuit board (100) includes a substrate (101) on which a metallized bar code pattern (104) is disposed. The substrate (101) further includes an electrical circuit metallization pattern (103) which incorporates at least a portion of the metallized bar code pattern (104).

Claims

1. An electrical circuit board comprising:

a substrate;

a metallized bar code pattern disposed on the substrate; and

an electrical circuit metallization pattern disposed on the substrate, the electrical circuit metallization pattern incorporating at least a portion of the metallized bar code pattern.

2. A circuit board assembly, comprising:

a circuit board substrate;

a plurality of metallized circuit traces disposed on the circuit board substrate;

a coded information metallized pattern disposed on the circuit board substrate, at least a portion of the coded information metallized pattern forms a portion of the plurality of metallized circuit traces; and

a plurality of electrical components located on the plurality of metallized circuit traces.

3. A circuit board assembly as defined in claim 2, in which:

at least one of said plurality of electrical components is located on said portion of the coded information metallized pattern.

4. A circuit board assembly as defined in claim 3, in which:

the coded information metallized pattern is a bar code pattern.

5. A circuit board assembly as defined in claim 2, in which:

the coded information metallized pattern is a bar code pattern.

6. A circuit board assembly as defined in claim 5, in which:

a portion of the bar code pattern forms at least a portion of a metallized circuit trace interconnecting at least two of said plurality of electrical components.

7. A circuit board assembly as defined in claim 5, in which:

at least one of said plurality of electrical components is located on said bar code pattern.

8. A communication device having a receiver, the receiver comprising:

a circuitry for realizing at least a portion of the receiver operation;

an electrical circuit board for accommodating a portion of the circuitry, comprising;

a substrate;

a metallized bar code pattern disposed on the substrate; and

an electrical circuit metallization pattern disposed on the substrate, the electrical circuit metallization pattern incorporating at least a portion of the metallized bar code pattern.