Conductive adhesive bonding means

• US 5,741,430 A
• Filed: 04/25/1996
• Issued: 04/21/1998
• Est. Priority Date: 04/25/1996
• Status: Expired due to Term

• Current Assignee: Bell Semiconductor, LLC (Hilco Inc. (d/b/a Hilco Global))
• Original Assignee: Lucent Technologies, Inc. (Nokia Corporation)
• Inventors: Dahringer, Donald William, Lyons, Alan Michael
• Primary Examiner(s): POWELL, WILLIAM A
• Application Number:
  US08/638,003
• Time in Patent Office: 726 Days
• Field of Search: 216/33, 216/34, 216/100, 216/108, 216/103, 216/13, 216/18, 216/20, 216/52
• US Class Current: 216/34
• CPC Class Codes: C09J 5/02 involving pretreatment of the surfaces to be joined
• CPC Class Codes: H05K 2201/023 Hard particles, i.e. particles in conductive adhesive at least partly penetrating an electrode
• CPC Class Codes: H05K 2203/025 Abrading, e.g. grinding or sand blasting deburring, rounding, bevelling or smoothing conductor edges H05K2203/0346
• CPC Class Codes: H05K 2203/0315 Oxidising metal
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: H05K 3/321 by conductive adhesives
• CPC Class Codes: H05K 3/323 by applying an anisotropic conductive adhesive layer over an array of pads
• CPC Class Codes: H05K 3/382 by special treatment of the metal
• CPC Class Codes: H05K 3/383 by microetching

Abstract

A method of electrically and mechanically bonding conductive surfaces with conductive adhesives, wherein at least one of the conductive surfaces is of the type upon which unstable oxides readily form. The conductive adhesives having a predetermined amount of conductive particles. The conductive particles having a rigidity at least as hard as the materials composing the conductive surfaces and any oxide formed thereon. The bonding method including the step of preparing the conductive surfaces so that a microscopically roughened oxide surface is formed thereon. The method further including the step of simultaneously applying a predetermined amount of heat and pressure to cure the conductive surface-conductive adhesive-conductive surface joint such that the conductive particles in the conductive adhesive pierce through the oxide to make direct contact with the conductive surfaces thereunder. The method controls the mechanical strength of the bond and the electrical characteristics of the bond joint. The electrical characteristics include joint resistivity and joint sensitivity to elevated temperature and/or humidity conditions.

Claims

1. A method of electrically and mechanically bonding a conductive surface made of a material on which unstable oxides form to a target surface using a conductive adhesive, the method comprising the steps of:

a. preparing the conductive surface so that a microscopically rough surface is formed to insure a substantially strong mechanical bond, said microscopically rough surface being coated with an oxide layer;

b. placing the conductive adhesive between said microscopically rough surface and the target surface to form a stack, the conductive adhesive having an amount of conductive particles that have a hardness at least as hard as said microscopically rough surface, said target surface and an underlying metal of said conductive surface, said amount insuring electrical conductivity between said underlying metal of said conductive surface and said target surface; and

c. simultaneously applying heat and pressure to said stack to cure said conductive adhesive such that said conductive particles make contact with said target surface and pierce through said microscopically rough surface to make direct contact with said conductive surface thereunder.

2. The bonding method of claim 1 wherein the target surface is the type upon which stable oxides form, the method further comprising the step of preparing the target surface so that a substantially stable oxide is formed.

3. The method of claim 2 wherein said conductive particles are at least as hard as said hardness of said stable oxide.

4. The method of claim 3 wherein said simultaneous application of said heat and pressure forces said conductive particles through said stable oxide layer to make direct contact with the target surface thereunder.

5. The method of claim 1 wherein said conductive surface comprises a metal selected from the group consisting of aluminum, titanium, copper, steel, aluminum alloys, titanium alloys, copper alloys and steel alloys.

6. The method of claim 5 wherein the conductive surface is aluminum and wherein said microscopically rough surface comprises aluminum oxide.

7. The method of claim 6 wherein said step of preparing the conductive surface includes the step of etching the first conductive surface in a solution of Na₂ Cr₂ O₇ --H₂ SO₄.

8. The method of claim 1 wherein said preparation of the conductive surface in step a, includes the steps of mechanically roughening the first conductive surface thereby removing the oxide formed thereon, and allowing an oxide to naturally form on said roughened conductive surface.

9. The method of claim 8 wherein said roughening step further includes sandblasting the first conductive surface.

10. The method of claim 2 wherein said preparation of the target surface includes the step of cleaning said target surface.

11. The method of claim 10 wherein the target surface is a tin surface.

12. The method of claim 1 wherein said conductive adhesive has a composition including an epoxy resin, a curing agent and said conductive particles.

13. The method of claim 12 wherein said conductive particles are selected from the group consisting of silver plated nickel, silver plated glass, silver plated copper, pure silver, and pure nickel.

14. The method of claim 12 wherein the conductive adhesive is 5 to 30 volume percent said conductive particles.

15. The bonding method of claim 7 wherein the oxide thickness is about 40 nm.

16. The bonding method of claim 1 wherein the target surface is made of a material on which oxides do not form in an oxygen-containing atmosphere, the method further comprising the step of preparing the target surface to form a clean conductive surface thereon.

17. The bonding method of claim 16 wherein said step of simultaneously applying said heat and pressure forces said conductive particles in direct contact with said clean target surface.

18. The method of claim 16 wherein said target surface is composed of a material selected from the group consisting of gold, silver, palladium, platinum and OSP-treated copper.

19. The bonding method of claim 1 wherein the target surface is a material of the type upon which unstable oxides form, the method further comprising the step of preparing said unstable target surface so that a microscopically rough surface is coated with an oxide layer.

20. The method of claim 19 wherein said conductive particles are at least as hard as said hardness of said microscopically rough oxide surface on said target surface.

21. The method of claim 20 wherein said simultaneous application of said heat and pressure forces said conductive particles through said microscopically rough oxide surfaces to make direct contact with the material thereunder.

22. The method of claim 19 wherein said conductive surfaces comprise metals selected from the group consisting of aluminum, titanium, copper, steel, aluminum alloys, titanium alloys, copper alloys and steel alloys.

23. The method of claim 22 wherein the conductive surface is aluminum and wherein said microscopically rough surface thereon comprises aluminum oxide.

24. The method of claim 23 wherein said step of preparing the target and conductive surfaces includes the step of etching said oxidized surfaces in a solution of Na₂ Cr₂ O₇ --H₂ SO₄.

25. The method of claim 19 wherein said step of preparing said target and conductive surfaces includes the step of mechanically roughening the surfaces thereby removing the oxide formed thereon and allowing an oxide to naturally form on said roughened surfaces.

26. The method of claim 25 wherein the surfaces are mechanically roughened by sandblasting.

27. The method of claim 19 wherein said conductive adhesive has a composition including an epoxy resin, a curing agent and said conductive particles.

28. The method of claim 27 wherein said conductive particles are selected from the group consisting of silver plated nickel, silver plated glass, silver plated copper, pure silver, and pure nickel.

29. The method of claim 27 wherein the conductive adhesive is 5 to 30 volume percent said conductive particles.

30. The bonding method of claim 24 wherein the thickness of the microscopically rough oxide is about 40 nm.

31. The bonding method of claim 1 wherein said thickness of said oxide layer insures electrical conductivity between said target surface and said conductive surface after application of said pressure.