Atomic force microscope measurement process for dense photoresist patterns

• US 5,741,614 A
• Filed: 10/16/1995
• Issued: 04/21/1998
• Est. Priority Date: 10/16/1995
• Status: Expired due to Term

• Current Assignee: Nikon Precision Incorporated (Nikon Corporation)
• Original Assignee: Nikon Corporation
• Inventors: Suwa, Kyoichi, McCoy, John H.
• Primary Examiner(s): Young, Christopher G.
• Application Number:
  US08/543,424
• Time in Patent Office: 918 Days
• Field of Search: 430/30, 430/311, 430/312, 430/313, 430/323
• US Class Current: 430/30
• CPC Class Codes: G01Q 60/24 AFM [Atomic Force Microscopy] or apparatus therefor, e.g. AFM probes
• CPC Class Codes: G01Q 80/00 Applications, other than SPM, of scanning-probe techniques manufacture or treatment of nanostructures B82B3/00; recording or reproducing information using near-field interaction G11B9/12, G11B11/24, G11B13/08
• CPC Class Codes: G03F 1/84 Inspecting
• CPC Class Codes: G03F 7/2022 Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
• CPC Class Codes: G03F 7/40 Treatment after imagewise removal, e.g. baking
• CPC Class Codes: G03F 7/70616 Monitoring the printed patterns
• CPC Class Codes: Y10S 977/854 Semiconductor sample

Abstract

Accurate measurement of the sidewalls of photoresist features formed on a semiconductor substrate is achieved by a double mask exposure process. This allows probing the sidewalls of closely spaced photoresist features with the probe tip of an atomic force microscope, in spite of the small (submicron) physical dimensions involved. First a conventional line/space pattern is exposed onto the photoresist using the desired mask. Then a second exposure is made using a second mask which has a special space pattern to effectively remove the already exposed photoresist features along at least one side of one of the previously exposed features. Hence, at least that one side of that one feature is clear of any adjoining photoresist features when the photoresist is then developed after the two exposures. This allows easy access to the sidewall of that one photoresist feature by tilting the probe tip of the atomic force microscope. This allows the measurement of the photoresist feature sidewall characteristics, including for instance angle, curvature and any artifacts present.

Claims

1. A method of measuring a feature formed on a substrate, the feature being one of a number of such features on the substrate, comprising the steps of:

forming a photoresist layer on the substrate;

exposing the photoresist layer to radiation through a first mask pattern which defines a plurality of features;

exposing the photoresist layer to radiation through a second mask pattern, the second mask pattern allowing irradiation of portions of the photoresist layer also irradiated through the first mask pattern;

then developing the photoresist layer, wherein the developed photoresist layer defines at least one particular feature defined by the first exposing step, and the particular feature having no other features within a predetermined distance of one side thereof as defined by the second exposing step; and

contacting the one side of the particular feature with a scanning microscope probe.

2. The method of claim 1, wherein the second step of exposing isolates the one particular feature, whereby there is no other feature within a predetermined distance of either side thereof.

3. The method of claim 1, further comprising the step of tilting the probe relative to a plane defined by a surface of the substrate prior to the step of contacting.

4. The method of claim 1, wherein the photoresist is a positive-type photoresist.

5. The method of claim 1, wherein in the first step of exposing, at least two of the plurality of features lie within 0.5 μ

m of each other.

6. The method of claim 1, wherein the second mask pattern is formed on a same reticle as the first mask pattern.

7. The method of claim 1, wherein the second mask pattern defines at least a single unexposed region of the photoresist layer.

8. The method of claim 1, wherein the probe is a needle-type probe.

9. The method of claim 1, wherein the probe has a dumbbell-shaped tip.

10. The method of claim 2, further comprising the steps of:

contacting both sides of the particular feature with the scanning microscope probe; and

combining measurements taken from the steps of contacting to form an image of the particular feature.

11. The method of claim 1, further comprising the step of:

after the step of developing, etching the substrate, thereby defining at least the one particular feature in the substrate.

12. A method for measuring a surface profile of a portion of a resist layer formed on a substrate, comprising the steps of:

forming latent images of line and space patterns in the resist layer by an exposure apparatus, the line patterns being capable of remaining and the space patterns being capable of being removed from the resist layer after development of the resist layer;

erasing at least one latent image of the line patterns, so as to leave remaining a particular latent image corresponding to at least one of the line patterns;

developing the particular latent image in the resist layer and thereby forming a patterned feature of the resist layer corresponding to the particular latent image; and

measuring a surface profile of the patterned feature by contacting a sidewall of the patterned feature with a scanning microscope probe.

13. A method comprising the steps of:

forming an image of a line and space pattern having a selected pitch in a layer coated on a substrate by exposing the layer using an exposure apparatus, the line and space pattern having a plurality of line patterns effecting to remain in the layer and a plurality of space patterns effecting to be removed from the layer;

removing at least one image of one of the line patterns adjacent to a specific line pattern image formed in the layer, whereby a specific line pattern feature is formed in the layer; and

measuring a surface profile of the specific line pattern feature of the layer by contacting at least one side surface of the specific line pattern feature with a scanning microscope probe.

14. The method of claim 13, wherein the layer is a resist layer coated on the substrate to a predetermined thickness.

15. The method of claim 14, wherein the forming step includes a first exposing step to form a latent image of the line and space pattern within the resist layer.

16. The method of claim 15, wherein the removing step includes a second exposing step to erase a latent image of the at least one or more line pattern adjacent to the specific line pattern image, and a developing step to form the specific line pattern feature according to the specific line pattern.

17. The method of claim 16, wherein the exposure apparatus includes a projection optical system having a resolution performance so as to image a line pattern having a width less than about 0.3 micrometer.

18. A method for measuring a surface profile of a pattern formed in a lithography process, comprising the steps of:

forming an image of a periodic pattern having a selected pitch on a surface of a substrate through a projection system of a lithographic exposure apparatus, the periodic pattern having a plurality of first patterns to remain on the substrate surface and a plurality of second patterns to be removed from the substrate surface;

removing at least one image of one of the first patterns adjacent to a particular first pattern image formed on the substrate surface, whereby a particular first pattern feature is formed on the substrate in an isolated state; and

measuring a surface profile of the particular first pattern feature by contacting at least one side surface of the particular first pattern feature with a scanning microscope probe.

19. The method of claim 18, further comprising the step of determining an image transferring performance of the projection system of the lithographic exposure apparatus on the basis of surface profile information obtained in the measuring step.

20. The method of claim 19, wherein the forming step is performed by projecting an image of said periodic pattern formed on a reticle through the projection system.

21. The method of claim 20, wherein the measuring step further comprises the step of relatively tilting the substrate surface and the scanning microscope probe.

22. The method of claim 20, wherein the substrate is coated with a photoresist layer on its surface, and the removing step includes developing the photoresist layer.