Flexible connector for circuit boards

• US 5,742,484 A
• Filed: 02/18/1997
• Issued: 04/21/1998
• Est. Priority Date: 02/18/1997
• Status: Expired due to Term

• Current Assignee: Motorola Solutions, Inc.
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Gillette, Joseph G., Potter, Scott G., Lall, Pradeep
• Primary Examiner(s): Phillips, Michael W.
• Assistant Examiner(s): FOSTER, DAVID A
• Application Number:
  US08/801,612
• Time in Patent Office: 427 Days
• Field of Search: 361/789, 361/803, 361/784, 361/826, 361/827, 361/767, 361/776, 361/777, 361/749, 439/77, 439/83, 439/85, 439/591, 439/592, 439/586, 174/99 R, 174/261, 174/268, 174/72 TR, 174/90, 174/106 R, 174/113 R, 174/117 F, 174/117 FF
• US Class Current: 361/789
• CPC Class Codes: H01R 12/52 connecting to other rigid printed circuits or like structures
• CPC Class Codes: H01R 12/62 connecting to rigid printed circuits or like structures
• CPC Class Codes: H05K 1/118 specially for flexible printed circuits, e.g. using folded portions
• CPC Class Codes: H05K 1/148 Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
• CPC Class Codes: H05K 2201/0909 Preformed cutting or breaking line
• CPC Class Codes: H05K 2201/09709 Staggered pads, lands or terminals; Parallel conductors in different planes
• CPC Class Codes: H05K 2201/10734 Ball grid array [BGA]; Bump grid array
• CPC Class Codes: H05K 2201/2009 Reinforced areas, e.g. for a specific part of a flexible printed circuit
• CPC Class Codes: H05K 2201/2018 Presence of a frame in a printed circuit or printed circuit assembly
• CPC Class Codes: H05K 3/0058 Laminating printed circuit boards onto other substrates, e.g. metallic substrates H05K1/0281 takes precedence
• CPC Class Codes: H05K 3/3457 Solder materials or compositions; Methods of application thereof
• CPC Class Codes: H05K 3/363 by soldering

Abstract

A surface mountable flexible interconnect (10) for connecting two circuit board (30, 32) consists of a flex circuit (12) with solderable runners (14) on one side, the runners traversing the flex circuit from one end to the other. There is a solderable pad (16) at the end of each runner, and each solderable pad has a solder bump (18) fused to it. A rigid carrier ring (20) is used to hold the flex circuit in position prior to placement on the PCB. The flex circuit is formed into a U-shaped loop (26), and the loop is aligned to the carrier so that the loop is situated in an aperture (24) in the carrier. The solder pads lie directly under the carrier ring and face away from it. An adhesive (22) bonds the flex circuit to the carrier ring.

Claims

1. A surface mountable flexible interconnect for connecting two circuit boards, comprising:

a flexible film having first and second opposed major surfaces, and having a plurality of electrically conductive runners formed on the first major surface, each runner having a terminal portion at each end, and each terminal portion having an electrically conductive bump affixed thereto;

a rigid member for retaining the flexible film, the rigid member having an aperture;

a central portion of the flexible film formed into a loop, said loop disposed in the aperture; and

perimeter portions of the flexible film adhesively bonded to the rigid member by means of an adhesive disposed between the rigid member and the second major surface.

2. The flexible interconnect as described in claim 1, wherein the electrically conductive bump is a solder bump.

3. The flexible interconnect as described in claim 1, wherein the flexible film is polyester or polyimide.

4. The flexible interconnect as described in claim 1, wherein the rigid member is a laminated sheet, injection molded plastic, of metal.

5. The flexible interconnect as described in claim 1, wherein the electrically conductive runners are copper or graphite-based conductive ink.

6. The flexible interconnect as described in claim 1, wherein the film is adhesively bonded to the rigid member by a thermoplastic adhesive.

7. The flexible interconnect as described in claim 1, wherein the film is adhesively bonded to the rigid member by a thermoset adhesive.

8. The flexible interconnect as described in claim 1, wherein the rigid member has a pre-scored break point that will allow the interconnect to bend when the break point is broken.

9. The flexible interconnect as described in claim 1, wherein the loop is formed into the shape of a U, a V, a W or an S.

10. A surface mountable flexible interconnect for connecting two circuit boards, comprising:

a flex circuit having circuit runners on a first side, the runners traversing the flex circuit from one end to the other and having a solderable pad at each end, each solderable pad having a solder bump fused thereto;

a rigid retaining ring having a perimeter portion surrounding a centrally located aperture;

the flex circuit formed into a U-shaped loop;

the flex circuit and the retaining ring aligned to each other so that the loop is situated in the aperture and the solder bumps lie directly under the perimeter portion and face away from the retaining ring; and

an adhesive bonding those portions of a second side of the flex circuit that lie directly above the solder bumps to the perimeter portion of the retaining ring.

11. The flexible interconnect as described in claim 10, wherein the retaining ring is a laminated sheet.

12. The flexible interconnect as described in claim 10, wherein the retaining ring is molded plastic.

13. The flexible interconnect as described in claim 10, wherein the retaining ring has a pre-scored break point that will allow the interconnect to bend when the break point is broken.

14. A surface mountable flexible interconnect for connecting two circuit boards, comprising:

a flexible film having first and second opposed major surfaces, and having a plurality of electrically conductive runners formed on the first major surface, each runner having a terminal portion, with a solder bump affixed thereto;

a rigid member for retaining the flexible film;

a central portion of the flexible film formed into a U-shaped loop;

the flexible film situated with respect to the rigid member so that the U-shaped loop protrudes away from the rigid member, other portions of the flexible film bonded to the rigid member by means of an adhesive disposed between the rigid member and portions of the second major surface that overlie the terminal portions.

15. A surface mountable flexible interconnect system, comprising:

first and second circuit boards, each having a plurality of interconnect pads;

a surface mountable flexible interconnect soldered to the plurality of solder pads, said flexible interconnect comprising;

a flex circuit having conductive runners on a first side, the runners traversing the flex circuit from one end to the other and having a solderable pad at each end, each solderable pad having a solder bump fused thereto for soldering to the interconnect pads;

a rigid retaining ring having a perimeter portion surrounding a centrally located aperture;

the flex circuit formed into a U-shaped loop;

the flex circuit and the retaining ring aligned to each other so that the loop is situated in the aperture and the solder pads lie directly under the perimeter portion and face away from the retaining ring; and

an adhesive bonding those portions of a second side of the flex circuit that lie directly above the solder bumps to the perimeter portion of the retaining ring; and

wherein the rigid retaining ring is removed after the flexible interconnect is soldered to the first and second circuit boards.

16. A surface mountable flexible interconnect, comprising:

a flex circuit having circuit runners on one side, the runners traversing the flex circuit from one end to the other and having a solderable pad at each end, each solderable pad having a solder bump fused thereto;

a rigid retaining member; and

the flex circuit and the retaining ring aligned to each other so that the flex circuit is adhered to a bottom side of the rigid retaining member by an adhesive, and the solder bumps face away from the rigid retaining member.

17. The surface mountable flexible interconnect as described in claim 16, wherein a center portion of the flex circuit is folded into an S-shape.

18. The surface mountable flexible interconnect as described in claim 16, further comprising an additional rigid member adhered to a top side of the rigid retaining member.

19. The surface mountable flexible interconnect as described in claim 16, wherein the rigid retaining member serves as a pickup point for a vacuum pickup tool.