Transfer foil having reflecting layer with surface relief pattern recorded thereon

• US 5,744,219 A
• Filed: 01/04/1995
• Issued: 04/28/1998
• Est. Priority Date: 01/28/1991
• Status: Expired due to Term

• Current Assignee: Dai Nippon Printing Company Limited
• Original Assignee: Dai Nippon Printing Company Limited
• Inventors: Tahara, Shigehiko
• Primary Examiner(s): KRYNSKI, WILLIAM A
• Application Number:
  US08/368,595
• Time in Patent Office: 1,210 Days
• Field of Search: 428/200, 428/202, 428/204, 428/411.1, 428/913, 428/914, 428/42.1, 428/195, 428/203, 428/212, 428/457, 428/488.4, 427/147, 427/148, 156/233
• US Class Current: 428/32.79
• CPC Class Codes: G03H 1/0236 Form or shape of the hologram when not registered to the substrate, e.g. trimming the hologram to alphanumerical shape substrates bearing a hologram G03H1/0272
• CPC Class Codes: G03H 1/0244 Surface relief holograms replicating hologram without interference recording G03H1/0276
• CPC Class Codes: G03H 1/0252 Laminate comprising a hologram layer
• CPC Class Codes: G03H 1/028 by embossing
• CPC Class Codes: G03H 2001/187 Trimming process, i.e. macroscopically patterning the hologram
• CPC Class Codes: G03H 2240/50 Parameters or numerical values associated with holography, e.g. peel strength
• CPC Class Codes: G03H 2250/10 arranged to be transferred onto a carrier body
• CPC Class Codes: G03H 2250/12 Special arrangement of layers
• CPC Class Codes: Y10S 428/914 Transfer or decalcomania
• CPC Class Codes: Y10T 428/1486 Ornamental, decorative, pattern, or indicia
• CPC Class Codes: Y10T 428/24843 with heat sealable or heat releasable adhesive layer
• CPC Class Codes: Y10T 428/24868 Translucent outer layer
• CPC Class Codes: Y10T 428/24942 including components having same physical characteristic in differing degree
• CPC Class Codes: Y10T 428/31504 Composite [nonstructural laminate]
• CPC Class Codes: Y10T 428/31678 Of metal

Abstract

A method wherein a hologram is transferred from a transfer foil formed with a surface relief pattern and having a reflecting layer, and information, e.g., an image or a character, other than information originally recorded on the hologram is added to the transferred hologram. The method comprises preparing a transfer foil having a reflection relief hologram comprising a resin layer having a surface relief pattern, e.g., a relief hologram, a relief diffraction grating, etc., formed on the surface thereof, and a reflecting layer formed on the relief surface of the resin layer, transferring at least a part of the hologram to the surface of an object, and heating a part of the transferred portion with a heating device, thereby destroying the reflecting layer to record another information. Also disclosed are a method which enables a fine hologram pattern to be readily transferred to a large area, a transfer foil having a reflecting layer which enables a surface relief pattern to be transferred precisely with excellent foil breaking characteristics, and a method of producing a surface relief pattern transfer foil.

Claims

1. A transfer foil comprising a releasable base film, a resin layer, a reflecting layer, and a heat-sensitive adhesive layer which are stacked in the mentioned order, and having a surface relief pattern formed on the resin layer on the side thereof where the reflecting layer is provided, said transfer foil being partially heated by a thermal head from the said releasable base film so that said surface relief pattern enables transfer of a precise region, wherein:

the peel strength (A) between said releasable base film and said resin layer is larger than the film breaking strength (B) of said resin layer, and the initial bond strength of said heat-sensitive adhesive layer is larger than said peel strength (A).

2. A transfer foil as claimed in claim 1, wherein said film breaking strength (B) is between 0.5 g/inch and 1.0 g/inch.

3. A transfer foil as claimed in claim 1, wherein said peel strength (A) is between 1.0 g/inch and 5.0 g/inch.

4. A transfer foil as claimed in claim 1, which has a thickness of 5 μ

m to 15 μ

m.

5. A transfer foil as claimed in claim 1, wherein the glass transition temperature (T_g) of said resin layer is higher than the temperature (T_h) applied to bond said heat-sensitive adhesive layer and is between 100°

C. and 150°

C.

6. A transfer foil as claimed in claim 1, wherein said film breaking strength (B) is much larger than the release force (D) during relief pattern formation.

7. A transfer foil as claimed in claim 1, wherein a release layer material has been incorporated in said releasable base film to impart release characteristics thereto.

8. A transfer foil as claimed in claim 1, which has a transparent reflecting layer.

9. A transfer foil as claimed in claim 1, which has a metallic reflecting layer.

10. A transfer foil as claimed in claim 1, wherein a slipping layer is provided on the surface of the releasable base film of said transfer foil that comes into contact with a thermal head.

11. A transfer foil as claimed in claim 10, wherein said slipping layer is formed of a layer containing inorganic powders as a solid slipping agent.

12. A transfer foil as claimed in claim 10, wherein said slipping layer is formed of a layer in which there is dissolved or dispersed an organic slipping agent that is converted into a liquid phase slipping agent upon being heated.

13. A transfer foil as claimed in claim 10, wherein said slipping layer is formed of an extreme surface relief pattern provided on the surface of said releasable base film that comes into contact with a thermal head.

14. A transfer foil as claimed in claim 13, wherein said relief pattern has a pitch lying in the range of 0.5 μ

m to 2.0 μ

m and a depth lying in the range of 0.1 μ

m to 15 μ

m.

15. A transfer foil as claimed in claim 13, wherein said relief pattern is a randomly matted pattern.

16. A transfer foil as claimed in claim 13, wherein said relief pattern is a parallel-line pattern parallel or vertical to the moving direction of a thermal head.

17. A transfer foil as claimed in claim 13, wherein said relief pattern is a relief hologram pattern.