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Adhesive composition for bonding a semiconductor device

  • US 5,744,533 A
  • Filed: 06/04/1997
  • Issued: 04/28/1998
  • Est. Priority Date: 06/04/1997
  • Status: Expired due to Term
First Claim
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1. An adhesive composition suitable for bonding a semiconductor device to a substrate comprising about 60 to 90 wt. % particulate silver;

  • about 10 to 40 wt. % of an adhesive material comprising at least one nonelectrically conductive organic compound; and

    a filler comprising at least one electrically conductive organic compound, said filler forming a conductivity bridge between silver particles.

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