Adhesive composition for bonding a semiconductor device
First Claim
1. An adhesive composition suitable for bonding a semiconductor device to a substrate comprising about 60 to 90 wt. % particulate silver;
- about 10 to 40 wt. % of an adhesive material comprising at least one nonelectrically conductive organic compound; and
a filler comprising at least one electrically conductive organic compound, said filler forming a conductivity bridge between silver particles.
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Accused Products
Abstract
Described is an adhesive composition suitable for bonding a semiconductor device to a substrate comprising about 60-90 wt. % particulate silver; about 10-40 wt. % of an adhesive material comprising at least one nonelectrically conductive organic compound; and a filler comprising at least one electrically conductive organic compound capable of forming a conductivity bridge between silver particles. The adhesive composition may additionally include at least one curing catalyst for the adhesive material, a flexibilizer to render the composition more flexible, a surfactant to facilitate contact with a substrate and/or a material to aid in adjusting the rheology of the composition.
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Citations
18 Claims
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1. An adhesive composition suitable for bonding a semiconductor device to a substrate comprising about 60 to 90 wt. % particulate silver;
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about 10 to 40 wt. % of an adhesive material comprising at least one nonelectrically conductive organic compound; and a filler comprising at least one electrically conductive organic compound, said filler forming a conductivity bridge between silver particles. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 17, 18)
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16. An adhesive composition suitable for bonding a semiconductor device to a substrate comprising:
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particulate silver in an amount up to about 90 wt. %; about 10 to 40 wt. % of an adhesive material comprising at least one nonelectrically conductive organic compound; a filler comprising at least one electrically conductive organic-based compound, said filler forming a conductivity bridge between silver particles; at least one curing catalyst for said adhesive material; at least one flexibilizer; a material to aid in adjusting the rheology of the adhesive composition; and an anti-bleed agent.
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Specification
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- Resources
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Current AssigneeHenkel IP & Holding GmbH (Henkel AG & Co KGaA)
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Original AssigneeJohnson Matthey Incorporated (Johnson Matthey PLC)
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InventorsGrieve, Alan, Iwamoto, Nancy E., Pedigo, Jesse L., Li, Shao Wei
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Primary Examiner(s)Cain, Edward J.
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Application NumberUS08/868,508Time in Patent Office328 DaysField of Search524/440, 524/439US Class Current524/440CPC Class CodesC09J 201/00 Adhesives based on unspecif...
