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Semiconductor packaging technique yielding increased inner lead count for a given die-receiving area

  • US 5,744,858 A
  • Filed: 09/26/1996
  • Issued: 04/28/1998
  • Est. Priority Date: 07/17/1992
  • Status: Expired due to Term
First Claim
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1. A semiconductor device assembly, comprising:

  • a semiconductor die having bond pads;

    a patterned layer of conductive lines, inner ends of the conductive lines defining an area for receiving the die; and

    a body formed about the die and inner ends of the conductive lines, the body having a triangular shape defined by angles alpha, beta and phi, wherein one of the angles is substantially equal to 90°

    .

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