Enhanced defect elimination process for electronic assemblies via application of sequentially combined multiple stress processes
First Claim
1. A method for detecting defects in an electronic assembly including at least one electronic component, coupled via at least one connection point to a printed circuit board, said method comprising the sequentially ordered steps of:
- first performing and completing a temperature cycling test upon the electronic assembly and then;
second performing and completing an electrical burn-in test upon the electronic assembly; and
thenthird performing and completing a random vibration test upon the electronic assembly;
wherein each of the sequential test steps are performed and completed separately from the other test steps.
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Accused Products
Abstract
A method for testing electronic assemblies having an electronic component affixed via solder or other such connections to a printed circuit board. The method includes combining, in order, three sequential stress test steps, into a single stress test for screening defects in the electronic assemblies. In particular, the test combines a thermal cycling stress test followed by a electrical burn-in stress test coupled with functional monitoring of the assembly, followed by a random vibration stress test coupled with functional monitoring of the assembly, each test is imposed with defined parameters upon the electronic assembly. The combination, order, and parameters of the sequential stress test steps provide a single test for electrical assemblies which substantially screens all such assemblies having systematic or random defects while imparting minimal reduction in useful life to the defect-free assemblies by virtue of the testing, thereby resulting in a high reliability product.
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Citations
28 Claims
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1. A method for detecting defects in an electronic assembly including at least one electronic component, coupled via at least one connection point to a printed circuit board, said method comprising the sequentially ordered steps of:
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first performing and completing a temperature cycling test upon the electronic assembly and then; second performing and completing an electrical burn-in test upon the electronic assembly; and
thenthird performing and completing a random vibration test upon the electronic assembly; wherein each of the sequential test steps are performed and completed separately from the other test steps. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
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Specification