Apparatus for testing a bonding position of a bonding wire

• US 5,745,594 A
• Filed: 10/04/1995
• Issued: 04/28/1998
• Est. Priority Date: 12/28/1992
• Status: Expired due to Fees

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation), Toshiba Corporation
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Miyahara, Yuichi
• Primary Examiner(s): Razavi, Michael T.
• Assistant Examiner(s): CHANG, JON CARLTON
• Application Number:
  US08/538,648
• Time in Patent Office: 937 Days
• Field of Search: 382/150, 382/151, 382/147, 382/205, 382/257, 382/258, 382/302, 382/308, 348/126, 348/87, 348/92
• US Class Current: 382/150
• CPC Class Codes: G06T 2207/30152 Solder
• CPC Class Codes: G06T 7/73 using feature-based methods
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/78 Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 2224/859 involving monitoring, e.g. feedback loop
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 24/78 Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 24/85 using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/14 Integrated circuits

Abstract

An imaging device for imaging an object is situated above the object. A downward-illumination device for emitting light to the object is situated as one unit with the imaging device. A background-illumination device for emitting light to the object is situated below the object. An image obtained by the imaging device is stored in a memory unit of an image processing apparatus. The image processing apparatus includes a processing unit for logically processing the image. The illumination devices are connected to power supplies. The image processing apparatus and the power supplies are controlled by a controller. Thus, a bonding position is recognized easily with simple structure, the reliability of test results is enhanced, and the cost for testing is reduced by a decrease in the processing time.

Claims

1. An apparatus for determining a bonding position of a bonding wire, comprising:

imaging means, situated above an object, for imaging the object, the object including a member and the bonding wire bonded to the member;

first illumination means, situated above the object, for emitting light to the object;

second illumination means, situated below the object, for emitting light to the object;

image processing means including a memory unit for storing an image obtained by said imaging means and a processing unit for logically processing said image;

first power supply means for supplying power to operate the first illumination means;

second power supply means for supplying power to operate the second illumination means; and

control means for controlling the operations of said image processing means, said first power supply means and said second power supply means;

said control means including;

data input means for presetting a number of executions (X;

a plural number) of a logical process, each execution comprising a scan of an image pixel-by-pixel, the logical process including an enlargement filtering process and a reduction filtering process;

means for obtaining a first image consisting of an image portion of the member, which image portion has a first brightness, and another image portion having a second brightness, by turning on said first power supply means and imaging the object by means of said imaging means;

means for obtaining a second image consisting of a first image portion of the member and the bonding wire, which first image portion has the second brightness, and a second image portion having the first brightness, by turning on said second power supply means and imaging the object by means of said imaging means;

means for obtaining a third image including a third image portion of the member, the third image portion alone having the second brightness, by subjecting the second image to the enlargement filtering process (X;

a plural number) times during which, for each time (X;

a plural number), the second image is scanned and a center pixel of each group of 3×

3 pixels of the second image is made to have the first brightness if the eight pixels surrounding the center pixel include at least one pixel with the first brightness;

means for obtaining a fourth image by subjecting the third image to the reduction filtering process (X;

a plural number) times during which, for each time (X;

a plural number), the third image is scanned and the center pixel of each group of 3×

3 pixels of the third image is made to have the second brightness if the eight pixels surrounding the center pixel include at least one pixel with the second brightness;

means for obtaining a fifth image including a fifth image portion of the bonding wire on the member, the fifth image portion alone having the first brightness, by combining the first image and the fourth image by one of a NOR process and a NAND process;

means for obtaining a sixth image including a sixth image portion of a part of the bonding wire in contact with the member, the sixth image portion alone having the first brightness, by subjecting the fifth image to the reduction filtering process (X;

a plural number) times during which, for each time (X;

a plural number), the fifth image is scanned and the center pixel of each group of 3×

3 pixels of the fifth image is made to have the second brightness if the eight pixels surrounding the center pixel include at least one pixel with the second brightness;

means for obtaining a seventh image by subjecting the sixth image to the enlargement filtering process (X;

a plural number) times during which, for each time (X;

a plural number), the sixth image is scanned and the center pixel of each group of 3×

3 pixels of the sixth image is made to have the first brightness if the eight pixels surrounding the center pixel include at least one pixel with the first brightness, the seventh image comprising an image of the part of the bonding wire in contact with the member and corresponding to the bonding position of the bonding wire; and

means for detecting the bonding position of the bonding wire on the basis of the seventh image by measuring a center of gravity of a wire collapse portion of the bonding wire.

2. The apparatus according to claim 1, wherein each of said images is a two-value image having only two values of white and black, said first brightness is and said second brightness is black, and said first image and said fourth image are converted to the fifth image by the NOR process.

3. The apparatus according to claim 1, wherein each of said images is a two-value image having only two values of white and black, said first brightness is black, said second brightness is white, and said first image and said fourth image are converted to the fifth image by the NAND process.

4. The apparatus according to claim 1, wherein the means for obtaining the third image includes means for changing the brightness of an image of the bonding wire, excluding a portion of the wire situated over the member, from the second brightness to the first brightness when an enlargement filtering process is executed (X:

a plural number) times, and the means for obtaining the sixth image includes means for obtaining an image, excluding the image portion of the part of the bonding wire in contact with the member, having the second brightness when a reduction filtering process is executed (X;

a plural number) times.

5. An apparatus for determining a bonding position of a bonding wire in which the bonding wire is in contact with a lead, the apparatus comprising:

means for emitting light to an object from above and detecting the light reflected from the object to obtain a first image on the basis of the detected light, the object comprising the lead and the bonding wire;

means for emitting light to the object from below and detecting the light passing through an upper portion of the object to obtain a second image on the basis of the detected light;

means for obtaining a third image by performing on the second image an enlargement filtering process (X;

a plural number) times to obtain a first intermediate image, and performing on the first intermediate image a reduction filtering process (X;

a plural number) times;

means for combining the first image and the third image by one of a NOR process and a NAND process to obtain a fourth image;

means for obtaining a fifth image corresponding to the bonding position of the bonding wire, said fifth image being obtained by performing on the fourth image the reduction filtering process (X;

a plural number) times to obtain a second intermediate image, and by performing on the second intermediate image the enlargement filtering process (X;

a plural number) times; and

means for detecting the bonding position of the bonding wire on the basis of the fifth image by measuring a center of gravity of a wire collapse portion of the bonding wire.

6. The apparatus according to claim 5, wherein the first image has a first brightness at an image portion corresponding to the lead and a second brightness at an image portion corresponding to that portion of the bonding wire which is situated over the lead, the second image has the second brightness at image portions corresponding to the lead and the bonding wire, the means for obtaining a third image includes means for establishing an image portion having the second brightness and corresponding to the lead, the means for obtaining a fourth image includes means for establishing an image portion having the first brightness and corresponding to the portion of the bonding wire which is situated over the lead, and the means for obtaining the fifth image includes means for establishing image portions having the first brightness and corresponding to the portion of the lead in contact with the bonding wire.

7. The apparatus according to claim 6, wherein the first brightness is white, the second brightness is black, and the first image and the third image are converted into the fourth image by the NOR process.

8. The apparatus according to claim 6, wherein the first brightness is black, the second brightness is white, and the first image and the third image are converted into the fourth image by the NAND process.

9. The apparatus according to claim 5, wherein the enlargement filtering process is a process in which, within each group of 3×

3 pixels included in one of the second image and the fourth image, a center pixel of each of the 3×

3 pixels is made to have the first brightness if at least one of the eight pixels surrounding the center pixel has the first brightness, and the reduction filtering process is a process in which, within each group of 3×

3 pixels included in one of the second image and the fourth image, a center pixel of each of the 3×

3 pixels is made to have the second brightness if at least one of the eight pixels surrounding the center pixel has the second brightness.