Automatic alignment and locking method and apparatus for fiber optic module manufacturing
First Claim
1. An alignment and locking system for aligning an optical fiber with an optoelectronic device secured to a substrate and locking the optical fiber in place, said system comprising:
- a computer;
a thin metallic resistor/heater overlying the substrate;
a solder preform overlying said thin metallic resistor/heater, said optical fiber positioned adjacent said solder preform, said solder preform having a known melting temperature and the ability to form a chemical bond with said thin metallic resistor/heater;
a power source for supplying electrical power to said thin metallic resistor/heater suitable for causing said solder preform to melt based on power control signals received by said power source from said computer;
an instrument for determining the amount of light passing between said optical fiber and said optoelectronic device and supplying related received power signals to said computer; and
a manipulator for aligning said optical fiber with said optoelectronic device based on alignment control signals received from said computer, said alignment control signals being based on said received power control signals, said manipulator aligning said optical fiber while said solder preform is melted.
1 Assignment
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Accused Products
Abstract
A method and apparatus for aligning an optical fiber (120) with an optoelectronic hybrid device (112) and locking the optical fiber in the aligned position are disclosed. A fiber coated with an external layer of gold is threaded through a solder preform (130). The optical fiber (120) rests upon a ceramic substrate (104). The ceramic substrate also supports a device submount (108) that houses the optoelectronic device (112). The ceramic substrate (104) supports a resistor/heater formed of a thin film of nickel-chromium alloy (604). The resistor/heater supports a pad (609) formed of a layer of nickel (610) and a layer of gold (612). Located atop the pad (609) is the solder preform (130). Precise control of heating is provided by applying a predetermined voltage to the resistor/heater (122) for precise time periods, thereby eliminating the necessity of making temperature measurements during heating. As the resistor/heater (122) is energized, the solder preform is liquefied. An open loop search process that utilizes signal strength feedback is used to control the operation of an x-y-z micropositioning stage (328) that precisely positions an arm (306) that supports the optical fiber (120). The alignment system also includes a fixturing setup that includes a probe head (340) having multiple electrical probes (502a, 502b, 504a, 504b) and a vertical rod (506) that applies a downward force to the solder during manufacturing.
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Citations
21 Claims
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1. An alignment and locking system for aligning an optical fiber with an optoelectronic device secured to a substrate and locking the optical fiber in place, said system comprising:
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a computer; a thin metallic resistor/heater overlying the substrate; a solder preform overlying said thin metallic resistor/heater, said optical fiber positioned adjacent said solder preform, said solder preform having a known melting temperature and the ability to form a chemical bond with said thin metallic resistor/heater; a power source for supplying electrical power to said thin metallic resistor/heater suitable for causing said solder preform to melt based on power control signals received by said power source from said computer; an instrument for determining the amount of light passing between said optical fiber and said optoelectronic device and supplying related received power signals to said computer; and a manipulator for aligning said optical fiber with said optoelectronic device based on alignment control signals received from said computer, said alignment control signals being based on said received power control signals, said manipulator aligning said optical fiber while said solder preform is melted. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method of aligning an optical fiber with an optoelectronic device so that the optimum amount of light passes between the optical fiber and the optoelectronic device, said method comprising:
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positioning an optical fiber adjacent a solder preform located atop a thin metallic resistor/heater positioned on a substrate that also supports an optoelectronic device; supplying electrical power to said thin metallic resistor/heater for a predetermined time period sufficient for the thin metallic resistor/heater to heat the solder preform to the melting point of the solder; passing light between said optical fiber and said optoelectronic device while said solder preform is melted; detecting the amount of light passing between said optical fiber and said optoelectronic device while said solder preform is melted; and automatically manipulating the position of said optical fiber relative to said optoelectronic device so as to increase the amount of light passing between said optical fiber and said optoelectronic device while said solder preform is melted. - View Dependent Claims (16, 17, 18, 19, 20, 21)
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Specification