End effector for semiconductor wafer transfer device and method of moving a wafer with an end effector

• US 5,746,460 A
• Filed: 12/08/1995
• Issued: 05/05/1998
• Est. Priority Date: 12/08/1995
• Status: Expired due to Term

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Marohl, Dan A., Ngan, Kenny King-Tai
• Primary Examiner(s): KRAMER, DEAN J
• Application Number:
  US08/569,760
• Time in Patent Office: 879 Days
• Field of Search: 294/1.1, 294/27.1, 294/32, 294/64.1-64.3, 294/902, 414/935, 414/936, 414/939, 414/941
• US Class Current: 294/213
• CPC Class Codes: H01L 21/68707 the wafers being placed on a robot blade, or gripped by a gripper for conveyance
• CPC Class Codes: Y10S 414/141 includes means for gripping wafer

Abstract

An end effector for a transfer robot used in connection with the manufacture of semiconductor wafers is provided. The end effector is designed to handle very thin (0.005"-0.010") semiconductor wafers which tend to bow during processing. The robot blade or end effector includes a deep pocket for receiving a bowed wafer. The depth of the pocket may be varied depending upon the degree of bowing in the wafers to be handled. Unlike ordinary wafer transfer devices, the present invention requires the wafer to be transferred with the surface bearing the devices facing down. The deep pocket allows the end effector to contact only the edges of the wafer, thus minimizing any defects across the wafer due to handling. The pocket opening is provided with arcuately shaped sloped wafer contact surfaces to prevent wafer sliding during robot movement.

Claims

1. An end effector for an article transfer device comprising:

a rear support mechanism for attaching the end effector to the article transfer device;

a pocket extending forward from a front edge of the rear support mechanism for receiving an article therein;

wafer capture shoes projecting forward through a peripheral forward end of the pocket;

a lower surface of each of said shoes exhibiting a sloped surface.

2. An end effector for an article transfer device comprising:

a rear support mechanism for attaching the end effector to the article transfer device;

a sloped article contact surface formed in an upper surface of the rear support mechanism along a forward edge thereof;

said sloped article contact surface configured to contact the edges of the article and to prevent lateral movement of the article as it is transferred;

a pair of substantially parallel elongated rods extending horizontally from a lower surface of the forward edge of the rear support mechanism; and

a pair of wafer capture pin caps, each located at a forward end of one of said pair of elongated rods.

3. The end effector according to claim 2, wherein said substantially parallel elongated rods are formed from a rigid material.

4. The end effector according to claim 3, wherein said substantially parallel elongated rods are formed from ceramic or a ceramic compound.

5. The end effector according to claim 4, wherein said rear support mechanism and said pin caps are formed from a metal alloy.

6. The end effector according to claim 5, wherein said metal alloy comprises KOVAR®

.

7. The end effector according to claim 6, wherein said substantially parallel elongated rods are connected to said rear support mechanism and said pin caps by brazing.

8. The end effector according to claim 2, wherein a lower leading edge of each of said pin caps exhibits a chamfer.

9. The end effector according to claim 2, wherein said sloped article contact surface exhibits a slope of about 4°

from the horizontal plane.