Direct chip attachment (DCA) with electrically conductive adhesives

• US 5,747,101 A
• Filed: 04/09/1996
• Issued: 05/05/1998
• Est. Priority Date: 02/02/1994
• Status: Expired due to Fees

• Current Assignee: GlobalFoundries, Inc.
• Original Assignee: International Business Machines Corporation
• Inventors: Gaynes, Michael A., Saraf, Ravi, Zalesinski, Jerzy M., Puligandla, Viswanadham, Murcko, Robert M., Booth, Richard B., Roldan, Judith M.
• Primary Examiner(s): Beck, Shrive
• Assistant Examiner(s): Talbot, Brian K.
• Application Number:
  US08/630,033
• Time in Patent Office: 756 Days
• Field of Search: 427/96, 427/125, 427/282, 427/97, 29/832, 29/840, 29/883, 29/884, 29/874, 29/877, 228/180.22, 257/737, 257/738, 257/758, 257/759, 437/183, 437/205, 437/226
• US Class Current: 438/460
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 2224/13 of an individual bump connector
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/1319 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/274 by blanket deposition of the material of the layer connector
• CPC Class Codes: H01L 2224/73104 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73203 Bump and layer connectors
• CPC Class Codes: H01L 2224/8319 Arrangement of the layer connectors prior to mounting
• CPC Class Codes: H01L 2224/838 Bonding techniques
• CPC Class Codes: H01L 2224/90 Methods for connecting semiconductor or solid state bodies using means for bonding not being attached to, or not being formed on, the body surface to be connected, e.g. pressure contacts using springs or clips
• CPC Class Codes: H01L 24/10 Bump connectors bumps on insulating substrates, e.g. chip carriers, H01L23/49816; Manufacturing methods related thereto
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 24/27 Manufacturing methods
• CPC Class Codes: H01L 24/28 Structure, shape, material or disposition of the layer connectors prior to the connecting process
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 24/90 Methods for connecting semiconductor or solid state bodies using means for bonding not being attached to, or not being formed on, the body surface to be connected, e.g. pressure contacts using springs or clips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01087 : Francium [Fr]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/0781 : being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: Y10T 29/49204 : Contact or terminal manufacturing
• CPC Class Codes: Y10T 29/49222 : forming array of contacts or terminals

Abstract

A simple process for card assembly by Direct Chip Attachment (DCA) uses electrically conductive adhesives. Two methods create the same intermediate wafer product with a layer of insulative thermoplastic and conductive thermoplastic bumps. After sawing or dicing the wafer to form the chips, the chips are adhered to chip carriers with conductive pads which match the conductive thermoplastic bumps, using heat and pressure. Chips may be easily removed and replaced using heat.

Claims

1. A method of making integrated circuit chips comprising the steps of:

applying an insulative thermoplastic adhesive paste, over a semiconductor wafer substrate having a plurality of chip sites and integrated circuits communicating with a matrix of conductive metal pads on a major surface of the substrate;

drying the insulative thermoplastic;

forming holes in the insulative thermoplastic layer at the metal pads;

filling the holes with a conductive thermoplastic adhesive paste; and

drying the conductive thermoplastic to form a dry composite adhesive layer dividing the wafer into a plurality of chips after forming the composite layer.

2. The method recited in claim 1 wherein the step of applying an insulative adhesive is performed by spin coating the substrate surface with a adhesive paste and drying, and the step of forming holes in the insulative thermoplastic layer is performed by laser ablation.

3. The method recited in claim 1 wherein the insulative adhesive layer is dried and pre-formed with punched holes and then bonded directly to the chip surface with heat and pressure.

4. The method recited in claim 1 wherein the insulative adhesive layer is applied by emulsion screening to place the adhesive everywhere except chip bond pads, thereby simultaneously performing the steps of applying the adhesive and forming the holes.

5. The method recited in claim 1 wherein the substrate is an integrated circuit wafer having a plurality of chip sites, and further including the step of dividing the wafer into a plurality of chips after drying both thermoplastic adhesives.

6. The method recited in claim 1 wherein the drying steps include heating to a temperature of at least about 80°

C.

7. The method recited in claim 1 further including the step of heating the substrate to a temperature between about 150°

C. and about 300°

C. to bond the adhesives to the substrate.

8. The method recited in claim 1 wherein the holes are filled with conductive adhesive paste by mask screening.

9. A method of making integrated circuit chips comprising the steps of:

providing a semiconductor wafer substrate having a plurality of chip sites and integrated circuits communicating with a matrix of conductive metal contact pads on a major surface of the substrate;

depositing conductive thermoplastic adhesive paste bumps on the metal pads;

drying the conductive adhesive;

applying an insulative thermoplastic adhesive over the substrate surface between the conductive adhesive deposits;

curing the insulative adhesive to form a dry composite adhesive layer; and

dividing the wafer into a plurality of chips after forming the composite layer.

10. The method recited in claim 9 wherein the step of applying the insulative adhesive is performed by emulsion screening of adhesive paste.

11. The method recited in claim 9 wherein the step of applying the insulative adhesive is performed by forming the insulative adhesive into a film, dried, punched and bonded directly to the chip surface by heat and pressure.

12. The method recited in claim 9 wherein the step of applying the insulative adhesive is performed by flowing adhesive paste over spaces between the conductive thermoplastic bumps.

13. The method recited in claim 9 further comprising the step of plating the conductive adhesive bumps with a layer of conductive metal prior to applying an insulative adhesive paste.

14. A method of preparing substrates for attachment comprising the steps of:

providing a first semiconductor wafer substrate having a plurality of chip sites with a matrix of conductive metal pads on a major surface;

depositing an electrically conductive thermoplastic adhesive paste on the metal pads;

depositing an electrically insulating thermoplastic adhesive on the substrate surface around the metal pads;

drying the paste; and

dividing the semiconductor wafer into a plurality of individual chips after said depositing steps and said drying step.

15. The method recited in claim 14 wherein the electrically insulating adhesive is deposited on the substrate as a paste followed by the additional step of drying the insulating adhesive prior to the step of depositing the conductive adhesive on the pads.