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Semiconductor power module with high speed operation and miniaturization

  • US 5,747,875 A
  • Filed: 07/02/1996
  • Issued: 05/05/1998
  • Est. Priority Date: 09/08/1993
  • Status: Expired due to Term
First Claim
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1. A semiconductor power module comprising a box type housing storing a power switching semiconductor element repeating cutoff and connection of a current to be supplied to a load in response to a control signal,a bottom portion of said housing comprising a power substrate being integrally provided with:

  • a power substrate body formed of a single layer and containing a heat-resistant insulating material;

    a thermally and electrically conductive power interconnection pattern being bonded to an upper major surface of said power substrate body to be connected with said power switching semiconductor element;

    a thermally conductive plate being formed of a single layer and directly bonded to a lower major surface of said power substrate body, said plate being formed of a material substantially identical to that of said power interconnection pattern; and

    said plate being exposed on a lower surface of said housing;

    wherein said heat-resistant insulating material is ceramic,wherein said power interconnection pattern substantially consists of a copper material and is arranged on said upper major surface of said power substrate body in metallization bonding, andwherein said plate substantially consists of a copper material and is arranged on said lower major surface of said power substrate body in metallization bonding;

    wherein said bottom portion of said housing comprises a control substrate having;

    a control substrate body substantially consisting of an insulator,an electrically conductive control interconnection pattern being arranged on an upper major surface of said control substrate body and connected with a control circuit element for producing said control signal and supplying the same to said power switching semiconductor element, anda plate type pressing member forming a multilayer structure with said control substrate body, said plate type pressing member having rigidity,said control substrate being arranged around said power substrate and engaged with an edge portion of said power substrate.

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