Integrated electro-optical package with independent menu bar

• US 5,748,161 A
• Filed: 03/04/1996
• Issued: 05/05/1998
• Est. Priority Date: 03/04/1996
• Status: Expired due to Term

• Current Assignee: Freescale Semiconductor, Inc. (NXP Semiconductors NV)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Lebby, Michael S., Nelson, Ronald J.
• Primary Examiner(s): Mengistu, Amare
• Application Number:
  US08/610,533
• Time in Patent Office: 792 Days
• Field of Search: 345/84, 257/81, 257/88, 257/98, 257/99, 257/72, 257/432
• US Class Current: 345/84
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12044 OLED

Abstract

An integrated electro-optical package (50) including a first light emitting device (LED) display chip (28) and at least one additional LED display chip (30), each composed of an optically transparent substrate (10) with an array (15) of LEDs (12) formed thereon and cooperating to generate a complete image. The LEDs (12) of the first LED display chip (28) are constructed to emit light of a wavelength different than the light emitted by the additional LED display chip(s) (30), thereby creating a different color menu or object bar (156) within the view (150) generated. A mounting substrate (25), having connection pads (32), bump bonded to the pads on the optically transparent substrate (10). A driver substrate (55) having connections to the pads (32) on the mounting substrate (25). A plurality of driver and control circuits (57) connected to the LED display chips (28) and (30) through electrodes on the driver substrate (55). A lens (73) in alignment with the LED display chips (28) and (30) to magnify the complete images and produce an easily viewable virtual image.

Claims

1. An integrated electro-optical package comprising:

a first light emitting device display chip comprised of an optically transparent substrate with an array of light emitting devices formed on a major surface and cooperating to generate a complete image, the light emitting devices being positioned in rows and columns to define all pixels of the complete image and operably connected to a plurality of connection pads adjacent outer edges of the optically transparent substrate;

at least one additional light emitting device display chip comprised of an optically transparent substrate with an array of light emitting devices formed thereon, constructed to emit light of a different wavelength than the light emitting devices of the first light emitting device display chip, cooperating to generate a complete image, the light emitting devices being positioned in rows and columns to define all pixels of the complete image and operably connected to a plurality of connection pads adjacent outer edges of the optically transparent substrate;

a mounting substrate defining an optically transparent central portion, substantially coextensive with the complete image generated by the first light emitting device display chip and the complete image generated by the at least one additional light emitting device display chip, having a plurality of connection pads formed on a surface surrounding the optically transparent central portion and a plurality of connection pads formed on a surface about a periphery of the mounting substrate in electrical cooperation with the plurality of connection pads surrounding the optically transparent central portion, the plurality of connection pads of the first light emitting device display chip and the at least one additional light emitting device display chip being bump bonded to the plurality of connection pads surrounding the optically transparent central portion on the mounting substrate; and

a plurality of driver circuits connected to the first light emitting device display chip and the at least one additional light emitting device display chip through the connection pads on the mounting substrate, and the plurality of connection pads on the optically transparent substrate of the first light emitting device display chip and the at least one additional light emitting device display chip.

2. An integrated electro-optical package as claimed in claim 1 wherein the optically transparent substrate is formed of optically transparent glass.

3. An integrated electro-optical package as claimed in claim 1 wherein the light emitting devices of the first light emitting device display chip are constructed to emit light in a red/orange range and the light emitting devices of the at least one additional light emitting device display chip are constructed to emit light in a blue/green range.

4. An integrated electro-optical package as claimed in claim 1 wherein the array of light emitting devices of the first light emitting device display chip and of the at least one additional light emitting device display chip includes a plurality of organic electroluminescent elements.

5. An integrated electro-optical package as claimed in claim 4 wherein the plurality of organic electroluminescent elements of the first light emitting device display chip and the at least one additional light emitting device display chip each include a first conductive layer positioned on the major surface of the optically transparent substrate, at least one layer of organic material positioned on the first conductive layer, and a second conductive layer positioned on the at least one layer of organic material.

6. An integrated electro-optical package as claimed in claim 5 wherein the at least one layer of organic material on the first conductive layer includes one of a layer of polymer and a layer of low molecular weight organic compound.

7. An integrated electro-optical package as claimed in claim 1 further comprising a driver substrate defining a central area substantially coextensive with the complete image generated by the first light emitting device display chip and the complete image generated by the at least one additional light emitting device display chip, having a plurality of connection pads formed about a periphery of the driver substrate, the plurality of connection pads formed on a surface about a periphery of the mounting substrate being bump bonded to the plurality of connection pads on the driver substrate, and a lens system positioned substantially coextensive with the complete image generated by the first light emitting device display chip and the complete image generated by the at least one additional light emitting device display chip, to receive and magnify the complete images and produce an easily viewable virtual image.

8. An integrated electro-optical package as claimed in claim 7 wherein the lens system positioned substantially coextensive with the complete image generated by the first light emitting device display chip and the complete image generated by the at least one additional light emitting device display chip is molded into the optically transparent central portion of the mounting substrate.

9. An integrated electro-optical package as claimed in claim 7 wherein the lens system positioned substantially coextensive with the complete image generated by the first light emitting device display chip and the complete image generated by the at least one additional light emitting device display chip is mounted to the mounting substrate on a side of the mounting substrate opposite a mounting of the first light emitting device display chip and the at least one additional light emitting device display chip.

10. An integrated electro-optical package comprising:

a first light emitting device display chip comprised of an optically transparent substrate having a major surface with an array of light emitting devices formed on the major surface at a central portion thereof, constructed to emit at a wavelength in a specific range and cooperating to generate a complete image, each of the light emitting devices having a first electrode and a second electrode for activating the light emitting devices, the light emitting device display chip further having a plurality of external connection pads adjacent outer edges thereof and outside of the central portion of the major surface with each of the first electrodes of the light emitting devices being connected to a first plurality of the external connection pads and each of the second electrodes of the light emitting devices being connected to a second plurality of the external connection pads;

at least one additional light emitting device display chip comprised of an optically transparent substrate having a major surface with an array of light emitting devices formed on the major surface at a central portion thereof, constructed to emit light of a shorter wavelength than the light emitting devices of the first light emitting device display chip, in a specific range, and cooperating to generate a complete image, each of the light emitting devices having first and second electrodes for activating the light emitting devices, the light emitting device display chip further having external connection pads adjacent outer edges thereof and outside of the central portion of the major surface with the first electrodes of the light emitting devices being connected to a first plurality of the external connection pads and the second electrodes of the light emitting devices being connected to a second plurality of the external connection pads;

a mounting substrate defining an optically transparent central portion, substantially coextensive with the complete image generated by the first light emitting device display chip and the complete image generated by the at least one additional light emitting device display chip, having a plurality of connection pads formed on a surface surrounding a central portion and a plurality of connection pads formed on a surface about a periphery of the mounting substrate in electrical cooperation with the plurality of connection pads formed on the surface surrounding the central portion, the plurality of connection pads of the first light emitting device display chip and the at least one additional light emitting device display chip being bump bonded to the plurality of connection pads formed on the surface surrounding the central portion on the mounting substrate;

a driver substrate having a first major surface and a second opposed major surface and defining a central area in the first major surface substantially coextensive with the first light emitting device display chip and the at least one additional light emitting device display chip, the driver substrate further having a plurality of electrical conductors formed therein, and a plurality of connection pads adjacent an edge of the central area on the first major surface and a plurality of connection pads on the second opposed major surface of the driver substrate, each of the plurality of electrical conductors extending from a connection pad adjacent an edge of the central area on the first major surface to a connection pad on the second opposed major surface of the driver substrate, the mounting substrate being mounted on the first major surface of the driver substrate with the plurality of connection pads formed on a surface about the periphery of the mounting substrate being in electrical contact with the plurality of connection pads on the first major surface of the driver substrate; and

a plurality of driver and controller circuits mounted on the second opposed major surface of the driver substrate and having data input terminals and further having control signal output terminals connected to the first light emitting device display chip and the at least one additional light emitting device display chip through the plurality of connection pads on the first and second opposed major surfaces of the driver substrate, the plurality of electrical conductors, and the plurality of connection pads on the first major surface of the mounting substrate and the plurality of external connection pads on the optically transparent substrate for activating the light emitting devices of the first light emitting device display chip and the at least one additional light emitting device display chip to generate a plurality of complete images in accordance with data signals applied to the data input terminals.

11. An integrated electro-optical package as claimed in claim 10 wherein the light emitting devices of the first light emitting device display chip are constructed to emit at wavelengths in a range of 550 to 750 nm and the light emitting devices of the at least one additional light emitting device display chip are constructed to emit at wavelengths in a range of 400 to 750 nm.

12. An integrated electro-optical package as claimed in claim 10 wherein the array of light emitting devices of the first light emitting device display chip and the array of light emitting devices of the at least one additional light emitting device display chip includes a plurality of organic electroluminescent elements.

13. An integrated electro-optical package as claimed in claim 12 wherein the plurality of organic electroluminescent elements of the first light emitting device display chip and the at least one additional light emitting device display chip each include a first conductive layer positioned on the major surface of the optically transparent substrate, at least one layer of organic material positioned on the first conductive layer, and a second conductive layer positioned on the at least one layer of organic material.

14. An integrated electro-optical package as claimed in claim 13 wherein the first conductive layer on the major surface of the optically transparent substrate includes a layer of indium-tin oxide.

15. An integrated electro-optical package as claimed in claim 13 wherein the at least one layer of organic material on the first conductive layer includes one of a layer of polymer and a layer of low molecular weight organic compound.

16. An integrated electro-optical package as claimed in claim 10 including in addition a lens system positioned substantially coextensive the central portion of the mounting substrate for magnifying the complete images generated by the array of light emitting devices of the first light emitting device display chip and the at least one additional light emitting device display chip and producing a virtual image perceivable by a human eye.

17. An integrated electro-optical package as claimed in claim 16 wherein the lens system positioned substantially coextensive with the complete image generated by the first light emitting device display chip and the complete image generated by the at least one additional light emitting device display chip is molded into the central portion of the mounting substrate.

18. An integrated electro-optical package as claimed in claim 16 wherein the lens system positioned substantially coextensive with the central portion of the mounting substrate, is mounted to the mounting substrate on a side of the mounting substrate opposite a mounting of the first light emitting device display chip and the at least one additional light emitting device display chip.

19. An integrated electro-optical package as claimed in claim 10 further comprised of a plurality of electrical conductors formed on the major surface of the optically transparent substrate of the first light emitting device display chip and the at least one additional light emitting device display chip, positioned to fan out from the array of light emitting devices to the plurality of external connection pads on the major surface of the optically transparent substrate, the plurality of external connection pads further being positioned in rows and columns on the major surface thereof.

20. A portable electronic device with visual display comprising:

a portable electronic device having a data output terminal; and

a display including a first two dimensional array of light emitting devices designed to emit light at a first wavelength, arranged in rows and columns, and a data input connected to the data output terminal of the portable electronic device to utilize received data from the portable electronic device to define complete images on the first two dimensional array, and a second two dimensional array of light emitting devices designed to emit light at a second wavelength different than the first wavelength, arranged in rows and columns and coupled to a plurality of controls of the portable electronic device to provide visual images of control functions.

21. A portable electronic device with visual display as claimed in claim 20 wherein the first two dimensional array of light emitting devices and the second two dimensional array of light emitting devices include organic electroluminescent elements on a glass substrate.

22. A portable electronic device with visual display as claimed in claim 20 wherein the light emitting devices of the first two dimensional array of light emitting devices are constructed to emit light in a red/orange range and the light emitting devices of the second two dimensional array of light emitting devices are constructed to emit light in a blue/green range.

23. A portable electronic device with visual display as claimed in claim 20 wherein the portable electronic device includes portable communications equipment.

24. A portable electronic device with visual display as claimed in claim 23 wherein the portable communications equipment is one of a cellular telephone, a two-way radio, a data bank and a pager.

25. A portable electronic device with visual display as claimed in claim 20 further comprising:

a first electrode and a second electrode for activating each of the light emitting devices, the first two dimensional array of light emitting devices and the second two dimensional array of light emitting devices further having a plurality of external connection pads adjacent outer edges thereof and outside of a central portion of a major surface with the first electrode of each of the light emitting devices of the first two dimensional array of light emitting devices and the second two dimensional array of light emitting devices being connected to a first plurality of the plurality of external connection pads defining rows of pixels and the second electrode of each of the light emitting devices of the first two dimensional array of light emitting devices and the second two dimensional array of light emitting devices being connected to a second plurality of the plurality of external connection pads defining columns of pixels;

a mounting substrate, defining an optically transparent central portion, substantially coextensive with the first two dimensional array of light emitting devices and the second two dimensional array of light emitting devices, having a first major surface and a second opposed major surface with a plurality of first and second electrical connection pads on the first major surface, a plurality of electrical connections formed in the mounting substrate between the plurality of first and second electrical connection pads, the first and second two dimensional arrays of light emitting devices being mounted on the first major surface of the mounting substrate with the first electrical connection pads in electrical contact with the first and second pluralities of external connection pads of the first and second two dimensional arrays of light emitting devices;

a driver substrate having a first major surface and a second opposed major surface with a first plurality of electrical connection pads formed on the first major surface, a second plurality of electrical connection pads formed on the second opposed major surface and electrical connections formed in the driver substrate between the first and second pluralities of electrical connection pads, the mounting substrate being mounted on the first major surface of the driver substrate with the first plurality of electrical connection pads of the driver substrate in electrical contact with the second plurality of electrical connection pads on the mounting substrate;

a plurality of driver and controller circuits having a plurality of data input terminals connected to the data output terminal of the electronic device and further having a plurality of control signal output terminals adapted to be connected to the first electrode and second electrode of each of the light emitting devices of the first and second two dimensional arrays of light emitting devices to generate a complete image in accordance with data signals applied to the plurality of data input terminals, the plurality of driver and controller circuits being mounted on the second opposed major surface of the driver substrate with a control signal output terminal electrically contacting the plurality of second electrical connection pads on the second opposed major surface of the driver substrate; and

a lens system positioned in the electronic device and axially aligned with the central portion of the mounting substrate for defining an aperture and providing a virtual image from the complete image generated by each of the array of light emitting devices of the first and second two dimensional arrays of light emitting devices, the virtual image being easily viewable by an operator of the electronic device.

26. A portable electronic device with visual display as claimed in claim 25 wherein the lens system is designed to magnify the complete image generated by each of the first and second two dimensional array of light emitting devices and produce a virtual image perceivable by a human eye.

27. A method of fabricating an electro-optical package comprising the steps of:

forming a first light emitting device display chip comprised of a plurality of light emitting devices on a major surface of an optically transparent substrate, each of the plurality of light emitting devices having a first electrode and a second electrode for activating each of the light emitting devices, the plurality of light emitting devices defining a plurality of pixels positioned in rows and columns and cooperating to generate a complete image, when activated, at a central portion of the major surface, the optically transparent substrate further being formed with external connection pads adjacent outer edges thereof and outside of the central portion of the major surface with the first electrode of each of the plurality of light emitting devices being connected to a first plurality of the external connection pads defining rows of pixels and the second electrode of each of the plurality of light emitting devices being connected to a second plurality of the external connection pads defining columns of pixels;

forming at least one additional light emitting device display chip comprised of a plurality of light emitting devices on a major surface of an optically transparent substrate constructed to emit light of a wavelength different than the light emitting devices of the first light emitting device display chip, each of the light emitting devices having a first electrode and a second electrode for activating each of the light emitting devices, the light emitting devices defining a plurality of pixels positioned in rows and columns and cooperating to generate a complete image, when activated, at a central portion of the major surface, the optically transparent substrate further being formed with external connection pads adjacent outer edges thereof and outside of the central portion of the major surface with the first electrode of each of the light emitting devices being connected to a first plurality of the external connection pads defining rows of pixels and the second electrode of each of the light emitting devices being connected to a second plurality of the external connection pads defining columns of pixels;

forming a mounting substrate with a first major surface and a second opposed major surface and forming a plurality of first electrical connection pads and a plurality of second electrical connection pads on the first major surface, and a plurality of electrical connections in the mounting substrate between the plurality of first and second electrical connection pads;

forming a driver substrate with a first major surface and a second opposed major surface and forming a plurality of first electrical connection pads on the first major surface, a plurality of second electrical connection pads on the second opposed major surface and electrical connections in the driver substrate between the first and second pluralities of electrical connection pads;

forming a plurality of driver and controller circuits having a plurality of data input terminals and further having a plurality of control signal output terminals adapted to be connected to the first electrode and the second electrode of each of the light emitting devices of the first light emitting device display chip and the at least one additional light emitting device display chip for activating each of the light emitting devices to generate images in accordance with a plurality of plurality of data signals applied to the data input terminals;

mounting the optically transparent substrate on the first major surface of the mounting substrate with the first plurality of electrical connection pads of the mounting substrate in electrical contact with the first plurality of the plurality of external connection pads and the second plurality of the plurality of external connection pads of the optically transparent substrate;

mounting the driver substrate on the mounting substrate with the plurality of first electrical connection pads of the driver substrate in electrical contact with the plurality of second electrical connection pads of the mounting substrate; and

mounting the plurality of driver and controller circuits on the second opposed major surface of the driver substrate with the plurality of control signal output terminals electrically contacting the plurality of second electrical connection pads of the driver substrate.

28. A method of fabricating an electro-optical package as claimed in claim 27 wherein the steps of forming the first light emitting device display chip and the at least one additional light emitting device display chip includes forming the first light emitting device display chip so that it emits light in a red/orange range and forming the at least one additional light emitting device display chip so that it emits light in a blue/green range.

29. A method of fabricating an electro-optical package as claimed in claim 27 wherein the step of forming a plurality of light emitting devices on the major surface of an optically transparent substrate includes forming a plurality of light emitting devices on a glass substrate.

30. A method of fabricating an electro-optical package as claimed in claim 29 wherein the step of forming a plurality of light emitting devices on the major surface of an optically transparent substrate includes forming organic electroluminescent elements on the glass substrate.

31. A method of fabricating an electro-optical package as claimed in claim 30 wherein the step of forming a plurality of organic electroluminescent elements on the glass substrate includes the steps of depositing a first conductive layer on a major surface of the glass substrate, depositing at least one layer of organic material on the first conductive layer, and depositing a second conductive layer on the at least one layer of organic material.

32. A method of fabricating an electro-optical package as claimed in claim 31 wherein the step of depositing a first conductive layer on a major surface of the glass substrate includes depositing a layer of indium-tin oxide.

33. A method of fabricating an electro-optical package as claimed in claim 31 wherein the step of depositing at least one layer of organic material on the first conductive layer includes depositing one of a layer of polymer and a layer of low molecular weight organic compound.