Solid-state image sensor assembly with image sensor element chip mounted in package

• US 5,748,448 A
• Filed: 02/21/1996
• Issued: 05/05/1998
• Est. Priority Date: 02/21/1995
• Status: Expired due to Fees

• Current Assignee: NEC Electronics Corporation (Renesas Electronics Corporation)
• Original Assignee: NEC Corporation
• Inventors: Hokari, Yasuaki
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): Vigushin, John B.
• Application Number:
  US08/604,416
• Time in Patent Office: 804 Days
• Field of Search: 361/813, 361/820, 361/749, 361/783, 174/52.4, 174/52.5, 174/52.6, 174/254, 257/680, 257/681, 257/432, 257/433, 257/434, 348/374, 348/375, 396/542
• US Class Current: 361/749
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 27/14643 Photodiode arrays; MOS imagers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/16195 Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/042 Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
• CPC Class Codes: H05K 2201/10151 Sensor
• CPC Class Codes: H05K 2201/10689 Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]

Abstract

The solid-state image sensor disclosed includes a package accommodating an image sensor element chip, and a plurality of wiring patterns carried by a flexible printed wiring circuit board. Each of the wiring patterns is a continuous seamless pattern and has electrode portions for connection with the element chip and for connection with circuit components, and a wiring portion disposed between those electrode portions. The flexible printed wiring circuit board is capable of being bent, extends through and out from the package, and is unitary with the package. The arrangement enables the compact accommodation of the element chip together with other components and the reduction in the number of steps for the fabrication.

Claims

1. A solid-state image sensor which comprises:

an image sensor element chip;

a package which accommodates said image sensor element chip;

a plurality of wiring patterns each of which is in a continuous seamless pattern having an inner side electrode portion disposed inside said package and used for electrical connection with said image sensor element chip, an outer side electrode portion disposed outside said package and used for electrical connection with circuit components, and a wiring portion disposed between said inner side electrode portion and said outer side electrode portion;

a flexible printed wiring circuit board made of a light-shielding resin material, which carries said wiring patterns and which is capable of being bent;

said flexible printed wiring circuit board carrying said image sensor element chip and extending through and out from said package, and said flexible printed wiring circuit board and said package being unitary formed.

2. A solid-state image sensor according to claim 1, in which said image sensor element chip and said circuit components are mounted both on said flexible printed wiring circuit board, and only said image sensor element chip and that portion of said flexible printed wiring circuit board at which said image sensor element chip is mounted are selectively packaged within said package.

3. A solid-state image sensor according to claim 1, in which said package in a plan view is shaped in one of a rectangular shape, a four corner chamfered rectangular shape, and a circular shape.

4. A solid-state image sensor according claim 1, in which a surface of said flexible printed wiring circuit board opposite to a surface on which said image sensor element chip is mounted constitutes a mounting surface for mounting various parts including ICs and circuit components for driving said image sensor element chip and processing signals therefrom.

5. A solid-state image sensor having at least one solid-state image sensor element chip accommodated in a package, said package comprising:

a flexible printed wiring circuit board which extends through and out from said package, is capable of being bent, has an intermediate portion on which said image sensor element chip is mounted, and has an upper surface on which a plurality of wiring patterns each extending through and out from said package are disposed;

a package board which is disposed on an underside of said flexible printed wiring circuit board and which supports an entire surface of said flexible printed wiring circuit board; and

a package frame which is disposed on said upper surface of said flexible printed wiring circuit board and which surrounds said image sensor element chip,

said package board and said package frame being made of a light-shielding resin material and being unitary formed with said flexible printed wiring circuit board interposed therebetween.

6. A solid-state image sensor according to claim 5, in which said package frame is provided with holes formed in said package frame and said package board penetrating said package for positioning said image sensor element chip in said package.

7. A solid-state image sensor according to claim 5, which comprises a glass cap for the package and in which said package frame has notches formed in its upper portion such that said glass cap is inserted and positioned at said notches.

8. A solid-state image sensor having at least one solid-state image sensor element chip accommodated in a package, said package comprising:

a flexible printed wiring circuit board which extends through and out from said package, is capable of being bent, has an intermediate portion on which said image sensor element chip is mounted, and has an tipper surface on which a plurality of wiring, patterns each extending through and out from said package are disposed;

a package board which is disposed on an underside of said flexible printed wiring circuit board and which supports an entire surface of said flexible printed wiring, circuit board;

a package frame which is disposed on said upper surface of said flexible printed wiring circuit board and which surrounds said image sensor element chip;

wherein a portion of said flexible printed wiring circuit board interposed between said package board and said package frame is provided with adhesive force reinforcement through holes formed in said flexible printed wiring circuit board, permitting direct contact between said package board and said package frame, and

said package board and said package frame being unitary formed with said flexible printed wiring circuit board interposed therebetween.