Hermetically sealed electrical feedthrough for use with implantable electronic devices

• US 5,750,926 A
• Filed: 08/16/1995
• Issued: 05/12/1998
• Est. Priority Date: 08/16/1995
• Status: Expired due to Term

• Current Assignee: Alfred E. Mann Foundation For Scientific Research
• Original Assignee: Alfred E. Mann Foundation For Scientific Research
• Inventors: Schulman, Joseph H., Canfield, Lyle Dean
• Primary Examiner(s): Kincaid, Kristine L.
• Assistant Examiner(s): Ngo, Hung V.
• Application Number:
  US08/515,559
• Time in Patent Office: 1,000 Days
• Field of Search: 174/52.2, 174/52.3, 174/52.4, 257/698, 257/692, 257/693, 257/697, 257/702, 257/704, 257/710
• US Class Current: 174/564
• CPC Class Codes: A61N 1/3754 Feedthroughs
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 23/057 the leads being parallel to the base
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 3/28 Applying non-metallic protective coatings H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673
• CPC Class Codes: H05K 3/4007 Surface contacts, e.g. bumps H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3457
• CPC Class Codes: H05K 5/0095 hermetically-sealed

Abstract

A thin hermetically sealed electrical feedthrough suitable for implantation within living tissue permits electrical connection between electronic circuits sealed within an hermetically sealed case and electrical terminals or contacts on the outside of the case. The hermetically sealed case is made by hermetically bonding a cover to an insulating layer. The hermetically sealed electrical feedthrough is made by depositing a conductive trace on the insulating layer and then depositing another insulating layer thereover, so that the conductive trace is hermetically encapsulated within the insulating layers. At least two spaced-apart openings are formed in the insulating layers before bonding the cover thereto, exposing the conductive trace. Additional conductive material is then inserted within each of the openings or holes so as to form conductive vias that make electrical contact with the conductive trace. The cover is then hermetically sealed to the insulating layer so that at least one conductive via resides inside of an hermetically sealed cavity formed under the cover, and the other conductive via resides outside of the hermetically sealed cavity. An electrical feedthrough is thus formed through the respective conductive vias and conductive trace so that electrical contact may be made between the outside and inside of the hermetically sealed cavity.

Claims

1. An electrical feedthrough suitable for implantation within living tissue comprising:

a metal trace encapsulated within an insulating material so as to form a hermetic seal between the metal trace and the insulating material, the insulating material and metal trace being made from materials that are compatible with living tissue, and the hermetic seal being hermetic in a living tissue environment; and

first and second conductive vias that pass through the insulating material from an outer surface thereof to make electrical contact with the metal trace at respective spaced-apart locations along the metal trace, said first and second conductive vias including conductive material that is also compatible with living tissue.

2. The electrical feedthrough of claim 1 further including a cover hermetically bonded to a portion of the insulating material so as to define a hermetically sealed cavity under the cover, one of the first or second conductive vias being positioned inside of said cavity, and the other of the first or second conductive vias being positioned outside of said cavity, whereby electrical contact may be made to the inside of the cavity from a location outside of the cavity.

3. The electrical feedthrough of claim 2 wherein said insulating material comprises an insulating substrate onto which the metal trace is deposited and over which an insulating layer is deposited.

4. The electrical feedthrough of claim 2 further including a substrate, and wherein said insulating material comprises a first insulating layer and a second insulating layer, the first insulating layer being deposited over a surface of the substrate, the metal trace being deposited on the first insulating layer, and the second insulating layer being deposited over the metal trace and first insulating layer.

5. The electrical feedthrough of claim 4 wherein said substrate comprises a metal having a thickness no greater than about 0.010 inches.

6. The electrical feedthrough of claim 1 wherein the insulating material is selected from the group consisting of:

aluminum oxides, zirconium oxides, magnesium oxides, and glass.

7. The electrical feedthrough of claim 1 wherein the insulating material has a thickness no greater than about 0.001 inches (1 mil).

8. The electrical feedthrough of claim 7 wherein the insulating material comprises aluminum oxide Al₂ O₃ and has a thickness of between about 0.25 mils to 1.0 mil as measured from the metal trace to an outer surface of the insulating material.

9. The electrical feedthrough of claim 1 wherein:

the first conductive via comprises an opening in the insulating material that exposes a point on the metal trace, and a first conductor that passes through the opening to make electrical contact with the metal trace; and

the second conductive via comprises another opening in the insulating material that exposes another point on the metal trace, and a second conductor that passes through the other opening to make electrical contact with the metal trace.

10. The electrical feedthrough of claim 9 wherein the metal trace, the first conductor, and the second conductor each includes a material selected from the group comprising:

gold, platinum, tungsten, titanium, titanium-niobium alloys, stainless steel, and cobalt-chromium alloys.

11. A hermetically sealed electrical feedthrough suitable for implantation within living tissue comprising:

a plurality of insulating layers, each of the plurality of insulating layers being successively stacked with and hermetically bonded to an adjacent one of the plurality of insulating layers;

a plurality of vias passing transversely through at least one of the plurality of insulating layers;

a conductive trace placed on one of the plurality of insulating layers, the conductive trace being in electrical contact with at least two of the plurality of vias, and being hermetically bonded to the at least one of the plurality of insulating layers and to the adjacent one of the plurality of insulating layers;

each of said plurality of vias comprising a conductor that makes electrical contact with the conductive trace; and

a cover hermetically bonded to one of the plurality of insulating layers to form a hermetically sealed cavity, wherein one of the plurality of vias resides inside the hermetically sealed cavity, and wherein another of the plurality of vias resides outside the hermetically sealed cavity;

whereby electrical contact may be made through the other of the plurality of vias outside of the hermetically sealed cavity with the one of the plurality of vias inside of the hermetically sealed cavity through the conductive trace.

12. The hermetically sealed electrical feedthrough as set forth in claim 11 wherein the plurality of insulating layers comprises:

a first insulating layer having the conductive trace deposited thereon; and

a second insulating layer deposited over the conductive trace and the first insulating layer, the one of the plurality of vias including a first opening and the other of the plurality of vias including a second opening, the first opening and the second opening expose, respectively, a first point and a second point on the conductive trace.

13. The hermetically sealed electrical feedthrough as set forth in claim 12 wherein the cover comprises a metal, and further comprises a flange around a periphery of the cover, and a formed raised portion at a center of the cover.

14. The hermetically sealed electrical feedthrough as set forth in claim 13 further comprising at least one electrical component mounted within the hermetically sealed cavity and electrically connected to the one of the plurality of vias inside the hermetically sealed cavity.

15. The hermetically sealed electrical feedthrough as set forth in claim 11 wherein each of the plurality of insulating layers comprise ceramic materials selected from the group consisting of aluminum oxides, zirconium oxides, magnesium oxides, and glass.

16. The hermetically sealed electrical feedthrough as set forth in claim 11 wherein the plurality of insulating layers comprises:

a first insulating layer having the conductive trace deposited thereon, said other of said plurality of vias passing transversely through the first insulating layer; and

a second insulating layer deposited over the conductive trace and the first insulating layer, said one of said plurality of vias passing transversely through the second insulating layer.

17. The hermetically sealed electrical feedthrough as set forth in claim 16 wherein the cover comprises a metal, and further comprises a flange around a periphery of the cover and a formed raised portion at a center of the cover.

18. The hermetically sealed electrical feedthrough as set forth in claim 11 wherein the cover further comprises:

a frame hermetically bonded to the one of the plurality of insulating layers; and

a lid hermetically bonded to the frame,

the lid and frame thereby defining the hermetically sealed cavity, the thermal coefficients of expansion of the frame and each of the plurality of insulating layers being approximately equal.

19. The hermetically sealed electrical feedthrough as set forth in claim 18 wherein the frame further comprises a Titanium-Niobium alloy and wherein each of said plurality of insulating layers is formed from a ceramic material selected from the group consisting of aluminum oxides, zirconium oxides, magnesium oxides and glass.

20. The hermetically sealed electrical feedthrough as set forth in claim 19 wherein the frame is hermetically bonded to the one of the plurality of insulating layers using a brazeless ceramic to metal diffusion bonding technique.

21. The hermetically sealed electrical feedthrough as set forth in claim 18 wherein the lid is formed from a body-safe metal selected from the group consisting of titanium, stainless steel and cobalt-chromium alloys.

22. The hermetically sealed electrical feedthrough as set forth in claim 18 wherein any bonded portions of the lid, frame and insulating layers are further encapsulated or shrouded within an epoxy sealant.

23. The hermetically sealed electrical feedthrough as set forth in claim 11 further comprising at least one conductive trace deposited on each of said plurality of insulating layers, each conductive trace being in communication with at least two of said plurality of vias, thereby providing a plurality of electrical paths that provide a network of hermetic electrical feedthroughs between vias on the inside of the hermetically sealed cavity and vias on the outside of the hermetically sealed cavity.

24. A hermetically sealed electrical feedthrough suitable for implantation within living tissue comprising:

a substrate;

a first insulating layer deposited on the substrate;

a conductive trace deposited on the first insulating layer, the conductive trace having a first end and a second end;

a second insulating layer hermetically bonded to the conductive trace and the first insulating layer to form a hermetic seal, the hermetic seal being hermetic in a living tissue environment, the second insulating layer having first and second openings therethrough that expose the conductive trace at the first and second ends, respectively;

a first conductor within the first opening and in electrical contact with the conductive trace

a second conductor within the second opening and in electrical contact with the conductive trace, the first conductor and the second conductor thus forming a first conductive via and a second conductive via, respectively; and

a cover comprising a flange around a periphery of the cover and a formed raised portion at a center of the cover, the flange being hermetically bonded to the second insulating layer such that the first conductive via resides inside of a hermetically sealed cavity, and the second conductive via resides outside of the hermetically sealed cavity.

25. The hermetically sealed electrical feedthrough as set forth in claim 24 wherein the first insulating layer and the second insulating layer are formed from ceramic material selected from the group consisting of aluminum oxides, zirconium oxides, magnesium oxides, and glass.

26. The hermetically sealed electrical feedthrough as set forth in claim 25 further comprising at least one electrical component mounted within the hermetically sealed cavity and electrically connected to the first conductive via.

27. A hermetically sealed electrical feedthrough suitable for implantation within living tissue comprising:

a first insulating layer having a conductive trace deposited thereon, the first insulating layer having a first via therethrough that electrically communicates with the conductive trace;

a second insulating layer hermetically bonded to the conductive trace and the first insulating layer to form a hermetic seal, the hermetic seal being hermetic in a living tissue environment, the second insulating layer having a second via therethrough that electrically communicates with the conductive trace; and

a cover comprising a flange at a periphery of the cover and a formed raised portion at a center of the cover, the flange being hermetically bonded to one of the first and second insulating layers such that one of the first and second vias resides inside of a hermetically sealed cavity formed under the formed raised portion of the cover, and the other of the first and second vias resides outside of the hermetically sealed cavity.

28. The hermetically sealed electrical feedthrough as set forth in claim 27 wherein the first insulating layer and the second insulating layer each comprise a material selected from the group consisting of aluminum oxide, zirconium oxide, and magnesium oxide.

29. The hermetically sealed electrical feedthrough as set forth in claim 28 further comprising at least one electrical component mounted within the hermetically sealed cavity, said at least one electrical component being electrically connected to the one of the first and second vias.