Semiconductor device having parallel overlapping main current terminals
First Claim
1. A semiconductor device comprising:
- a circuit substrate including wiring patterns along a major substrate surface and supporting a switching element having a pair of main electrodes coupled to the wiring patterns;
a case holding said circuit substrate;
a pair of electrically conductive main current terminals having a pair of first end portions inside the case adjacent to and electrically coupled with respective first and second ones of said pair of main electrodes and further having a pair of closely spaced parallel principal parts extending from respective ones of the first end portions, said closely spaced principal parts including a pair of respective closely spaced parallel second end portions projecting outside of said case, at least the pair of said closely spaced parallel principal parts of said pair of electrically conductive main current terminals having identical overlapping segments with plane contours;
an electrically insulating material filling in spaces at least between and around said closely spaced parallel principal parts inside said case;
an electrically insulating member having at least a supporting and separating flat plate segment located between said pair of closely spaced parallel second end portions maintaining electrical insulation therebetween, said flat plate segment extending from between said pair of closely spaced parallel second end portions all around the periphery thereof to improve the withstand voltage of the closely spaced parallel second end portions.
1 Assignment
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Accused Products
Abstract
Main current terminals (31, 32) electrically coupled to main electrodes of IGBT elements (27) which are loaded on a power substrate (30) project from a side wall of a case (21) to the exterior. The main current terminals (31, 32), which are in the form of flat plates having the same plane contours in principal parts thereof, are arranged to be parallel to each other and overlap with each other. Thus, inductances of the main current terminals (31, 32) are suppressed. An insulating member (33) is interposed between the portions of the main current terminals (31, 32) outwardly projecting from the case (21), while outwardly extending from the plane contours of the main current terminals (31, 32). Therefore, a withstand voltage across these portions of the main current terminals (31, 32) is maintained at a high value. The interior of the case (21) is filled up with an electric insulating filler (43), whereby a withstand voltage across the remaining portions of the main current terminals (31, 32) which are stored in the case (21) is also maintained at a high value. Thus, a high withstand voltage across the main current terminals and reduction of the inductances are compatibly implemented.
92 Citations
15 Claims
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1. A semiconductor device comprising:
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a circuit substrate including wiring patterns along a major substrate surface and supporting a switching element having a pair of main electrodes coupled to the wiring patterns; a case holding said circuit substrate; a pair of electrically conductive main current terminals having a pair of first end portions inside the case adjacent to and electrically coupled with respective first and second ones of said pair of main electrodes and further having a pair of closely spaced parallel principal parts extending from respective ones of the first end portions, said closely spaced principal parts including a pair of respective closely spaced parallel second end portions projecting outside of said case, at least the pair of said closely spaced parallel principal parts of said pair of electrically conductive main current terminals having identical overlapping segments with plane contours; an electrically insulating material filling in spaces at least between and around said closely spaced parallel principal parts inside said case; an electrically insulating member having at least a supporting and separating flat plate segment located between said pair of closely spaced parallel second end portions maintaining electrical insulation therebetween, said flat plate segment extending from between said pair of closely spaced parallel second end portions all around the periphery thereof to improve the withstand voltage of the closely spaced parallel second end portions. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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Specification