Resonant tag labels and method of making same

• US 5,751,256 A
• Filed: 01/31/1995
• Issued: 05/12/1998
• Est. Priority Date: 03/04/1994
• Status: Expired due to Fees

• Current Assignee: FLEXcon Company Incorporated
• Original Assignee: FLEXcon Company Incorporated
• Inventors: Pennace, John R., McDonough, Neil
• Primary Examiner(s): Wimer, Michael C.
• Application Number:
  US08/381,086
• Time in Patent Office: 1,197 Days
• Field of Search: 343/872, 343/873, 343/895
• US Class Current: 343/873
• CPC Class Codes: B32B 2519/02 RFID tags
• CPC Class Codes: G06K 19/0776 the adhering arrangement being a layer of adhesive, so that the record carrier can function as a sticker
• CPC Class Codes: G08B 13/2414 using inductive tags
• CPC Class Codes: G08B 13/2417 having a radio frequency identification chip
• CPC Class Codes: G08B 13/242 Tag deactivation
• CPC Class Codes: G08B 13/2437 Tag layered structure, processes for making layered tags
• CPC Class Codes: G08B 13/244 Tag manufacturing, e.g. continuous manufacturing processes
• CPC Class Codes: G08B 13/2442 Tag materials and material properties thereof, e.g. magnetic material details
• CPC Class Codes: G08B 13/2445 Tag integrated into item to be protected, e.g. source tagging
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 2203/0156 Temporary polymeric carrier or foil, e.g. for processing or transferring
• CPC Class Codes: H05K 3/20 by affixing prefabricated conductor pattern H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence
• CPC Class Codes: H05K 3/386 by the use of an organic polymeric bonding layer, e.g. adhesive
• CPC Class Codes: H05K 3/4644 by building the multilayer layer by layer, i.e. build-up multilayer circuits making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602
• CPC Class Codes: H05K 3/4682 Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil

Abstract

A frangible label which includes a plurality of integrally joined layers deposited successively on a removable carrier film. One or more of the layers are electrically conductive and configured to define an electrical circuit. The label is transferrable from the carrier film onto a receiving surface and is otherwise inseparable from the carrier film without attendant disruption of the circuit. In an alternative embodiment, the label includes an adhesive layer for applying the label to a substrate, such that the plurality of integrally joined layers including the electrical circuit are transferrable to the receiving surface and are otherwise inseparable from the carrier film without destruction of the electrical circuit.

Claims

1. A labeling system comprising:

a carrier film;

a first electrically conductive layer formed as a deposit on said carrier film;

a dielectric layer formed as a deposit on and at least partially covering said first electrically conductive layer;

a second electrically conductive layer formed as a deposit on and at least partially covering said dielectric layer, said first and second electrically conductive layers being integrally joined to said dielectric layer to provide a composite label structure, said label structure having oppositely facing sides, with said carrier film being integrally associated with first portions of said label structure and separably associated with second portions of said label structure at one of said sides; and

adhesive means arranged to coact with the other side of said label structure for applying said label structure to a receiving surface, said carrier film being separable from said second portions of the thus applied label structure with said first portions of said label structure remaining with said carrier film, said second portions defining an operable resonant circuit.

2. The labeling system as claimed in claim 1 wherein said adhesive means comprises an adhesive coating applied to the said other side of said label structure.

3. The labeling system as claimed in claim 1 wherein said adhesive means comprises an adhesive coating applied to said receiving surface.

4. The labeling system as claimed in claim 1 wherein said composite label structure has a thickness of between 0.5 to 1.2 mils.

5. The labeling system as claimed in claim 1 wherein said first and second electrically conductive layers comprise conductive ink coatings.

6. The labeling system of claim 5 wherein said conductive ink coatings have thicknesses ranging from 0.05 to 0.5 mils.

7. The labeling system as claimed in claim 1 wherein said first and second electrically conductive layers comprise electrodeless depositions ranging in thickness from 0.001 to 0.1 mils.

8. The labeling system as claimed in claim 1 wherein said first and second electrically conductive layers comprise vacuum metalized deposits ranging in thickness from 3.0×

10^-4 to 6.0×

10^-3 mils.

9. The labeling system as claimed in claim 1 wherein said first and second electrically conductive layers comprise sputter depositions ranging in thickness from 25 to 1200 Å

.

10. The labeling system as claimed in claim 1 wherein said first and second electrically conductive layers comprise plasma depositions ranging in thickness from 50 to 10,000 Å

.

11. The labeling system as claimed in claim 1 wherein said dielectric layer comprises a polymeric coating ranging in thickness from 0.025 to 1.2 mils.

12. The labeling system as claimed in claim 2 wherein said adhesive coating has a thickness ranging from 0.1 to 1.0 mils.

13. The labeling system as claimed in claim 1 wherein said label structure is otherwise inseparable from said carrier film without attendant disruption of said resonant circuit.