Continuous mesh EMI shield for pulse oximetry sensor

• US 5,752,914 A
• Filed: 05/28/1996
• Issued: 05/19/1998
• Est. Priority Date: 05/28/1996
• Status: Expired due to Term

• Current Assignee: Nellcor Puritan Bennett Incorporated (Medtronic Plc)
• Original Assignee: Nellcor Puritan Bennett Incorporated (Medtronic Plc)
• Inventors: Delonzor, Russell, Namy, Al
• Primary Examiner(s): Bahr, Jennifer
• Assistant Examiner(s): WINAKUR, ERIC FRANK
• Application Number:
  US08/654,449
• Time in Patent Office: 721 Days
• Field of Search: 128/633, 128/664, 128/665, 428/344, 428/354, 442/6, 442/16, 442/131, 600/310, 600/322, 600/323, 600/344, 600/473, 600/476
• US Class Current: 600/310
• CPC Class Codes: A61B 5/14552 Details of sensors specially adapted therefor
• CPC Class Codes: H05K 9/00 Screening of apparatus or components against electric or magnetic fields devices for absorbing radiation from an antenna H01Q17/00
• CPC Class Codes: Y10T 442/259 Coating or impregnation provides protection from radiation [e.g., U.V., visible light, I.R., micscheme-change-itemave, high energy particle, etc.] or heat retention thru radiation absorption

Abstract

An improved electromagnetic shield for a photodetector which uses a wire mesh screen laminated to an insulating layer. A portion of the wire mesh screen and laminated layer sandwich can then be cut out to provide an individual electromagnetic shield. The sandwich combination is flexible, and can be easily wrapped around the photodetector. Preferably, an adhesive is on one side of the insulating layer, to allow the wrapped combination to adhere to the photodetector.

Claims

1. A method for providing an electromagnetic shield for a photodetector, comprising the steps of:

providing an insulating layer;

providing a wire mesh screen;

laminating said wire mesh screen to said insulating layer to produce a laminated sandwich;

cutting out individual electromagnetic shields from said laminated sandwich; and

placing one of said electromagnetic shields adjacent said photodetector, with said insulating layer facing said photodetector.

2. The method of claim 1 further comprising the step of providing an adhesive on a side of said insulating layer opposite said wire mesh screen.

3. The method of claim 1 further comprising the step of wrapping said electromagnetic shield around leads to said photodetector up to a shield around said leads.

4. The method of claim 1 wherein said wire mesh screen is copper.

5. The method of claim 4 wherein said wire mesh screen is comprised of wires having a diameter of 0.0020-0.0024 inches, and having a grid of between 75×

75 and 125×

125 wires per square inch.

6. A method for providing an electromagnetic shield for a photodetector, comprising:

providing an insulating layer;

providing a wire mesh screen;

laminating said wire mesh screen to said insulating layer to produce a laminated sandwich;

cutting out individual electromagnetic shields from said laminated sandwich; and

placing one of said electromagnetic shields adjacent said photodetector, with said insulating layer facing said photodetector;

wherein said insulating layer is a double sided adhesive layer bonded to a release liner on at least one side, wherein said cutting step cuts through said double sided adhesive layer but not said release liner.

7. A method for providing an electromagnetic shield for a photodetector, comprising the steps of:

providing an insulating layer as a double sided adhesive layer bonded to a release liner;

providing a copper wire mesh screen;

laminating said wire mesh screen to said insulating layer to produce a laminated sandwich;

cutting out individual electromagnetic shields from said laminated sandwich by cutting through said copper wire mesh screen and said insulating layer, but not through said release liner;

separating one of said electromagnetic shields from said release liner; and

at least partially enclosing said photodetector with said one of said electromagnetic shields, with a side of said electromagnetic shield having said insulating layer being adjacent said photodetector, and including, within the area wrapped by said electromagnetic shield, leads connected to said photodetector up to a shield around said leads.

8. A sensor comprising:

a photodetector mounted in said sensor;

a wire mesh screen; and

an insulating layer bonded to said wire mesh screen to form an electromagnetic shield, said electromagnetic shield at least partially enclosing said photodetector.

9. The sensor of claim 8 further comprising an adhesive bonded to said insulating layer for holding said electromagnetic shield in position.

10. The sensor of claim 8 wherein said electromagnetic shield is also at least partially enclosing leads of said photodetector up to a shield for said leads.

11. The sensor of claim 8 wherein said wire mesh screen is copper.

12. The sensor of claim 11 wherein said wire mesh screen is comprised of wires having a diameter of 0.0020 inches to 0.0024 inches, and having a grid of between 75×

75 and 125×

125 wires per square inch.

13. A pulse oximeter sensor comprising:

a photoemitter mounted in said sensor;

a photodetector mounted in said sensor;

a copper wire mesh screen;

an insulating layer bonded to said wire mesh screen to form an electromagnetic shield, said electromagnetic shield at least partially enclosing said photodetector;

an adhesive bonded to said insulating layer for holding said electromagnetic shield in a wrapped position; and

wherein said electromagnetic shield is also at least partially enclosing leads of said photodetector up to a shield for said leads.

14. A sensor comprising:

a photodetector mounted in said sensor;

an insulating layer; and

a conductive layer bonded to said insulating layer to form an electromagnetic shield, said electromagnetic shield at least partially enclosing said photodetector;

said conductive layer being sufficiently transparent to block less than 50% of the light directed at said photodetector, and being sufficiently conductive to reduce electromagnetic interference by at least 50% compared to an unshielded photodetector.

15. The sensor of claim 14 further comprising an adhesive bonded to said insulating layer for holding said electromagnetic shield in a wrapped position.

16. The sensor of claim 14 wherein said electromagnetic shield is also wrapped around leads of said photodetector up to a shield for said leads.

17. The sensor of claim 14 wherein said conductive layer is indium tin oxide.

18. The sensor of claim 14 further comprising a ground lead coupled to said conductive layer.

19. The sensor of claim 18 wherein said ground lead is coupled to said conductive layer by a conductive adhesive.

20. The sensor of claim 18 wherein said ground lead is connected to said conductive layer by a low temperature curing conductive epoxy.

21. The sensor of claim 14 wherein said conductive layer is silver.