Method of removing particles by adhesive

• US 5,753,563 A
• Filed: 07/30/1997
• Issued: 05/19/1998
• Est. Priority Date: 07/30/1997
• Status: Expired due to Fees

• Current Assignee: Chartered Semiconductor Manufacturing Incorporated (Mamoura Diversified Global Holding PJSC)
• Original Assignee: Chartered Semiconductor Manufacturing Incorporated (Mamoura Diversified Global Holding PJSC)
• Inventors: Guan, Yong Yang, Lim, Edward Hock Vui
• Primary Examiner(s): Bowers, Jr., Charles L.
• Assistant Examiner(s): GURLEY, LYNNE ANN
• Application Number:
  US08/902,756
• Time in Patent Office: 293 Days
• Field of Search: 438/476, 438/906, 438/310
• US Class Current: 438/476
• CPC Class Codes: B08B 7/0028 by adhesive surfaces
• CPC Class Codes: H01L 21/02043 Cleaning before device manufacture, i.e. Begin-Of-Line process
• CPC Class Codes: H01L 21/67028 for cleaning followed by drying, rinsing, stripping, blasting or the like
• CPC Class Codes: H01L 21/67092 Apparatus for mechanical treatment or grinding or cutting, see the relevant groups in subclasses B24B or B28D
• CPC Class Codes: H01L 29/66575 where the source and drain or source and drain extensions are self-aligned to the sides of the gate H01L29/66606 takes precedence
• CPC Class Codes: Y10S 438/906 Cleaning of wafer as interim step

Abstract

The removal of particulate contaminants, such as dust particles, from the surface of a semiconductor wafer is achieved by pressing a soft adhesive layer against the wafer surface, leaving it in place for a short time and then removing it. The adhesive is brought to the wafer surface on a flexible medium which serves as a backing layer and to whose other side pressure can be applied. To remove the adhesive, the backing layer is peeled off, either by pulling on one end or by passing a sticky roller over it. The operation may be performed in air or under vacuum.

Claims

1. A method for removing dust particles from a surface of a semiconductor wafer, comprising the sequential steps of:

a) providing a flexible substantially planar medium, having first and second sides, the first side being coated with a layer, having a thickness, of a soft adhesive material;

b) pressing said adhesive layer against the entire wafer surface by applying a pressure to the second side, said pressure applying the entire adhesive layer to the entire wafer surface; and

c) removing the entire adhesive layer from the surface of the wafer by pulling said flexible substantially planar medium away from the wafer surface.

2. The method of claim 1 wherein the adhesive material further comprises methacrylate or 2 ethyl-hexyl-acrylate.

3. The method of claim 1 wherein the flexible medium is selected from the group consisting of ethylene vinyl acetate, polyethylene, polyethylene tetrephalate, and oriented polypropylene.

4. The method of claim 1 further comprising waiting about one minute between steps b) and c).

5. The method of claim 1 wherein the pressure applied to the second side is between about 0.3 and 0.35 mPa.

6. The method of claim 1 wherein steps b) and c) are performed under vacuum.

7. The method of claim 1 wherein the adhesive strength of said adhesive layer is between about 120 and 180 grams per 25 mm. length.

8. The method of claim 1 wherein the thickness of the adhesive layer is between about 9 and 11 microns.

9. The method of claim 1 wherein the pressure is applied to the second side by means of a roller.

10. A method for removing dust particles from a surface of a semiconductor wafer, comprising the sequential steps of:

a) providing a flexible substantially planar medium, having first and second sides, the first side being coated with a layer, having a thickness, of a soft adhesive material;

b) providing a roller to which said second side will stick when brought into contact with the roller;

c) pressing said adhesive layer against the entire wafer surface by applying a pressure to the second side said pressure applying the entire adhesive layer to the entire wafer surface; and

d) removing the entire adhesive layer from the surface of the wafer by rolling the roller over said second side.

11. The method of claim 10 wherein the adhesive material further comprises methacrylate or 2 ethyl-hexyl-acrylate.

12. The method of claim 10 wherein the flexible medium is selected from the group consisting of ethylene vinyl acetate, polyethylene, polyethylene tetrephalate, and oriented polypropylene.

13. The method of claim 10 further comprising waiting about one minute between steps c) and d).

14. The method of claim 10 wherein the pressure applied to the second side is between about 0.3 and 0.35 mPa.

15. The method of claim 10 wherein steps c) and d) are performed under vacuum.

16. The method of claim 10 wherein the adhesive strength of said adhesive layer is between about 120 and 180 grams per 25 mm. length.

17. The method of claim 10 wherein the thickness of the adhesive layer is between about 9 and 11 microns.