Planar transformer and method of manufacture
First Claim
1. A planar transformer comprising at least one core set and at least one integrated circuit card containing a plurality of planes wherein at least a first plane contains primary electrically conductive windings and at least a second plane contains secondary electrically conductive windings;
- at least one conformal dielectric layer of epoxy composition on each of the planes containing the primary windings and the secondary windings to encapsulate the windings and to insulate the windings from the perimeter of each plane of said plurality of planes to prevent the primary windings from electrically contacting the secondary windings around the edges of said planes; and
at least one conformal dielectric layer of epoxy composition separating the at least first plane containing the primary windings from the at least second plane containing the secondary windings to electrically isolate the primary windings from the secondary windings.
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Accused Products
Abstract
A planar transformer wherein a conformal dielectric epoxy composition is provided on the planes containing the primary and secondary windings to encapsulate the windings and to insulate the windings from the perimeter of each plane to prevent the primary windings from electrically contacting the secondary windings around the edges of the planes. Also, a conformal dielectric epoxy composition separates the plane with the primary windings from the plane with the secondary windings from primary and secondary circuits directly and below windings.
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Citations
20 Claims
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1. A planar transformer comprising at least one core set and at least one integrated circuit card containing a plurality of planes wherein at least a first plane contains primary electrically conductive windings and at least a second plane contains secondary electrically conductive windings;
at least one conformal dielectric layer of epoxy composition on each of the planes containing the primary windings and the secondary windings to encapsulate the windings and to insulate the windings from the perimeter of each plane of said plurality of planes to prevent the primary windings from electrically contacting the secondary windings around the edges of said planes; and
at least one conformal dielectric layer of epoxy composition separating the at least first plane containing the primary windings from the at least second plane containing the secondary windings to electrically isolate the primary windings from the secondary windings.- View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 13, 14, 15, 16, 17, 18, 19, 20)
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12. A method for fabricating an integrated circuit card including a plurality of planes, said method comprising:
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providing a first assembly comprising an epoxy prepreg substrate containing on at least one major surface thereto primary windings, providing a second assembly comprising an epoxy prepreg substrate containing on at least one major surface thereof secondary windings, providing at least one epoxy prepreg substrate between the plane primary windings and secondary windings, providing an epoxy prepreg substrate covering each surface of said first and second assemblies that contains windings, pressing together the layers of the first and second assemblies and then subjecting the layers to temperature and under a pressure for a time sufficient to cure the epoxy of the prepreg substrates, and to cause epoxy from prepreg substrates to encapsulate the windings.
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Specification