Imager assembly
DCFirst Claim
1. A solid state imager assembly that includesa TAB imager unit having a transparent window mounted over a solid state imager, a first set of imager leads passing outwardly from between the imager and the window to one side of the unit and a second set of imager leads passing outwardly from between the imager and the window to the other side of the unit,a first circuit board solder bonded to the first set of leads and a second circuit board solder bonded to said second set of leads,said first and second circuit boards containing circuit components positioned in spaced apart alignment beneath said imager unit with the inside surfaces of the boards facing each other, anda block of encapsulating material at least partially encapsulating to said boards and filling the space between said boards to support the boards in alignment.
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Litigations
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Accused Products
Abstract
A solid state imager assembly for use in an insertion tube of a video endoscope that includes a TAB imager package having fine pitch leads extending outwardly to either side of the imager. A transparent window covers the imager. A first hybrid board is attached to one set of leads and a second hybrid circuit board is attached to the second set of leads. The boards are turned downwardly to either side of the imager and placed in opposed parallel alignment beneath the imager. Circuitry is mounted on the opposed inside surfaces of the boards. A block of encapsulating material is placed between the boards to encapsulate the circuitry therein and provide structural support to the package.
277 Citations
29 Claims
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1. A solid state imager assembly that includes
a TAB imager unit having a transparent window mounted over a solid state imager, a first set of imager leads passing outwardly from between the imager and the window to one side of the unit and a second set of imager leads passing outwardly from between the imager and the window to the other side of the unit, a first circuit board solder bonded to the first set of leads and a second circuit board solder bonded to said second set of leads, said first and second circuit boards containing circuit components positioned in spaced apart alignment beneath said imager unit with the inside surfaces of the boards facing each other, and a block of encapsulating material at least partially encapsulating to said boards and filling the space between said boards to support the boards in alignment.
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15. A solid state imager assembly that includes
a pair of circuit boards positioned in spaced apart alignment, said boards having opposed inner faces, outer faces and top edge surfaces, each board having a shoulder formed to a desired depth in said top edge surface of said boards so that the shoulders face each other, a TAB imager unit seated in said recesses so that the unit spans the space between the boards, said unit including a solid state imager and a transparent window mounted over the imager, the height of the imager being about equal to the depth of the shoulders and being seated therein, a first set of imager leads passing outwardly from between the imager and the window to one side and extending over the top edge surface of one of said boards and a second set of imager leads passing outwardly from between the imager and the window to the other side of the unit extending over the top edge surface of the other board, circuit traces printed on each of the boards, and means for electrically connecting the leads to said traces on said boards.
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23. A video endoscope having a video processor connected to an insertion tube for generating video images of a target, said endoscope further including,
a housing mounted in the distal end of the insertion tube, a light bundle contained in said housing having a light exit face at the distal end of the insertion tube, a lens means mounted in the housing for focussing an image of a target within a plane located inside said housing, a TAB imager that includes a solid state imager having an image recording surface and a transparent window mounted over the imager, said unit being mounted in said housing behind the lens with the image recording surface of the imager lying in the focal plane of the lens means, a first set of imager leads passing outwardly from between the imager and the window to one side of the unit and a second set of imager leads passing outwardly from between the imager and the window to the other side of the unit, a first circuit board connected to said first set of leads and a second circuit board connected to said second set of leads, each board having an inner face and an outer face and a top edge surface, said first and second circuit boards positioned in spaced apart relationship behind said imager unit with the inner surfaces of said boards facing each other, and a block of epoxy resin mounted between said boards with said boards being at least partially encapsulated in said resin.
Specification