Electrostatic chuck
First Claim
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1. An electrostatic wafer-holding chuck, comprising:
- a first dielectric plate formed of single crystal aluminum oxide having a first surface and an opposed second surface, said first surface having formed therein a recess,at least one electrode disposed within the recess formed in the first surface of the first dielectric plate, anda second dielectric plate formed of single crystal aluminum oxide having a first wafer-supporting surface and an opposed second surface, said first wafer-supporting surface having a fluid distribution network formed therein,said first dielectric plate disposed contiguous to said second dielectric plate such that said second surface of said second dielectric plate intimately contacts at least a peripheral portion of said first surface of said first dielectric plate,wherein said single crystal aluminum oxide materials forming said first and second dielectric plates each have a C-axis, said C-axes being aligned so that they are generally parallel relative to each other and form an angle therebetween of less than about 5 degrees when said electrostatic chuck is constructed.
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Abstract
An electrostatic wafer-holding chuck includes first and second dielectric plates formed of single crystal aluminum oxide and at least one electrode disposed within a recess formed in the first dielectric plate. The second dielectric plate has a top wafer-supporting surface that has a fluid distribution network formed therein. The fluid distribution network channels a heat transfer medium to the backside of the wafer. When the first and second dielectric plates are assembled, the first dielectric plate is disposed contiguous to the second dielectric plate and then are diffusively joined together to form a monolithic, hermetically-sealed electrostatic chuck.
64 Citations
17 Claims
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1. An electrostatic wafer-holding chuck, comprising:
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a first dielectric plate formed of single crystal aluminum oxide having a first surface and an opposed second surface, said first surface having formed therein a recess, at least one electrode disposed within the recess formed in the first surface of the first dielectric plate, and a second dielectric plate formed of single crystal aluminum oxide having a first wafer-supporting surface and an opposed second surface, said first wafer-supporting surface having a fluid distribution network formed therein, said first dielectric plate disposed contiguous to said second dielectric plate such that said second surface of said second dielectric plate intimately contacts at least a peripheral portion of said first surface of said first dielectric plate, wherein said single crystal aluminum oxide materials forming said first and second dielectric plates each have a C-axis, said C-axes being aligned so that they are generally parallel relative to each other and form an angle therebetween of less than about 5 degrees when said electrostatic chuck is constructed. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. An electrostatic chuck system, comprising:
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a first dielectric plate formed of single crystal aluminum oxide having a first surface and an opposed second surface, said first surface having formed therein a recess, an electrode disposed within the recess formed in said first surface of said first dielectric plate, a second dielectric plate formed of single crystal aluminum oxide having a first wafer-supporting surface and an opposed second surface,said first surface, having a fluid distribution network formed therein, said second plate being disposed contiguous to said first plate such that the second surface of said second plate intimately contacts a peripheral portion of said first surface of said first dielectric plate, and wherein said single crystal aluminum oxide materials forming said first and second plates each have a C-axis, said C-axes being generally parallel relative to each other and form an angle therebetween of less than about 5 degrees when said electrostatic chuck is constructed, fluid introduction means coupled to said first and second dielectric plates for introducing a heat transfer fluid to said fluid distribution network, and voltage means coupled to said electrode for supplying a voltage thereto. - View Dependent Claims (9)
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10. A method of producing an electrostatic chuck, comprising the steps of
providing a first dielectric plate formed of a single crystal material having a first surface and an opposed second surface, said first surface having an electrode recess formed therein, and providing a second dielectric plate formed of a single crystal material having a first wafer-supporting surface and an opposed second surface, said first surface having a fluid distribution network formed therein, wherein said single crystal material of said first and second dielectric plates each have a C-axis, said C-axes being generally parallel relative to each other to form an angle therebetween of less than about 5 degrees when the chuck is constructed, placing said second dielectric plate contiguous with said first dielectric plate such that said second surface of said second dielectric plate intimately contacts a peripheral portion of said first surface of said first dielectric plate, and heating said first and second dielectric plates to an elevated temperature in the range between about 1900° - C. and about 2000°
C. to diffusively join said second surface of said second dielectric plate to said first surface of said first dielectric plate. - View Dependent Claims (11, 12, 13)
- C. and about 2000°
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14. An electrostatic wafer-holding chuck, comprising:
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a first dielectric plate formed of single crystal aluminum oxide having a first surface and an opposed second surface, said first surface having formed therein a recess, at least one electrode disposed within the recess formed in the first surface of the first dielectric plate, and a second dielectric plate formed of single crystal aluminum oxide having a first wafer-supporting surface and an opposed second surface, wherein said single crystal aluminum oxide materials forming said first and second dielectric plates each have a C-axis, said C-axes being aligned so that they are generally parallel relative to each other and form an angle therebetween of less than about 5 degrees when the electrostatic chuck is constructed. - View Dependent Claims (15, 16)
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17. A method of producing an electrostatic chuck, comprising the steps of
providing a first dielectric plate formed of a single crystal material having a first surface and an opposed second surface, said first surface having an electrode recess formed therein, and providing a second dielectric plate formed of a single crystal material having a first wafer-supporting surface and an opposed second surface, wherein said single crystal material of said first and second dielectric plates each have a C-axis, said C-axes being generally parallel relative to each other to form an angle therebetween of less than about 5 degrees when the chuck is constructed, placing said second dielectric plate contiguous with said first dielectric plate such that said second surface of said second dielectric plate contacts a peripheral portion of said first surface of said first dielectric plate, and heating said first and second dielectric plates to an elevated temperature to join said second surface of said second dielectric plate to said first surface of said first dielectric plate.
Specification