Negative charge pump circuit for electrically erasable semiconductor memory devices

• US 5,754,476 A
• Filed: 10/31/1996
• Issued: 05/19/1998
• Est. Priority Date: 10/31/1995
• Status: Expired due to Term

• Current Assignee: Micron Technology, Inc.
• Original Assignee: SGS-Thomson Microelectronics, S.R.L. (STMicroelectronics NV)
• Inventors: Caser, Fabio Tassan, Defendi, Marco, Dallabora, Marco
• Primary Examiner(s): Nelms, David C.
• Assistant Examiner(s): NGUYEN, HIEN N
• Application Number:
  US08/751,299
• Time in Patent Office: 565 Days
• Field of Search: 365/185.18, 365/185.27, 365/185.29, 327/536, 327/540
• US Class Current: 365/185.29
• CPC Class Codes: H02M 3/073 Charge pumps of the Schenkel-type

Abstract

A negative charge pump circuit having a plurality of charge pump stages. Each charge pump stage has an input node and an output node and includes a pass transistor and a first coupling capacitor. The pass transistor has a first terminal connected to the input node, a second terminal connected to the output node and a control terminal connected to an internal node of the charge pump stage. The first coupling capacitor has a first plate connected to said output node and a second plate connected to a respective clock signal. Negative voltage regulation means are provided for regulating a negative output voltage on an output node of the negative charge pump circuit to provide a fixed negative voltage value. The negative charge pump circuit includes at least one negative voltage limiting means electrically coupling said output node of the negative charge pump circuit with the internal node of the last charge pump stage of the negative charge pump circuit. The negative voltage limiting means limits the negative voltage on the internal node and on the output node of said last charge pump stage.

Claims

1. A negative charge pump circuit, comprising:

a plurality of charge pump stages, each charge pump stage having an input node and an output node and comprising a pass transistor and a first coupling capacitor, the pass transistor having a first terminal connected to the input node, a second terminal connected to the output node and a control terminal connected to an internal node of the charge pump stage, said first coupling capacitor having a first plate connected to said output node and a second plate connected to a respective clock signal; and

negative voltage regulation means for regulating a negative output voltage on an output node of the negative charge pump circuit to provide a fixed negative voltage value, comprising at least one negative voltage limiting means electrically coupling said output node of the negative charge pump circuit with the internal node of the last charge pump stage of the negative charge pump circuit to limit the negative voltage on said internal node and on the output node of said last charge pump stage.

2. The negative charge pump circuit according to claim 1, further comprising a plurality of voltage limiting means, each voltage limiting means electrically coupling the output node of the negative charge pump circuit with the internal node of one respective charge pump stage.

3. The negative charge pump circuit according to claim 2 wherein said voltage limiting means further includes a diode-connected transistor.

4. The negative charge pump circuit according to claim 1 wherein each charge pump stage further includes cancellation means for canceling out a threshold voltage drop caused on the output node of the charge pump stage by said pass transistor.

5. The negative charge pump circuit according to claim 4 wherein said cancellation means further includes:

an initialization transistor with a first terminal and a second terminal respectively connected to the input node and to the output node of the charge pump stage, and with a control terminal connected to the first terminal;

a pre-charge transistor with a first terminal and a second terminal respectively connected to the input node and to the internal node of the charge pump stage, and with a control terminal connected to the output node of the charge pump stage; and

a second coupling capacitor with a first plate connected to the internal node of the charge pump stage and with a second plate connected to a respective clock signal substantially 180°

out-of-phase with respect to the clock signal driving the first coupling capacitor.

6. The negative charge pump circuit according to claim 5 wherein said first and second coupling capacitors of the charge pump stages are MOS capacitors with a first plate formed by an insulated gate layer, a second plate formed by an inversion layer formed in a semiconductor region under the insulated gate layer, and a dielectric layer formed by a gate oxide layer insulating said insulated gate layer from the underlying semiconductor region.

7. The negative charge pump circuit according to claim 5 wherein at least in the last charge pump stages said first and second coupling capacitors further include each a pair of serially connected capacitors, a first capacitor of the pair having a first plate formed by an inversion layer in a semiconductor region, a second plate formed by a first polysilicon layer placed over said inversion layer and a dielectric layer formed by a gate oxide layer insulating the first polysilicon layer from the underlying inversion layer, a second capacitor of the pair having a first plate formed by said first polysilicon layer, a second plate formed by a second polysilicon layer placed over the first polysilicon layer and a dielectric layer formed by an interpoly dielectric layer insulating the second polysilicon layer from the underlying first polysilicon layer.

8. The negative charge pump circuit according to claim 5 wherein at least in the first charge pump stages said first and second coupling capacitors comprise each a pair of parallely connected capacitors, a first capacitor of the pair having a first plate formed by an inversion layer in a semiconductor region, a second plate formed by a first polysilicon layer placed over said inversion layer and a dielectric layer formed by a gate oxide layer insulating the first polysilicon layer from the underlying inversion layer, a second capacitor of the pair having a first plate formed by said first polysilicon layer, a second plate formed by a second polysilicon layer placed over the first polysilicon layer and a dielectric layer formed by an interpoly dielectric layer insulating the second polysilicon layer from the underlying first polysilicon layer.

9. A method for producing a negative charge voltage for erasure of a memory cell using a plurality of charge pump stages, comprising the steps of:

a) enabling a reference potential for said plurality of charge pump stages;

b) supplying first and second signals at first time intervals to a first stage of said plurality of charge pump stages and establishing a first negative charge voltage value at a first input node;

c) supplying said first and second signals at second time intervals to said first stage for driving said first negative voltage to a second input node;

d) supplying third and fourth signals at third time intervals to a second stage of said plurality of charge pump stages and establishing a second negative charge voltage value at said second input node, said first and second negative voltages establish a cumulative voltage greater than said first or second negative voltages;

e) supplying said third and fourth signals at fourth time intervals to said second stage for driving said cumulative negative voltage to a third input node;

f) limiting said cumulative negative voltage;

g) regulating said limited cumulative negative voltage; and

h) erasing said memory cell using said regulated cumulative negative voltage.

10. The method of claim 9 wherein said steps b) through e) are repeated for additional stages of said plurality of charge pump stages to produce a predetermined cumulative negative voltage.

11. The method of claim 10 further including the step of limiting the predetermined cumulative negative voltage.

12. The method of claim 9 wherein said third time intervals are contained within said second time intervals.

13. The method of claim 12 wherein said first and third time intervals for said first and third signals are less than said first and third time intervals for said second and fourth signals.

14. The method of claim 9 further including the step of canceling a threshold voltage drop during steps c) and e) while driving the negative voltage.

15. The method of claim 9 wherein said second and fourth time intervals for said second and fourth signals are less than said second and fourth time intervals for said first and third signals.

16. A negative charge pump circuit for erasure of a memory cell comprising:

an enablement transistor coupled to a reference potential;

a first stage having input and output nodes and a first threshold voltage cancellation circuit, said input node being coupled to said enablement transistor and said first stage providing a first negative charge pump voltage at said first output node compensated by said first cancellation circuit;

a first pair of clock signals respectively coupled to an intermediate node and said output node of said first stage for driving said first negative charge pump voltage;

a second stage having input and output nodes and a second threshold voltage cancellation circuit, said second input node being coupled to said first output node and said second stage providing a second negative charge pump voltage at said second output node, said second voltage being equal to approximately twice the negative voltage value as said first voltage and includes said first voltage;

a second pair of clock signals coupled to an intermediate node and said output node of said second stage for driving said second negative charge pump voltage; and

a voltage regulation circuit being coupled between said second stage output and an erasure voltage output terminal.

17. The negative charge pump circuit of claim 16 further including a voltage limitation circuit coupled between said regulation circuit and said second stage output which limits the second voltage provided to said voltage regulation circuit.

18. The negative charge pump circuit of claim 16 wherein each stage further includes:

a pass transistor having first and second terminals respectively coupled between the input and output nodes, and a control terminal coupled to said intermediate node;

a first coupling capacitor coupled between the internal node and the first clock signal of said pair of clock signals.

19. The negative charge pump circuit of claim 18 wherein said threshold voltage cancellation circuit for each stage further includes:

an initialization transistor having first and second terminals respectively coupled between the input and output nodes, and a control terminal coupled to the first terminal;

a pre-charge transistor having first and second terminals respectively coupled between the input and internal nodes, and a control terminal coupled to the output node; and

a second coupling capacitor coupled between the output node and the second clock signal of said pair of clock signals, said second clock signal being substantially 180°

out-of-phase with respect to the first clock signal.

20. The negative charge pump circuit of claim 16 wherein said negative charge pump circuit further includes a plurality of first and second stages serially coupled to the respective second output node and at least one limitation circuit coupled between the output node of said plurality of stages and said regulation circuit, each said plurality of first and second stages increases the negative voltage provided to said regulation circuit by the second voltage generated by each first and second stage.

21. The negative charge pump circuit of claim 19 wherein said first and second coupling capacitors of the charge pump stages are MOS capacitors with a first plate formed by an insulated gate layer, a second plate formed by an inversion layer formed in a semiconductor region under the insulated gate layer, and a dielectric layer formed by a gate oxide layer insulating said insulated gate layer from the underlying semiconductor region.

22. The negative charge pump circuit of claim 19 wherein at least in the first charge pump stages said first and second coupling capacitors comprise each a pair of parallel connected capacitors, a first capacitor of the pair having a first plate formed by an inversion layer in a semiconductor region, a second plate formed by a first polysilicon layer placed over said inversion layer and a dielectric layer formed by a gate oxide layer insulating the first polysilicon layer from the underlying inversion layer, a second capacitor of the pair having a first plate formed by said first polysilicon layer, a second plate formed by a second polysilicon layer placed over the first polysilicon layer and a dielectric layer formed by an interpoly dielectric layer insulating the second polysilicon layer from the underlying first polysilicon layer.