×

Substrate inspection apparatus and method

  • US 5,754,678 A
  • Filed: 05/30/1996
  • Issued: 05/19/1998
  • Est. Priority Date: 01/17/1996
  • Status: Expired due to Fees
First Claim
Patent Images

1. A method for inspecting a substrate using an image sensing device, the substrate having a plurality of output pixels and the image sensing device having a plurality of input pixels, each of the plurality of output pixels comprising a plurality of sub-pixels, the method comprising the steps of:

  • capturing an image of at least a portion of the substrate with the image sensing device, the image including an image of a first group of output pixels as a first group image and the image including an image of a second group of output pixels as a second group image, a first group of input pixels of the image sensing device capturing the first group image, and a second group of input pixels of the image sensing device capturing the second group image;

    comparing a first intensity value of the first group image, corresponding to a location of a first input pixel within the first group of input pixels, to a first intensity value of the second group image, corresponding to a location of a first input pixel within the second group of input pixels;

    comparing a second intensity value of the first group image, corresponding to a location of a second input pixel within the first group of input pixels, to a second intensity value of the second group image, corresponding to a location of a second input pixel within the second group of input pixels; and

    determining defects in sub-pixels in the first group of output pixels in response to the comparing steps.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×