Electroding of ceramic piezoelectric transducers

• US 5,755,909 A
• Filed: 06/26/1996
• Issued: 05/26/1998
• Est. Priority Date: 06/26/1996
• Status: Expired due to Term

• Current Assignee: Spectra Inc (Fujifilm Holdings Corporation)
• Original Assignee: Spectra Inc (Fujifilm Holdings Corporation)
• Inventors: Gailus, David W.
• Primary Examiner(s): MAYES, MELVIN C
• Application Number:
  US08/673,162
• Time in Patent Office: 699 Days
• Field of Search: 156/230, 156/233, 156/235, 156/239, 156/241, 156/212, 156/196, 156/221, 156/229, 156/276, 310/311, 310/324, 310/325, 310/328, 310/330, 310/358, 310/363, 310/365, 347/68, 347/69, 347/70, 347/71, 347/72, 29/25.35
• US Class Current: 156/229
• CPC Class Codes: B41J 2/14201 Structure of print heads with piezoelectric elements
• CPC Class Codes: B41J 2/1607 Production of print heads with piezoelectric elements B41J2/1606, B41J2/162 take precedence
• CPC Class Codes: B41J 2/161 of film type, deformed by bending and disposed on a diaphragm
• CPC Class Codes: B41J 2/1618 Fixing the piezoelectric elements
• CPC Class Codes: B41J 2/1623 bonding and adhesion
• CPC Class Codes: B41J 2002/14491 Electrical connection
• CPC Class Codes: B41J 2202/03 Specific materials used
• CPC Class Codes: B41J 2202/11 characterised by specific geometrical characteristics
• CPC Class Codes: H10N 30/06 Forming electrodes or interconnections, e.g. leads or terminals
• CPC Class Codes: H10N 30/87 Electrodes or interconnections, e.g. leads or terminals
• CPC Class Codes: H10N 30/877 Conductive materials
• CPC Class Codes: Y10T 156/1043 Subsequent to assembly
• CPC Class Codes: Y10T 29/42 Piezoelectric device making

Abstract

In the embodiments described in the specification, electrodes are bonded to the surface of a ceramic piezoelectric layer by supporting electrodes having a reduced dimension on a flexible dielectric film and placing the dielectric film under tension to expand the film and the electrodes sufficiently to conform the electrodes to the desired electrode pattern on the ceramic piezoelectric layer. The electrodes are then bonded to the piezoelectric layer with an adhesive bonding agent under pressure applied hydraulically so as to be distributed uniformly throughout the surface of the piezoelectric layer. In one embodiment the dielectric film also carries conductor arrays for connecting the electrodes to remote driver chips at locations spaced from the surface of the piezoelectric layer.

Claims

1. A method for applying electrodes to a surface of a ceramic piezoelectric layer comprising forming a pattern of deformable electrode material, interposing an adhesive layer between the pattern of deformable electrode material and a surface of a ceramic piezoelectric layer, and pressing the pattern of deformable electrode material against the surface of the ceramic piezoelectric layer with a pressure which is applied substantially uniformly over the surface of the ceramic piezoelectric layer.

2. A method according to claim 1 wherein the adhesive layer is interposed between the pattern of deformable electrode material and the surface of the ceramic piezoelectric layer by applying adhesive material to the surface of the ceramic piezoelectric layer.

3. A method according to claim 1 wherein the adhesive layer is interposed between the pattern of deformable electrode material and the surface of the ceramic piezoelectric layer by applying adhesive material to the pattern of deformable electrode material.

4. A method according to claim 1 wherein the surface of the ceramic piezoelectric layer has granular asperities and the pattern of deformable electrode material is pressed against the surface of the ceramic piezoelectric layer with sufficient pressure to cause the electrode material to be deformed by the granular asperities.

5. A method according to claim 4 wherein the pattern of deformable electrode material is pressed against the surface of the ceramic piezoelectric layer with sufficient pressure to displace adhesive material in the layer of adhesive material from the peaks of the granular asperities into spaces between the asperities.

6. A method according to claim 1 wherein the surface of the ceramic piezoelectric layer has macrovariations and the pattern of deformable electrode material is pressed against the surface of the ceramic piezoelectric layer with sufficient pressure to cause the pattern of deformable electrode material to be deformed to conform to the macrovariations in the surface of the ceramic piezoelectric layer.

7. A method according to claim 1 wherein the pattern of deformable electrode material is supported on a deformable film which is larger than the surface of the ceramic piezoelectric layer and the pattern of deformable electrode material includes a pattern of electrodes to be bonded to the surface of the ceramic piezoelectric layer and a pattern of conductors extending beyond the surface of the ceramic piezoelectric layer to connect the pattern of electrodes to a remote driving component.

8. A method according to claim 7 including the step of connecting an electrode driving component to the pattern of conductors at a location spaced from the surface of the ceramic piezoelectric layer.

9. A method according to claim 1 wherein the pattern of deformable electrode material is supported on a deformable film and including removing the deformable film from the pattern of deformable electrode material after the pattern of deformable electrode material has been bonded to the surface of the ceramic piezoelectric layer.

10. A method according claim 1 wherein the pattern of deformable electrode material is supported on a deformable film and has dimensions which are smaller than desired dimensions of an electrode pattern on the surface of the ceramic piezoelectric layer and including the step of stretching the deformable film and the deformable electrode material to make the electrode pattern conform to the desired dimensions on the surface of the ceramic piezoelectric layer before pressing it against the surface of the ceramic piezoelectric layer.

11. A method according to claim 1 including the step of pressing a further pattern of deformable electrode material and a further interposed adhesive layer against a further surface of the ceramic piezoelectric layer opposite the surface to which the pattern of deformable electrode material has been applied.

12. A method according to claim 11 wherein the pattern of deformable electrode material and the further pattern of deformable electrode material have corresponding electrode patterns arranged to provide enhanced deflection of the ceramic piezoelectric layer when actuated.

13. A method according to claim 1 including applying substantially uniform pressure to the pattern of deformable electrode material by applying pressure to the pattern of the deformable electrode material through an elastomeric layer.

14. A method according to claim 1 including applying substantially uniform pressure to the pattern of deformable electrode material by applying pressure to the pattern of deformable electrode material through a viscoplastic layer.

15. A method according to claim 1, including the step of providing fine particles of high dielectric constant or conductive material between the pattern of deformable electrode material and the surface of the ceramic piezoelectric layer.

16. A method according to claim 15 wherein the fine particles of high dielectric constant or conductive material are distributed in the adhesive layer.

17. A method according to claim 15 wherein the fine particles of high dielectric constant or conductive material are dispersed on the surface of the ceramic piezoelectric layer.

18. A method according to claim 1 including the step of heating the pattern of deformable electrode material, the adhesive layer and the ceramic piezoelectric layer while the deformable electrode material is pressed against the surface of the ceramic piezoelectric layer to harden the adhesive material.

19. A method according to claim 18 wherein the deformable electrode material, the adhesive layer and the ceramic piezoelectric layer are pressed together with a pressure of at least 500 psi (35.2 kg/cm²) and no more than 3,750 psi (264 kg/cm²)while hardening the adhesive material.