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Method of monitoring constituents in electroless plating baths

  • US 5,755,954 A
  • Filed: 01/17/1996
  • Issued: 05/26/1998
  • Est. Priority Date: 01/17/1996
  • Status: Expired due to Fees
First Claim
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1. A method for monitoring the concentrations of constituents present in a solution used in an electroless plating process wherein said constituents affect plating deposit properties, said method comprising the steps of:

  • (a) applying a selected dc potential to a working electrode which has been subjected to annealing and anodic pretreatment and is positioned within said solution containing said constituents, said working electrode being a non-catalytic electrode which comprises a low or moderate hydrogen overvoltage material which is alloyed or mixed with a high overvoltage material;

    (b) superimposing a constant ac voltage on said dc potential applied to said working electrode, said ac voltage having a root mean square potential and a frequency and producing an ac current;

    (c) varying said dc potential at a chosen sweep rate over a chosen range; and

    (d) measure said dc and/or said ac current or a harmonic thereof at one or more reference phase angles with respect to said constant ac voltage between said working electrode and a reference electrode positioned within said solution as said dc potential is varied over said range, said measurement of dc and/or ac current in relation to varying dc potential being expressed as dc and/or ac current spectra which are used to determine and monitor said constituents in said solution.

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