Sheet-framed IC carrier, method for producing the same, and IC carrier case
First Claim
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1. A sheet-framed IC carriers comprising:
- a sheet;
frame having an aperture including a protrusion and having a first area;
a backing film having a pressure-sensitive adhesive layer on one surface, said backing film being adhered to a back surface of said sheet frame through said adhesive layer;
an IC carrier having a base and an IC module mounted on said base, said base having the same shape as said aperture, an indentation corresponding to said protrusion and a second area less than said first area, said IC carrier being set in the aperture of said sheet frame such that the difference in area between the IC carrier base and the sheet frame aperture results in a peripheral slit of constant width extending around the entire periphery of the IC carrier between the sheet frame aperture and the IC carrier, said IC carrier being secured in the aperture of said sheet frame with said adhesive layer of said backing film; and
a bridge portion connecting said sheet frame and said IC carrier between said protrusion and said indentation, said bridge portion having a thickness thinner than that of said IC carrier, and being positioned at a portion of said peripheral slit which is directed inside said base of said IC carrier.
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Abstract
A sheet-framed IC carrier has a sheet frame having an aperture, and a backing film with a pressure-sensitive adhesive layer on one surface thereof which is adhered to the back surface of the sheet frame. An IC carrier having an IC module is secured in the aperture of the sheet frame with the adhesive layer on the backing film. When the IC carrier is removed from the sheet-framed IC carrier, no excessive load is exerted on the IC module and no projection remains on the peripheral edge of the carrier base.
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Citations
34 Claims
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1. A sheet-framed IC carriers comprising:
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a sheet;
frame having an aperture including a protrusion and having a first area;a backing film having a pressure-sensitive adhesive layer on one surface, said backing film being adhered to a back surface of said sheet frame through said adhesive layer; an IC carrier having a base and an IC module mounted on said base, said base having the same shape as said aperture, an indentation corresponding to said protrusion and a second area less than said first area, said IC carrier being set in the aperture of said sheet frame such that the difference in area between the IC carrier base and the sheet frame aperture results in a peripheral slit of constant width extending around the entire periphery of the IC carrier between the sheet frame aperture and the IC carrier, said IC carrier being secured in the aperture of said sheet frame with said adhesive layer of said backing film; and a bridge portion connecting said sheet frame and said IC carrier between said protrusion and said indentation, said bridge portion having a thickness thinner than that of said IC carrier, and being positioned at a portion of said peripheral slit which is directed inside said base of said IC carrier. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34)
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Specification
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Current AssigneeDai Nippon Printing Company Limited
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Original AssigneeDai Nippon Printing Company Limited
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InventorsTakahashi, Jun, Wakamatsu, Masaki, Irisawa, Kazuyoshi, Nishikawa, Seiichi, Harima, Hiroshi, Moriyama, Akiko, Inada, Mayumi, Fukushima, Yoshikazu
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Primary Examiner(s)Haiec, Donald T.
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Assistant Examiner(s)TREMBLAY, MARK STEPHEN
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Application NumberUS08/699,034Time in Patent Office645 DaysField of Search235/487, 235/489, 235/492US Class Current235/492CPC Class CodesA45C 2011/188 Media card holders, e.g. me...G06K 19/072 the record carrier comprisi...G06K 19/077 Constructional details, e.g...G06K 19/07701 the record carrier comprisi...G06K 19/07739 comprising a first part cap...G06K 19/07745 Mounting details of integra...H01L 2924/00 Indexing scheme for arrange...H01L 2924/0002 Not covered by any one of g...
