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Sheet-framed IC carrier, method for producing the same, and IC carrier case

  • US 5,757,116 A
  • Filed: 08/19/1996
  • Issued: 05/26/1998
  • Est. Priority Date: 08/02/1993
  • Status: Expired due to Term
First Claim
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1. A sheet-framed IC carriers comprising:

  • a sheet;

    frame having an aperture including a protrusion and having a first area;

    a backing film having a pressure-sensitive adhesive layer on one surface, said backing film being adhered to a back surface of said sheet frame through said adhesive layer;

    an IC carrier having a base and an IC module mounted on said base, said base having the same shape as said aperture, an indentation corresponding to said protrusion and a second area less than said first area, said IC carrier being set in the aperture of said sheet frame such that the difference in area between the IC carrier base and the sheet frame aperture results in a peripheral slit of constant width extending around the entire periphery of the IC carrier between the sheet frame aperture and the IC carrier, said IC carrier being secured in the aperture of said sheet frame with said adhesive layer of said backing film; and

    a bridge portion connecting said sheet frame and said IC carrier between said protrusion and said indentation, said bridge portion having a thickness thinner than that of said IC carrier, and being positioned at a portion of said peripheral slit which is directed inside said base of said IC carrier.

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