Passivated organic device having alternating layers of polymer and dielectric

• US 5,757,126 A
• Filed: 06/30/1997
• Issued: 05/26/1998
• Est. Priority Date: 11/30/1995
• Status: Expired due to Term

• Current Assignee: Universal Display Corporation
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: So, Franky, Harvey, Thomas B. III, Shi, Song Q.
• Primary Examiner(s): O'Shea, Sandra L.
• Assistant Examiner(s): Patel, Vip
• Application Number:
  US08/886,112
• Time in Patent Office: 330 Days
• Field of Search: 313/504, 313/506, 313/509, 313/512, 428/690, 428/917
• US Class Current: 313/506
• CPC Class Codes: H10K 50/844 Encapsulations
• CPC Class Codes: H10K 50/8445 multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
• CPC Class Codes: H10K 59/873 Encapsulations
• CPC Class Codes: H10K 77/111 Flexible substrates
• CPC Class Codes: Y02E 10/549 Organic PV cells
• CPC Class Codes: Y10S 438/958 Passivation layer

Abstract

A method of passivating organic devices positioned on a supporting transparent plastic substrate including the steps of overcoating the plastic substrate with a multi-layer overcoating, composed of alternating layers of a transparent polymer film and a transparent dielectric material, forming an organic device on the overcoated transparent plastic substrate and sealing the organic device formed on the overcoated plastic substrate. The polymer film layer used in overcoating the plastic substrate acts as a means of improving the barrier properties of the multi-layer overcoating and the dielectric material acts as a physical barrier to atmospheric elements which can corrode the organic device and are a detriment to the reliability of organic LEDs.

Claims

1. A passivated organic device comprising:

a supporting transparent plastic substrate, overcoated with alternating layers of at least one transparent polymer film layer and at least one dielectric material layer;

an organic emissive layer formed on the supporting plastic substrate defining a plurality of pixels; and

a sealing layer positioned to seal the organic device.

2. A passivated organic device as claimed in claim 1 wherein the at least one polymer film layer is comprised of at least one of fluorinated polymers, parylenes or cyclotenes.

3. A passivated organic device as claimed in claim 1 wherein the at least one transparent dielectric material layer is comprised of at least one of silicon monoxide, silicon oxide, silicon dioxide or silicon nitride.

4. A passivated organic device as claimed in claim 1 wherein the plastic substrate overcoated with alternating layers of at least one polymer film layer and at least one dielectric material layer is overcoated on at least one planar surface.

5. A passivated organic device as claimed in claim 1 wherein the plastic substrate overcoated with alternating layers of at least one polymer film layer and at least one dielectric material layer is overcoated on all planar surfaces, thereby encapsulating the plastic substrate.

6. A passivated organic device as claimed in claim 1 further comprised of an overcoating layer of stable metal, capping the plurality of pixels, a buffer system including an overcoating layer of organic material coating the layer of stable metal, capping the pixels, and a low permeability inorganic layer positioned on the buffer system.

7. A passivated organic device as claimed in claim 6 wherein the overcoating layer of stable metal includes indium.

8. A passivated organic device as claimed in claim 6 wherein the buffer system further includes a thermal coefficient matching layer positioned on the buffer layer.

9. A passivated organic device as claimed in claim 6 wherein the buffer layer of organic material includes an organic polymer.

10. A passivated organic device as claimed in claim 1 wherein the sealing layer includes at least one of a layer of polymer coated metal foil, an epoxy encapsulant, a metalized plastic or a metal can formed over the organic device.

11. A passivated organic device as claimed in claim 1 wherein the sealing layer includes alternating layers of at least one polymer and at least one metal deposited over the organic device.

12. A passivated organic device comprising:

a supporting transparent plastic substrate, overcoated with alternating layers of at least one polymer film layer comprised of at least one of fluorinated polymers, parylenes or cyclotenes, and at least one dielectric material layer comprised of at least one of silicon monoxide, silicon oxide, silicon dioxide or silicon nitride;

an organic emissive layer formed on the supporting plastic substrate defining a plurality of pixels; and

a sealing layer positioned to seal the organic device.

13. A passivated organic device as claimed in claim 12 wherein the plastic substrate overcoated with alternating layers of at least one polymer film layer and at least one dielectric material layer is overcoated on at least one planar surface.

14. A passivated organic device as claimed in claim 12 wherein the plastic substrate overcoated with alternating layers of at least one polymer film layer and at least one dielectric material layer is overcoated on all planar surfaces, thereby encapsulating the plastic substrate.

15. A passivated organic device as claimed in claim 12 further comprised of an overcoating layer of stable metal, capping the plurality of pixels, a buffer system including an overcoating layer of organic material coating the layer of stable metal, capping the pixels, and a low permeability inorganic layer positioned on the buffer system.

16. A passivated organic device as claimed in claim 15 wherein the buffer system further includes a thermal coefficient matching layer positioned on the overcoating layer of organic material.

17. A passivated organic device as claimed in claim 12 wherein the sealing layer includes at least one of a layer of polymer coated metal foil, an epoxy encapsulant, a metallized plastic encapsulant or a metal can formed over the organic device.

18. A passivated organic device as claimed in claim 12 wherein the sealing layer includes alternating layers of at least one polymer and at least one metal formed over the organic device.