Single crystal silicon tiles for display panels

• US 5,757,445 A
• Filed: 12/27/1995
• Issued: 05/26/1998
• Est. Priority Date: 12/31/1990
• Status: Expired due to Term

• Current Assignee: Kopin Corporation
• Original Assignee: Kopin Corporation
• Inventors: Vu, Duy-Phach, Dingle, Jason E., Dingle, Brenda D., Cheong, Ngwe
• Primary Examiner(s): Sikes, William L.
• Assistant Examiner(s): MILLER, CHARLES LELAND
• Application Number:
  US08/579,122
• Time in Patent Office: 881 Days
• Field of Search: 349/45, 349/158, 349/122
• US Class Current: 349/45
• CPC Class Codes: A61B 3/113 for determining or recording eye movement
• CPC Class Codes: G02B 2027/0132 comprising binocular systems
• CPC Class Codes: G02B 2027/0138 comprising image capture systems, e.g. camera
• CPC Class Codes: G02B 2027/0187 slaved to motion of at least a part of the body of the user, e.g. head, eye
• CPC Class Codes: G02B 2027/0198 System for aligning or maintaining alignment of an image in a predetermined direction
• CPC Class Codes: G02B 27/0093 with means for monitoring data relating to the user, e.g. head-tracking, eye-tracking
• CPC Class Codes: G02B 27/017 Head mounted
• CPC Class Codes: G02B 27/0172 characterised by optical features
• CPC Class Codes: G02B 5/30 Polarising elements light-modulating devices with active elements G02F1/00
• CPC Class Codes: G02F 1/13336 Combining plural substrates to produce large-area displays, e.g. tiled displays
• CPC Class Codes: G02F 1/133526 Lenses, e.g. microlenses or Fresnel lenses
• CPC Class Codes: G02F 1/13454 Drivers integrated on the active matrix substrate G02F1/136277 takes precedence
• CPC Class Codes: G02F 1/13473 for wavelength filtering or for colour display without the use of colour mosaic filters
• CPC Class Codes: G02F 1/13613 the semiconductor element being formed on a first substrate and thereafter transferred to the final cell substrate
• CPC Class Codes: G02F 1/136209 Light shielding layers, e.g. black matrix, incorporated in the active matrix substrate, e.g. structurally associated with the switching element
• CPC Class Codes: G02F 1/136277 formed on a semiconductor substrate, e.g. of silicon
• CPC Class Codes: G02F 2202/105 single crystal Si
• CPC Class Codes: G09G 2300/023 Display panel composed of stacked panels
• CPC Class Codes: G09G 2300/0809 Several active elements per pixel in active matrix panels
• CPC Class Codes: G09G 2300/0842 forming a memory circuit, e.g. a dynamic memory with one capacitor
• CPC Class Codes: G09G 2320/0233 : Improving the luminance or brightness uniformity across the screen
• CPC Class Codes: G09G 2320/041 : Temperature compensation
• CPC Class Codes: G09G 2320/043 : Preventing or counteracting the effects of ageing
• CPC Class Codes: G09G 2340/0464 : Positioning
• CPC Class Codes: G09G 2370/042 : for monitor identification
• CPC Class Codes: G09G 3/30 : using electroluminescent panels
• CPC Class Codes: G09G 3/32 : semiconductive, e.g. using light-emitting diodes [LED]
• CPC Class Codes: G09G 3/36 : using liquid crystals
• CPC Class Codes: G09G 3/3607 : for displaying colours or for displaying grey scales with a specific pixel layout, e.g. using sub-pixels display of colours in flat matrix panels other than liquid crystal displays G09G3/2003; grey scales specific for television H04N3/127
• CPC Class Codes: G09G 3/3614 : Control of polarity reversal in general
• CPC Class Codes: G09G 3/3648 : using an active matrix G09G3/367 - G09G3/3696 take precedence
• CPC Class Codes: H01L 21/8221 : Three dimensional integrated circuits stacked in different levels
• CPC Class Codes: H01L 2221/68359 : used as a support during manufacture of interconnect decals or build up layers
• CPC Class Codes: H01L 2221/68363 : used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
• CPC Class Codes: H01L 24/96 : the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/0756 : Stacked arrangements of devices
• CPC Class Codes: H01L 25/10 : the devices having separate containers
• CPC Class Codes: H01L 25/50 : Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 27/0688 : Integrated circuits having a three-dimensional layout
• CPC Class Codes: H01L 27/1214 : comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
• CPC Class Codes: H01L 27/1266 : the substrate on which the devices are formed not being the final device substrate, e.g. using a temporary substrate
• CPC Class Codes: H01L 27/156 : two-dimensional arrays
• CPC Class Codes: H01L 29/786 : Thin film transistors, i.e. transistors with a channel being at least partly a thin film transistors having only the source or the drain region on an insulator layer H01L29/0653; thin film FinFETs H01L29/785
• CPC Class Codes: H01L 29/78603 : characterised by the insulating substrate or support H01L29/78657 takes precedence
• CPC Class Codes: H01L 29/78648 : arranged on opposing sides of the channel
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/01065 : Terbium [Tb]
• CPC Class Codes: H01L 2924/01072 : Hafnium [Hf]
• CPC Class Codes: H01L 2924/01073 : Tantalum [Ta]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01L 2924/3511 : Warping
• CPC Class Codes: H01S 5/0217 : Removal of the substrate
• CPC Class Codes: H01S 5/423 : having a vertical cavity
• CPC Class Codes: H04N 5/70 : Circuit details for electroluminescent devices
• CPC Class Codes: H04N 5/7441 : the modulator being an array of liquid crystal cells
• CPC Class Codes: H04N 5/7491 : of head mounted projectors
• CPC Class Codes: H04N 9/3141 : Constructional details thereof details not peculiar to the presence of an electronic spatial light modulator G03B21/14
• CPC Class Codes: H05B 33/12 : Light sources with substantially two-dimensional radiating surfaces

Abstract

The invention relates to the formation of arrays of thin film transistors (TFT'"'"'s) on silicon substrates and the dicing and tiling of such substrates for transfer to a common module body. TFT'"'"'s activate display electrodes formed adjacent the transistors after the tiles have been transferred.

Claims

1. An active matrix liquid crystal display comprising;

an array of transistor circuits formed with a layer of silicon over an insulating layer, the insulating layer being positioned on a first side of the array of transistor circuits;

an array of pixel electrodes formed with a polycrystalline silicon material, each pixel electrode being connected to a transistor circuit;

an optically transmissive substrate bonded to the array of transistor circuits on a second side of the array of transistor circuits with a bonding layer;

a light source that is optically coupled to the optically transmissive substrate such that light from the source is directed through the array of pixel electrodes; and

a liquid crystal material positioned between the insulating layer and a counterelectrode such that each pixel electrode can be actuated to control transmission of light through the liquid crystal material.

2. The active matrix liquid crystal display of claim 1 further comprising an array of color filter elements.

3. The active matrix liquid crystal display of claim 1 further comprising a light shield positioned between each transistor circuit and the light source.

4. The active matrix liquid crystal display of claim 1 wherein bonding layer comprises an the adhesive including a cycloaliphatic anhydride.

5. The active matrix liquid crystal display of claim 1 wherein the array of transistor circuits comprises a plurality of tiles that are electrically connected.

6. The active matrix display of claim 1 further comprising a driver circuit electrically connected to the array of transistor circuits.

7. The active matrix display of claim 1 wherein the pixel electrodes are formed on a plurality of tiles bonded to a common module body.

8. The active matrix display of claim 1 wherein the bonding layer comprises an adhesive such that the pixel electrodes are positioned between the adhesive and the liquid crystal material.

9. The active matrix display of claim 1 wherein the pixel electrodes are positioned between the insulating layer and the optically transmissive substrate.

10. The active matrix display of claim 1 further comprising an interconnect between each transistors circuit and a corresponding pixel electrode of the array of pixel electrodes.

11. An active matrix liquid crystal display comprising:

an array of transistor circuits formed with a layer of silicon on an insulating layer;

an optically transmissive substrate bonded to the array of transistor circuits and the silicon layer with an adhesive layer such that the adhesive layer and the array of transistors are positioned between the optically transmissive substrate and the insulating layer;

an array of pixel electrodes formed with a polycrystalline silicon material, each pixel electrode being connected to a transistor circuit in the array of transistor circuits;

a light source that is optically coupled to the optically transmissive substrate and the array of pixel electrodes; and

a liquid crystal material positioned between the insulating layer and a counterelectrode such that each pixel electrode can be actuated to control transmission of light through the liquid crystal material.

12. The active matrix liquid crystal display of claim 11 further comprising an array of color filter elements.

13. The active matrix liquid crystal display of claim 11 further comprising a light shield positioned between each transistor circuit and the light source.

14. The active matrix liquid crystal display of claim 11 wherein the adhesive comprises a cycloaliphatic anhydride.

15. The active matrix liquid crystal display of claim 11 wherein the array of transistor circuits comprises a plurality of tiles that are electrically connected.

16. A method of fabricating an active matrix liquid crystal display comprising:

forming a silicon layer over an insulating layer and a supporting substrate;

forming an array of transistors with the silicon layer to form an active matrix display circuit;

forming an array of pixel electrodes with a polycrystalline silicon material;

bonding the array of transistors onto an optically transmissive substrate with a bonding layer;

removing the supporting substrate from the display circuit; and

positioning a liquid crystal material between the array of pixel electrodes conductively connected to the active matrix display circuit and a counterelectrode element.

17. The method of claim 16 wherein the removing step further comprises chemically etching the supporting substrate to release the active matrix display circuit.

18. The method of claim 16 further comprising forming interconnects between each pixel electrode and a transistor circuit.