Display device and method of fabricating involving peeling circuits from one substrate and mounting on other

• US 5,757,456 A
• Filed: 03/08/1996
• Issued: 05/26/1998
• Est. Priority Date: 03/10/1995
• Status: Expired due to Term

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Nakajima, Setsuo, Arai, Yasuyuki, Takemura, Yasuhiko, Yamazaki, Shunpei
• Primary Examiner(s): Sikes, William L.
• Assistant Examiner(s): Parker, Kenneth
• Application Number:
  US08/611,336
• Time in Patent Office: 809 Days
• Field of Search: 349/41, 349/149, 349/151, 349/187
• US Class Current: 349/151
• CPC Class Codes: G02F 1/1303 Apparatus specially adapted to the manufacture of LCDs
• CPC Class Codes: G02F 1/133305 Flexible substrates, e.g. plastics, organic film
• CPC Class Codes: G02F 1/1345 Conductors connecting electrodes to cell terminals
• CPC Class Codes: G02F 1/13452 Conductors connecting driver circuitry and terminals of panels
• CPC Class Codes: G02F 1/13454 Drivers integrated on the active matrix substrate G02F1/136277 takes precedence
• CPC Class Codes: H01L 21/67132 Apparatus for placing on an insulating substrate, e.g. tape
• CPC Class Codes: H01L 2221/68363 used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2924/01079 Gold [Au]

Abstract

A method of fabricating a driver circuit for use with a passive matrix or active matrix electrooptical display device such as a liquid crystal display. The driver circuit occupies less space than heretofore. A circuit (stick crystal) having a length substantially equal to the length of one side of the matrix of the display device is used as the driver circuit. The circuit is bonded to one substrate of the display device, and then the terminals of the circuit are connected with the terminals of the display device. Subsequently, the substrate of the driver circuit is removed. This makes the configuration of the circuit much simpler than the configuration of the circuit heretofore required by the TAB method or COG method, because conducting lines are not laid in a complex manner. The driver circuit can be formed on a large-area substrate such as a glass substrate. The display device can be formed on a lightweight material having a high shock resistance such as a plastic substrate. Hence, a display device having excellent portability can be obtained.

Claims

1. A display device comprising:

a first substrate;

conducting lines formed from a transparent conductive film on said first substrate;

a semiconductor integrated circuit connected with said conducting lines and having TFTs;

a second substrate having a transparent conductive film on its surface, said transparent conductive film of said second substrate being opposite to said conducting lines on said first substrate; and

a display surface having sides of a length, said semiconductor integrated circuit having a length approximately equal to the length of one side of said display surface, said semiconductor integrated circuit peeled from other substrate carrying said semiconductor integrated circuit being mounted on said first substrate.

2. The device of claim 1 wherein at least said first substrate is made of a plastic.

3. The device of claim 1 wherein a liquid crystal material is sandwiched between said first and second substrates.

4. The device of claim 1 wherein said semiconductor integrated circuit has a connection portion connected with said conducting lines, and wherein said connection portion has an electrode of a conductive oxide.

5. The device of claim 1 wherein said second substrate exists in a direction perpendicular to said semiconductor integrated circuit which is formed on said first substrate.

6. A display device comprising:

a first substrate;

a transparent conductive film formed on said first substrate and forming a plurality of first conducting lines extending in a first direction;

a first semiconductor integrated circuit connected with said first conducting lines and having TFTs, said first semiconductor integrated circuit extending in a second direction substantially perpendicular to said first direction;

a second substrate;

another transparent conductive film formed on said second substrate and forming a plurality of second conducting lines extending in said second direction;

a second semiconductor integrated circuit connected with said second conducting lines and having TFTs, said second semiconductor integrated circuit extending in said first direction;

said first and second substrates being so arranged that said first and second conducting lines are opposite to each other; and

said first and second semiconductor integrated circuits peeled from other substrate carrying said first and second semiconductor integrated circuits being mounted on said first and second substrates, respectively.

7. The device of claim 6 wherein at least said first substrate is made of a plastic.

8. The device of claim 6 wherein a liquid crystal material is sandwiched between said first and second substrates.

9. The device of claim 6 wherein said second substrate exists in a direction perpendicular to said first semiconductor integrated circuit which is formed on said first substrate.

10. A display device comprising:

a first substrate;

a plurality of first conducting lines formed on said first substrate and extending in a first direction;

a first semiconductor integrated circuit connected with said first conducting lines and having TFTs, said first semiconductor integrated circuit extending in a second direction substantially perpendicular to said first direction;

a plurality of second conducting lines formed on said first substrate and extending in said second direction;

a second semiconductor integrated circuit connected with said second conducting lines and having TFTs, said second semiconductor integrated circuit extending in said first direction;

a second substrate having a transparent conductive film on its surface;

said first and second substrates being so arranged that said first and second conducting lines on said first substrate are opposite to said transparent conductive film on said second substrate; and

said first and second semiconductor integrated circuits peeled from other substrate carrying said first and second semiconductor integrated circuits being mounted on said first substrate.

11. The device of claim 10 wherein at least said first substrate is made of a plastic.

12. The device of claim 10 wherein a liquid crystal material is sandwiched between said first and second substrates.

13. A method of fabricating a display device having a first substrate, a transparent conductive film formed on said first substrate and forming a plurality of first conducting lines extending in a first direction, a first semiconductor integrated circuit connected with said first conducting lines and having TFTs and extending in a second direction substantially perpendicular to said first direction, a second substrate, a second transparent conductive film formed on said second substrate and forming a plurality of second conducting lines extending in said second direction, a second semiconductor integrated circuit connected with said second conducting lines and having TFTs, said second semiconductor integrated circuit extending in said first direction, said first and second substrates being so arranged that said first conducting lines are located opposite to said second conducting lines, said method comprising the steps of:

forming said first and second semiconductor integrated circuits on their respective support substrates via their respective peeling layers;

bonding said first and second semiconductor integrated circuits to said first and second substrates, respectively, thus forming a laminate; and

processing said laminate with a gas containing a halogen to remove said peeling layers, whereby said first and second semiconductor integrated circuits are peeled from their respective support substrates.

14. The method of claim 13 wherein said peeling layers are made from a semiconductor consisting mainly of silicon, and wherein said gas containing a halogen contains at least chlorine trifluoride.

15. The method of claim 13 wherein at least said first substrate is made of a plastic.

16. The method of claim 13 wherein said laminate processing step removes said peeling layers by etching using said gas containing a halogen under a non-plasma state.

17. A method of fabricating a display device having a first substrate, a plurality of first conducting lines formed on said first substrate and extending in a first direction, a first semiconductor integrated circuit connected with said first conducting lines and having TFTs and extending in a second direction substantially perpendicular to said first direction, a plurality of second conducting lines formed on said first substrate and extending in said second direction a second semiconductor integrated circuit connected with said second conducting lines and having TFTs and extending in said first direction, a second substrate having a transparent conductive film on its surface, said first and second substrates being so arranged that said first and second conducting lines on said first substrate are located opposite to said transparent conductive film on said second substrate, said method comprising the steps of:

forming said first and second semiconductor integrated circuits on their respective support substrates via their respective peeling layers;

bonding said first and second semiconductor integrated circuits to said first substrate, thus forming a laminate; and

processing said laminate with a gas containing a halogen to remove said peeling layers, whereby said first and second semiconductor integrated circuits are peeled from their respective support substrates.

18. The method of claim 17 wherein said peeling layers are made from a semiconductor consisting mainly of silicon, and wherein said gas containing a halogen contains at least chlorine trifluoride.

19. The method of claim 17 wherein at least said first substrate is made of a plastic.

20. The method of claim 17 wherein said laminate processing step removes said peeling layers by etching using said gas containing a halogen under a non-plasma state.