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Method of analyzing failure of semiconductor device by using emission microscope and system for analyzing failure of semiconductor device

  • US 5,760,892 A
  • Filed: 12/17/1996
  • Issued: 06/02/1998
  • Est. Priority Date: 06/14/1996
  • Status: Expired due to Fees
First Claim
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1. A method of analyzing a failure of a semiconductor device, comprising:

  • forming an emission image of said semiconductor device using an emission microscope, said emission image having light emitting portions at positions in the emission image relating to the two-dimensional position of corresponding positions on the semiconductor device;

    storing light emission information in an image memory, said light emission information including data indicating the two-dimensional position of each of said light emitting portions on said emission image and emitted light intensity data associated with each of said light emitting portions on said emission image at each of the two-dimensional positions;

    accessing said image memory to identify and retrieve said light emission information; and

    analyzing a failure of said semiconductor device in the form of a numerical value on the basis of said retrieved light emission information.

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