Faraday cage

• US 5,761,053 A
• Filed: 05/08/1996
• Issued: 06/02/1998
• Est. Priority Date: 05/08/1996
• Status: Expired due to Term

• Current Assignee: W. L. Gore & Associates (W.L. Gore & Associates)
• Original Assignee: W. L. Gore & Associates (W.L. Gore & Associates)
• Inventors: Rowan, Joseph C., Reis, Bradley E., Johnson, Daniel D., King, David Robert
• Primary Examiner(s): Kincaid, Kristine L.
• Assistant Examiner(s): Ngo, Hung V.
• Application Number:
  US08/643,292
• Time in Patent Office: 755 Days
• Field of Search: 174/35 R, 174/35 GC, 174/51, 361/816, 361/818, 361/719, 361/748, 361/753, 361/752, 361/796, 361/799, 361/800
• US Class Current: 361/818
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H05K 2201/10371 Shields or metal cases
• CPC Class Codes: H05K 3/323 by applying an anisotropic conductive adhesive layer over an array of pads
• CPC Class Codes: H05K 9/0026 integrally formed from metal sheet

Abstract

A Faraday cage is provided for EMI/RFI shielding which includes a substrate having an electrical ground; at least one electronic component electrically connected to the substrate; a conductive housing; and an electrically conductive adhesive. The electrically conductive adhesive may be defined by a substrate having numerous passageways through the substrate. The passageways are defined by a plurality of walls of the material making up the substrate. The walls are covered with a layer of conductive metal. The passageways are filled with a non-conductive adhesive resin. The conductive housing is adhesively electrically mounted to the electrical ground of the substrate, over the electronic component, to shield electromagnetic and radio frequency interference.

Claims

1. A Faraday cage comprising:

a circuit board having an electrical ground;

at least one electronic component electrically connected to the circuit board;

a conductive housing having at least an open end; and

an electrically conductive adhesive having a substrate having numerous passageways through the substrate defined by a plurality of internal surfaces, said internal surfaces defining said passageways having disposed thereon a layer of conductive metal, said passageways being at least partially filled with an adhesive resin, wherein the electrically conductive adhesive electrically mounts the conductive housing to the electrical ground of the circuit board, such that the open end of the conductive housing is disposed over the at least one electronic component, to shield electromagnetic and radio frequency interference.

2. The invention of claim 1, wherein the conductive housing is a metallized plastic housing.

3. A Faraday cage comprising:

a printed wiring board having an electrical ground;

at least one electronic component electrically connected to the printed wiring board;

a conductive housing; and

an electrically conductive adhesive having a substrate having numerous passageways through the substrate, the passageways being defined by a plurality of walls, said walls being covered with a layer of conductive metal, said passageways being at least partially filled with a non-conductive adhesive resin;

wherein the electrically conductive adhesive mounts the conductive housing to the electrical ground of the printed wiring board, over the at least one electronic component, to shield electromagnetic and radio frequency interference.

4. An article comprising:

a conductive housing having at least one open end; and

an electrically conductive adhesive disposed on a surface of the conductive housing about the open end, said electrically conductive adhesive having a substrate having numerous passageways through the substrate, the passageways being defined by a plurality of walls, said walls having disposed thereon a layer of conductive metal, said passageways being at least partially filled with a non-conductive adhesive resin;

wherein said conductive housing is conformably dimensioned to receive an electronic component through said open end.