Defect management system for productivity and yield improvement

• US 5,761,064 A
• Filed: 10/06/1995
• Issued: 06/02/1998
• Est. Priority Date: 10/06/1995
• Status: Expired due to Term

• Current Assignee: Advanced Micro Devices, Inc.
• Original Assignee: Advanced Micro Devices, Inc.
• Inventors: La, Tho Le, Shiau, Ying
• Primary Examiner(s): Trammell, James P.
• Application Number:
  US08/539,913
• Time in Patent Office: 970 Days
• Field of Search: 364/468.17, 364/468.28, 364/488-491, 364/551.01, 364/552, 364/554, 364/480, 364/481
• US Class Current: 700/110
• CPC Class Codes: G01R 31/319 Tester hardware, i.e. output processing circuits
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

Abstract

An automated wafer defect management system in which wafer defect data are collected from wafer inspection instruments, converted into a standard data format and made available through a central database system to workstations for review, analysis, and evaluation.

Claims

1. An automated wafer defect data management system, comprising:

multiple wafer inspection instruments;

multiple wafer analysis tools;

means for collecting wafer defect data from multiple defects on wafers from each of said multiple wafer inspection instruments and said multiple wafer analysis tools;

conversion means associated with each of the multiple wafer inspection instruments and each of the multiple wafer analysis tools for converting the collected wafer defect data from each of said multiple wafer inspection instruments and said multiple wafer analysis tools from an instrument and tool specific format to a standard format;

a central database system with means for storing converted wafer defect data wherein the stored converted wafer defect data is retrievable based on selected criteria;

at least one user interface workstation wherein user selected converted wafer defect data can be analyzed in real time; and

means for transferring user selected converted wafer defect data from the central database system to the at least one user interface workstation.

2. The system as in claim 1, wherein said central database system comprises:

a server;

a relational database installed on said server for organizing said converted wafer defect data in tables wherein aid converted wafer defect data is tagged according to preselected criteria; and

wherein said means for storing converted wafer defect data comprises a memory associated with said server to store said converted wafer defect data and said tables.

3. The system as in claim 2, wherein said at least one interface workstation includes:

means for creating statistical and graphical representations from said user selected converted wafer defect data; and

means for displaying said representations.

4. The system as in claim 3, further comprising:

at least one data analysis station;

means for transferring user selected converted wafer defect data to said at least one data analysis station;

means for analyzing said converted wafer defect data at said at least one data analysis station; and

means for transferring analyzed wafer defect data to said central database system.

5. The system as in claim 4, further comprising means for converting user selected converted wafer defect data to an instrument specific format required by said at least one data analysis station.

6. The system as in claim 5, further comprising:

means for transferring user selected analyzed wafer defect data to said at least one user interface workstation.

7. The system as in claim 6, wherein said workstation includes said means for creating said statistical and graphical representations.

8. The system as in claim 7, wherein said means for creating said statistical and graphical representations is independent of said central database system.

9. The system as in claim 8, wherein said means for creating said statistical and graphical representations includes a point-and-click graphical interface system allowing said user selected analyzed data to be selectively displayed in at least one format selected from the group consisting of a trend chart, an image, a wafer map, a tool comparison, or a Pareto chart.

10. The system as in claim 9, wherein said preselected criteria includes process technology, layer, lot, wafer, device, process equipment identification, and scan tool identification.

11. The system as in claim 10, wherein said data analysis station includes means for defect classification, image capture, surface/cross-section analysis, and spectral analysis.

12. The system as in claim 11, further comprising means for accessing an electrical test database.

13. The system as in claim 12, further comprising means for accessing an in-line process monitor and equipment monitor database.

14. The system as in claim 13, wherein said central database system further comprises means for correlating said user selected analyzed data with said electrical test data and said in-line process monitor and equipment monitor data.

15. The system as in claim 14, further comprising means for providing password security access by type of user.

16. The system as in claim 15, further comprising means for an automatic backup data integrity.

17. The system as in claim 16, wherein said means for transferring comprises a computer network.

18. An automated wafer defect data management system, comprising:

multiple wafer inspection instruments;

multiple wafer analysis tools;

a central database system;

a network for transferring wafer defect data from multiple defects on wafers generated at each of the multiple wafer inspection instruments and each of the multiple wafer analysis tools to the central database system;

a converter associated with each of the multiple wafer inspection instruments and each of the multiple wafer analysis tools to convert the wafer defect data generated at each of the multiple wafer inspection instruments and each of the multiple wafer analysis tools from an instrument and tool specific format to a standard format;

a memory associated with the central database system to store the converted wafer defect data wherein the stored converted wafer defect data is retrievable via the network based on selected criteria; and

at least one user interface workstation wherein user selected converted wafer defect data can be analyzed in real time.

19. The system as in claim 18, wherein said central database system includes:

a server; and

a relational database installed on said server for organizing said converted wafer defect data in tables wherein said converted wafer defect data is tagged according to preselected criteria.

20. The system as in claim 19, wherein said at least one user interface workstation creates statistical and graphical representations from said user selected converted wafer defect data and wherein said at least one user interface workstation further includes a display to display said representations.

21. The system as in claim 20, further comprising at least one data analysis station wherein said converted wafer defect data is analyzed and wherein said user selected converted wafer defect data is transferred to and from said at least one data analysis station and to said central database system by said network.

22. The system as in claim 21, further comprising at least one converter to convert user selected converted wafer defect data to an instrument specific format required by said at least one data analysis station.

23. The system as in claim 22, wherein said analyzed wafer defect data is transferred to said at least one user interface workstation by said network.

24. The system as in claim 23, wherein said user interface workstation includes a point-and-click graphical interface to allow said user selected analyzed data to be selectively displayed in at least one format selected from the group consisting of a trend chart, an image, a wafer map, a tool comparison, or a Pareto chart.

25. The system as in claim 24, wherein said preselected criteria includes process technology, layer, lot, wafer, device, process equipment identification, and scan tool identification.

26. The system as in claim 25, wherein said data analysis station performs defect classification, image capture, surface/cross-section analysis, and spectral analysis.

27. The system as in claim 26, further comprising a system to access an electrical test database.

28. The system as in claim 27, further comprising a system to access an in-line process monitor and equipment monitor database.

29. The system as in claim 28, wherein said central database system correlates said user selected analyzed data with said electrical test data and said in-line process monitor and equipment monitor data.

30. The system as in claim 29, comprising a system to provide password security access by type of user.

31. The system as in claim 30, further comprising a system to perform an automatic backup of said data.

32. A method of automating wafer defect data management, the method comprising:

collecting wafer defect data from multiple defects on wafers from multiple wafer inspection instruments;

collecting wafer defect data from multiple defects on wafers from multiple analysis tools;

transferring the collected wafer defect data from the multiple wafer inspection instruments and the multiple wafer analysis tools to a central database system via a network;

converting the collected wafer defect data from the multiple wafer inspection instruments and the multiple wafer analysis tools from an instrument and tool specific format to a standard format;

storing the converted collected wafer defect data in a memory associated with the central database system wherein the converted collected wafer defect data is retrievable based on selected criteria; and

analyzing selected converted collected wafer defect data in real time at at least one user interface workstation.

33. The method of claim 32, further comprising the step of organizing said converted wafer defect data in tables in a relational database installed on a server in said central database system wherein said converted wafer defect data is tagged according to preselected criteria comprising process technology, layer, lot, wafer, device process equipment identification, and scan tool identification.

34. The method of claim 33, further comprising the steps of:

creating statistical and graphical representations from said user selected converted wafer defect data; and

displaying said representations at said user interface workstation.

35. The method of claim 34, further comprising the steps of:

transferring said selected converted wafer defect data to a data analysis station;

analyzing said selected converted wafer defect data at the data analysis station; and

transferring said analyzed selected converted wafer defect data to said central database system by said network.

36. The method of claim 35, further comprising the steps of:

transferring said analyzed selected converted wafer defect data to said user interface workstation by said network; and

displaying said user selected analyzed data in a format selected from the group consisting of a trend chart, an image, a wafer map, a tool comparison, or a Pareto chart.

37. The method of claim 36, further comprising the step of performing defect classification, image capture, surface/cross-section analysis, and spectral analysis.

38. The method of claim 37, further comprising the steps of:

accessing an electrical test data base;

accessing an in-line process monitor and equipment monitor database; and

correlating information from said electrical test data base and information from said equipment monitor database with said user selected analyzed data.

39. The method of claim 38, further comprising the step of providing password security.

40. The method of claim 39, further comprising the step of performing an automated backup of said memory in said central database system.