Method of making a machine structures fabricated of mutiple microstructure layers

• US 5,763,318 A
• Filed: 12/24/1996
• Issued: 06/09/1998
• Est. Priority Date: 08/03/1995
• Status: Expired due to Term

• Current Assignee: GlobalFoundries, Inc.
• Original Assignee: International Business Machines Corporation
• Inventors: Cronin, John Edward, Bertin, Claude Louis
• Primary Examiner(s): DUTTON, BRIAN KEITH
• Application Number:
  US08/772,841
• Time in Patent Office: 532 Days
• Field of Search: 310/40 MM, 216/2, 438/455
• US Class Current: 438/455
• CPC Class Codes: H01H 1/0036 Switches making use of microelectromechanical systems [MEMS] for electromagnetic relays H01H50/005; for electrostatic relays H01H59/0009
• CPC Class Codes: H02N 1/004 in which a body is moved along a path due to interaction with an electric field travelling along the path

Abstract

Machine structures each comprising a stack of a plurality of micromachine layers laminated together are presented, along with fabrication methods therefore. Each machine structure includes a movable member(s) defined from microstructure of at least one layer of the plurality of micromachine layers comprising the stack. During fabrication, the micromachine layers are separately formed using VLSI techniques and then subsequently laminated together in a selected arrangement in the stack to define the machine structure.

Claims

1. A method for fabricating a machine comprising the steps of:

(a) providing a plurality of substrates;

(b) forming at least one opening in at least one substrate, said at least one opening defining structures in said at least one substrate;

(c) filling at least some of said at least one opening in said at least one substrate with a sacrificial material for temporarily securing together selected structures defined and separated by said at least one opening;

(d) stacking said plurality of substrates together in a selected arrangement to form a stack structure; and

(e) removing said sacrificial material from said at least one opening, such that said structures defined in said at least one substrate by said at least one opening form a movable member within said stack structure, thereby forming said machine.

2. The method of claim 1, wherein said forming step (b) comprises forming said at least one opening in multiple substrates of said plurality of substrates provided in said step (a) such that upon stacking of said plurality of substrates in said selected arrangement, structures defined within said multiple substrates together define said movable member within said stack structure.

3. The method of claim 2, wherein each substrate of said multiple substrates having said at least one opening formed therein in said step (b) comprises a micromachine layer having a movable microstructure, said movable microstructures of said multiple micromachine layers forming said movable member subsequent to removing of said sacrificial material in said step (e).

4. The method of claim 3, wherein said plurality of substrates comprise silicon substrates, and said stacking step (d) comprises laminating said plurality of substrates together in said selected arrangement to form said stack structure, said laminating including establishing a layer of tungsten or titanium between adjacent substrates of said plurality of substrates and heat treating said stack structure to bond said adjacent substrates together via said layer of tungsten or titanium.

5. The method of claim 2, wherein said multiple substrates having said at least one opening formed therein in said step (b) each comprise a silicon substrate, and wherein said sacrificial material of said step (c) comprises one of polyimide, paralyene, nitride and oxide.

6. A method for fabricating a machine comprising the steps of:

(a) forming at least one opening in each of at least two substrates, said at least one openings defining microstructures in said at least two substrates that create said machine when said at least two substrates are stacked in a selected arrangement;

(b) filling at least some of said at least one openings in said at least two substrates with a sacrificial material for temporarily securing together selected microstructures separated by said openings;

(c) stacking said at least two substrates together in said selected arrangement, thereby forming a stack; and

(d) removing said sacrificial material from said at least one opening in each of said at least two substrates, wherein a moveable member is defined within said stack by stacked microstructures of said at least two substrates, thereby forming said machine.

7. The method of claim 6, wherein said machine comprises an electrostatic machine, and wherein said forming step (a) and said stacking step (c) result in stacked microstructure of said at least two substrates defining a stator structure.

8. The method of claim 7, wherein said electrostatic machine comprises an electrostatic motor and said movable member comprises a rotor, and wherein said method further comprises the step of laminating an endcap substrate at each end of said stack formed in said step (c) to retain said rotor within said stack.

9. The method of claim 6, wherein said at least two substrates comprise silicon substrates and wherein said forming step (a) comprises wet etching said openings in said at least two substrates.

10. The method of claim 9, wherein said filling step (b) comprises filling at least some openings in said at least two silicon substrates with a sacrificial material comprising one of polyimide, paralyene, nitride and oxide.

11. The method of claim 10, wherein said stacking step (c) includes laminating said at least two substrates together in said selected arrangement, said laminating including establishing a layer of tungsten or titanium between said at least two substrates and heat treating said stack to bond said at least two substrates together via said layer of tungsten or titanium.