Chip antenna

• US 5,764,197 A
• Filed: 06/19/1996
• Issued: 06/09/1998
• Est. Priority Date: 06/20/1995
• Status: Expired due to Term

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Asakura, Kenji, Tsuru, Teruhisa, Mandai, Harufumi, Shiroki, Koji
• Primary Examiner(s): Le, Hoanganh T.
• Application Number:
  US08/667,978
• Time in Patent Office: 720 Days
• Field of Search: 343/895, 343/702, 343/787, 343/788, 343/872, 343/873, 343/866, 343/741
• US Class Current: 343/895
• CPC Class Codes: H01Q 1/362 for broadside radiating helical antennas
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142

Abstract

A chip antenna which provides a high gain and large band width and which makes it possible to achieve a reduction in the size of the chip antenna. The chip antenna has a dielectric base which is formed as a rectangular parallelepiped containing a spirally wound conductor whose winding axis is perpendicular to the longitudinal dimension of the dielectric base and parallel to the mounting surface. The configuration of the winding cross section S, which is perpendicular to the winding axis of the conductor, is a rectangle whose longitudinal vertical dimension is H and whose horizontal dimension is W. One end of the conductor is led out to the surface of the dielectric base to form a feeding end that is connected to a feeding terminal for applying a signal to the conductor, and the other end thereof forms a free end within the dielectric base.

Claims

1. A chip antenna comprising:

a dielectric substrate having a mounting surface, a longitudinal dimension, a transverse dimension which is smaller than said longitudinal dimension, and a thickness dimension which is smaller than said transverse dimension;

a spirally wound conductor attached to said dielectric substrate; and

a terminal connected to said conductor for applying a signal to said conductor,

wherein the winding axis of said conductor is perpendicular to said longitudinal dimension of said dielectric substrate and parallel to said mounting surface.

2. The chip antenna of claim 1, wherein said dielectric substrate comprises at least two stacked layers wherein respective portions of said spirally wound conductor are disposed on each of said at least two stacked layers.

3. The chip antenna of claim 2, wherein a stacking axis of said layers is perpendicular to said winding axis of said conductor.

4. The chip antenna of claim 1, wherein said spirally wound conductor is disposed within said dielectric substrate.

5. The chip antenna of claim 1, wherein said terminal is located at least partially on said mounting surface.

6. The chip antenna of claim 5, wherein said terminal is located at least partially adjacent to said mounting surface.

7. The chip antenna of claim 1, wherein said terminal is located at least partially adjacent to said mounting surface.