Pressure-plate-operative system for one-side injection molding of substrate-mounted integrated circuits

• US 5,766,535 A
• Filed: 06/04/1997
• Issued: 06/16/1998
• Est. Priority Date: 06/04/1997
• Status: Expired due to Fees

• Current Assignee: OSE USA, Inc. (Orient Semiconductor Electronics Limited)
• Original Assignee: Integrated Packaging Assembly Corporation
• Inventors: Ong, E. C.
• Primary Examiner(s): Nguyen, Khanh P.
• Application Number:
  US08/868,748
• Time in Patent Office: 377 Days
• Field of Search: 264/272.17, 264/275, 264/279, 264/272.15, 425/116, 425/117, 425/121, 425/125, 425/544, 425/572, 425/577, 425/DIG. 228, 249/95, 249/91
• US Class Current: 264/272.15
• CPC Class Codes: B29C 45/14655 connected to or mounted on a carrier, e.g. lead frame
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A mold system for encapsulating substrate-mounted ICs includes a split mold having a lower cavity adapted for positioning the substrate and an upper cavity adapted for providing a volume space around the IC. The lower cavity is provided with a compressible shim plate adapted to lie on a bottom surface of the lower cavity such that a substrate of a substrate-mounted IC placed in the lower cavity will extend above the upper limit of the lower cavity, which is the split surface of the mold. As the split mold is closed, a lower surface of the upper mold portion encounters first an upper surface of the substrate, then the compressible shim plate is compressed until the mold is fully closed, at which time the lower surface of the upper mold portion is in intimate contact with both the substrate and the upper surface of the lower mold portion. The IC mounted on the substrate is then presented in the upper cavity for encapsulation. This apparatus and method allows a lower mold portion having a single cavity depth to be used to encapsulate substrate-mounted ICs wherein the substrate thickness may vary from part-to-part.

Claims

1. A method for one-side encapsulation of substrate-mounted integrated circuits (ICs) in a split mold including a lower mold portion having a first cavity with a bottom surface and a first depth for containing and positioning the substrate, and an upper mold portion having a second cavity of a second depth for surrounding the IC to be encapsulated with a volume space for injecting molding material, wherein the mold is split along a plane at the upper extremity of the lower cavity, there being an upper plane surface of the lower mold portion and a lower plane surface of the upper mold portion, the method comprising steps of:

(a) placing an IC mounted on a single substrate that is not a heat sink, a compressible pressure plate, and a shim plate having greater rigidity than the single substrate in the first cavity such that the compressible pressure plate and the shim plate space the substrate from the bottom surface of the first cavity, a portion of the substrate is held within the lower cavity portion, and an upper surface of the substrate extends above the upper plane surface of the lower mold portion;

(b) closing the split mold such that the lower plane surface of the upper mold portion first contacts the upper surface of the single substrate, then compresses the compressible pressure plate until the lower plane surface of the upper mold portion contacts the upper plane surface of the lower mold portion, placing the substrate wholly within the lower cavity with the upper surface of the substrate, the lower surface of the upper mold portion, and the upper surface of the lower mold portion coplanar, and placing the IC wholly within the second cavity; and

(c) injecting molding material into the second cavity.

2. The method of claim 1 wherein the mold comprises more than two portions.

3. The method of claim 2 wherein the mold comprises four separate planar plates.

4. The method of claim 1 wherein, in step (a), the compressible pressure plate is spaced apart from the substrate by the shim plate.

5. The method of claim 4 wherein the shim plate is a metal plate.

6. The method of claim 1 wherein the lower mold portion comprises a plurality of first cavities arranged in a matrix pattern and the upper mold portion comprises a plurality of second cavities arranged in the same pattern, such that, with the mold closed each first cavity mates with a second cavity, providing a plurality of positions for encapsulating.

7. The method of claim 1 wherein the compressible pressure plate is made of a silicon rubber material.