Microelectronic encapsulation methods and equipment
First Claim
1. A method of encapsulating a plurality of microelectronic subassemblies comprising the steps of:
- providing a plurality of subassemblies each incorporating a dielectric layer overlying a surface of a microelectronic element, terminals on a top surface of the dielectric layer and leads connecting the terminals to contacts on the microelectronic element, said subassemblies being disposed side-by-side so that said microelectronic elements are side-by-side and so that said dielectric layers are disposed side-by-side, said dielectric layers defining openings;
filling a liquid composition between said dielectric layers and microelectronic elements while substantially preventing flow of said liquid onto said top surfaces of said dielectric layers through said openings;
applying a top covering layer extending over said top surfaces of said dielectric layers and occluding said openings so that said top covering layer prevents flow of said liquid onto said top surfaces during said filling step.
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Accused Products
Abstract
Microelectronic assemblies such as semiconductor chip assemblies are encapsulated. During encapsulation, the terminals carried by a dielectric layer in each assembly, and the bottom surface of the semiconductor chip in each assembly are protected by covering layers. The covering layers confine the liquid encapsulant and prevent contamination of the terminals and chip bottom surfaces. The encapsulation process may be conducted by using a tilting fixture. The liquid encapsulant and the assemblies are placed into the fixture, the fixture is closed and evacuated, and the encapsulant is then poured onto the assemblies while maintaining the fixture under vacuum. The fixture is then pressurized and maintained under pressure during cure of the encapsulant.
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Citations
26 Claims
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1. A method of encapsulating a plurality of microelectronic subassemblies comprising the steps of:
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providing a plurality of subassemblies each incorporating a dielectric layer overlying a surface of a microelectronic element, terminals on a top surface of the dielectric layer and leads connecting the terminals to contacts on the microelectronic element, said subassemblies being disposed side-by-side so that said microelectronic elements are side-by-side and so that said dielectric layers are disposed side-by-side, said dielectric layers defining openings; filling a liquid composition between said dielectric layers and microelectronic elements while substantially preventing flow of said liquid onto said top surfaces of said dielectric layers through said openings; applying a top covering layer extending over said top surfaces of said dielectric layers and occluding said openings so that said top covering layer prevents flow of said liquid onto said top surfaces during said filling step. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A method of encapsulating a plurality of microelectronic subassemblies comprising the steps of:
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providing a plurality of subassemblies each incorporating a dielectric layer overlying a surface of a microelectronic element, terminals on a top surface of the dielectric layer and leads connecting the terminals to contacts on the microelectronic element, said subassemblies being disposed side-by-side so that said microelectronic elements are side-by-side and so that said dielectric layers are disposed side-by-side, said microelectronic elements being separate from one another and defining openings therebetween, said microelectronic elements having bottom surfaces facing away from the dielectric layers; filling a liquid between said dielectric layers and microelectronic elements while substantially preventing flow of said liquid onto said bottom surfaces of said microelectronic elements through said openings; providing a bottom covering layer overlying the bottom surfaces of the microelectronic elements and occluding said openings, whereby said bottom covering layer will prevent said flow. - View Dependent Claims (17, 18, 20, 21, 22, 23, 24)
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19. A method of encapsulating a microelectronic device comprising the steps of:
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(a) placing the microelectronic device in a device-receiving pocket of a fixture; (b) placing a liquid encapsulant in a well in said fixture while said fixture is in a first orientation in which said well extends downwardly and said liquid is confined by gravity in said well; (c) sealing said fixture and evacuating air from within said fixture, to thereby degas said encapsulant and remove air from around said microelectronic device; (d) while said fixture remains sealed, turning the fixture to a second orientation to thereby pour the liquid encapsulant into the device-receiving pocket so that the liquid encapsulant surrounds the microelectronic device; and (e) curing the liquid encapsulant to a solid or gel surrounding the microelectronic device. - View Dependent Claims (25, 26)
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Specification