Method for forming a low impurity diffusion polysilicon layer
First Claim
1. A method for forming an impurity diffusion inhibited polysilicon layer comprising:
- forming over a semiconductor substrate an amorphous silicon layer;
forming over the semiconductor substrate a polysilicon layer in contact with the amorphous silicon layer;
annealing simultaneously the amorphous silicon layer and the polysilicon layer to form an impurity diffusion inhibited polysilicon layer, the impurity diffusion inhibited polysilicon layer being a polysilicon multi-layer with grain boundary mis-matched polycrystalline properties; and
forming adjoining the impurity diffusion inhibited polysilicon layer a metal silicide layer, the impurity diffusion inhibited polysilicon layer inhibiting diffusion of impurities from within the impurity diffusion inhibited polysilicon layer and the impurity diffusion inhibited polysilicon layer inhibiting diffusion of impurities through the impurity diffusion inhibited polysilicon layer from the metal silicide layer.
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Abstract
A method for forming within an integrated circuit a low impurity diffusion polysilicon layer. Formed upon a semiconductor substrate is an amorphous silicon layer. Formed also upon the semiconductor substrate and contacting the amorphous silicon layer is a polysilicon layer. The amorphous silicon layer and the polysilicon layer are then simultaneously annealed to form a low impurity diffusion polysilicon layer. The low impurity diffusion polysilicon layer is a polysilicon multi-layer with grain boundary mis-matched polycrystalline properties. Optionally, a metal silicide layer may be formed upon the amorphous silicon layer and the polysilicon layer either prior to or subsequent to annealing the amorphous silicon layer and the polysilicon layer. The metal silicide layer and low impurity diffusion polysilicon layer may then be patterned to form a polycide gate electrode.
114 Citations
22 Claims
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1. A method for forming an impurity diffusion inhibited polysilicon layer comprising:
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forming over a semiconductor substrate an amorphous silicon layer; forming over the semiconductor substrate a polysilicon layer in contact with the amorphous silicon layer; annealing simultaneously the amorphous silicon layer and the polysilicon layer to form an impurity diffusion inhibited polysilicon layer, the impurity diffusion inhibited polysilicon layer being a polysilicon multi-layer with grain boundary mis-matched polycrystalline properties; and forming adjoining the impurity diffusion inhibited polysilicon layer a metal silicide layer, the impurity diffusion inhibited polysilicon layer inhibiting diffusion of impurities from within the impurity diffusion inhibited polysilicon layer and the impurity diffusion inhibited polysilicon layer inhibiting diffusion of impurities through the impurity diffusion inhibited polysilicon layer from the metal silicide layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 22)
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11. A method for forming an impurity diffusion inhibited polycide gate electrode for use within a Metal Oxide Semiconductor Field Effect Transistor (MOSFET) comprising:
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forming over a semiconductor substrate an amorphous silicon layer; forming over the semiconductor substrate a polysilicon layer contacting the amorphous silicon layer; annealing simultaneously the amorphous silicon layer and the polysilicon layer to form an impurity diffusion inhibited polysilicon layer, the impurity diffusion inhibited polysilicon layer being a polysilicon multi-layer having grain boundary mis-matched polycrystalline properties; forming contacting the impurity diffusion inhibited polysilicon layer a metal silicide layer, the impurity diffusion inhibited polysilicon layer inhibiting diffusion of impurities from within the impurity diffusion inhibited polysilicon layer and the impurity diffusion inhibited polysilicon layer inhibiting diffusion of impurities through the impurity diffusion inhibited polysilicon layer from the metal silicide layer; and patterning the metal silicide layer and the impurity diffusion inhibited polysilicon layer to form a polycide gate electrode. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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