Method for the manufacture of contact-free cards

• US 5,767,503 A
• Filed: 08/30/1995
• Issued: 06/16/1998
• Est. Priority Date: 09/13/1994
• Status: Expired due to Fees

• Current Assignee: Gemplus (Thales SA)
• Original Assignee: Gemplus (Thales SA)
• Inventors: Gloton, Jean-Pierre
• Primary Examiner(s): Le, Hoanganh T.
• Assistant Examiner(s): Frech, Karl D.
• Application Number:
  US08/520,924
• Time in Patent Office: 1,021 Days
• Field of Search: 235/491, 235/487, 235/488, 235/380, 235/382, 235/382.5, 235/384, 235/492
• US Class Current: 235/487
• CPC Class Codes: G06K 19/07747 at least one of the integrated circuit chips being mounted as a module
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: G06K 19/07769 the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
• CPC Class Codes: G06K 19/07779 the inductive antenna being a coil
• CPC Class Codes: G06K 19/07783 the coil being planar
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 3/28 Applying non-metallic protective coatings H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673

Abstract

Disclosed is a method for the manufacture of a contact-free card comprising an antenna embedded in a card body and connected, by its connection terminals, to the contact zones of an electronic module of the card body as well as a card obtained by such a method. The method comprises depositing a plastic sheet in a cavity of a mold; dispensing liquid plastic material into the cavity; and distributing the material on the surface of the sheet so that it is guided by the antenna in order to form a layer of the card body. The disclosed method can be applied to cards that are exclusively contact-free cards and to combined cards designed for operations such as remote cash operations.

Claims

1. A method for the manufacture of a contact-free card comprising an antenna embedded in a card body and connected, by its connection terminals, to the contact zones of an electronic module of the card body, wherein said method comprises the following steps, according to which:

the antenna is placed in a cavity of a mold;

then

a liquid plastic material is dispensed into the cavity; and

then

the liquid plastic material is distributed within said cavity so that it is guided by the antenna to form a first layer of the card body which does not cover the connection terminals of the antenna.

2. A method according to claim 1 wherein, prior to the dispensing step, a plastic sheet is deposited into the cavity, and wherein the antenna is then placed on said sheet.

3. A method according to claim 2, wherein the cavity of the mold in which the sheet is deposited has dimensions, namely length and width, that are substantially equal to the dimensions, namely the length and width, of the contact-free card.

4. A method according claim 1, wherein the material is dispensed substantially at the center of the cavity.

5. A method according to claim 1, wherein the distribution is done by pressing the material using a pressing device.

6. A method according to claim 1, wherein the distribution is done in a spiral, the antenna itself having a spiral shape.

7. A method according to claim 1, wherein, above the first layer, there is formed a second layer of the card body which receives the electronic module.

8. A method according to claim 7, wherein the second layer has a housing in which the electronic module is inserted before the second layer is inserted into said cavity.

9. A method according to claim 1, further comprising connecting the contact zones of the electronic module to the connection terminals of the antenna following the step of dispensing the liquid plastic material into the cavity.

10. A method according to claim 9, wherein the step of connecting the contact zones of the electronic module to the connection terminals of the antenna is performed following the formation of the first layer of the card body.

11. A method according to claim 10, wherein the material solidifies prior to the step of connecting the contact zones of the electronic module to the connection terminals of the antenna.

12. A method for the manufacture of a contact free card, comprising:

providing a mold having a cavity formed therein;

then

placing an antenna in the cavity, the antenna having connection terminals;

then

dispensing a liquid plastic material into the cavity;

then

distributing the liquid plastic material, while using the antenna to guide material flow through the cavity, to form a first layer of a card body that does not cover the connection terminals of the antenna; and

then

connecting contact zones of an electronic module to the connection terminals of the antenna.

13. A method as defined in claim 12, further comprising depositing a plastic sheet in the cavity prior to the step of placing the antenna in the cavity, and wherein the antenna is positioned on top of the sheet.

14. A method as defined in claim 12, wherein the antenna is formed from multiple loops and has a spiral shape, and wherein, during the step of distributing the liquid plastic material, the material flows between the loops of the antenna in a spiral.

15. A method as defined in claim 12, wherein the step of distributing the liquid plastic material is performed by pressing the material from above to cause the material to flow.

16. A method as defined in claim 12, further comprising, prior to the step of connecting the connection zones of the electronic module to the terminals of the antenna, imbedding the electronic module in a second layer of the card body and then positioning the second layer over the first layer.

17. A method according to claim 12, wherein the plastic material solidifies prior to the step of connecting the contact zones of the electronic module to the connection terminals of the antenna.

18. A contact-free card comprising:

a plastic sheet;

a first distinct plastic layer disposed on top of said plastic sheet;

an antenna imbedded in said first plastic layer and having connection terminals on an upper surface thereof, wherein said first plastic layer and said antenna are of substantially equal average thickness so that said first plastic layer does not cover said connection terminals and wherein said first plastic layer is formed by placing the antenna in a cavity of a mold dispensing a liquid plastic material into the cavity, and then distributing the liquid plastic material while using the antenna to guide material flow through the cavity;

a second distinct plastic layer disposed on top of said first plastic layer; and

an electronic module imbedded in said second plastic layer and having connection zones which extend downwardly from said plastic layer and into electrical contact with said connection terminals of said antenna.

19. A method for the manufacture of a contact free card, comprising:

providing a mold having a cavity formed therein;

then

placing an antenna in the cavity, the antenna having connection terminals;

then

dispensing a liquid plastic material into the cavity under a pressure lower than 100 kg/cm² ;

then

distributing the liquid plastic material, while using the antenna to guide material flow through the cavity, to form a first layer of a card body.

20. A method as defined in claim 19, wherein the first layer of the card body does not cover the connection terminals of the antenna.

21. A method as defined in claim 20, further comprising connecting contact zones of an electronic module to the connection terminals of the antenna following the distributing step.

22. A method as defined in claim 19, further comprising attaching a micromodule to the connection terminals of the antenna prior to the dispensing step.