Structure for ESD protection in semiconductor chips

• US 5,767,552 A
• Filed: 06/05/1997
• Issued: 06/16/1998
• Est. Priority Date: 11/30/1995
• Status: Expired due to Term

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Ma, Manny K. F., Casper, Stephen L., Sher, Joseph C.
• Primary Examiner(s): MEIER, STEPHEN D
• Application Number:
  US08/869,513
• Time in Patent Office: 376 Days
• Field of Search: 257/379, 257/382
• US Class Current: 257/379
• CPC Class Codes: H01L 27/0288 using passive elements as protective elements, e.g. resistors, capacitors, inductors, spark-gaps

Abstract

An ESD protection structure for I/O pads is formed with well resistors underlying the active areas of a transistor. The well resistors are coupled in series with the active areas and provide additional resistance which is effective in protecting the transistor from ESD events. Metal conductors over the active areas, have a plurality of contacts to the active areas formed through an insulative layer to contact the active areas. Additional active areas adjacent to the active areas of the transistor are also coupled to the well resistors, and to a conductive layer which provides a conductor to the I/O pads. The active areas are silicided to reduce their resistance and increase the switching speed of the transistor. The n-well resistors are coupled in series to provide a large resistance with respect to that of the active areas to reduce the impact of ESD events.

Claims

1. An ESD protected CMOS semiconductor structure, comprising:

a lateral CMOS transistor having a source and a drain comprising first and second n+ doped active areas;

a first n-well resistor formed at least partially under the first active transistor area and conductively coupled thereto;

a third n+ area formed adjacently spaced from the first active transistor area and conductively coupled to the first n-well resistor;

a first and a second independent conductive layer formed on top of the first and third areas respectively, and insulated therefrom by an insulating layer, said conductive layers having independent sets of electrical contacts formed to contact the first and third areas respectively such that the electrical resistance observed between the sets of contacts comprises resistance provided by the first n-well resistor;

a second n-well resistor formed at least partially under the second active transistor area and conductively coupled thereto;

a fourth n+ area formed adjacently spaced from the second active transistor area and conductively coupled to the second n-well resistor;

a third and a fourth independent conductive layer formed on top of the second and fourth areas respectively and insulated therefrom by an insulating layer, said conductive layers having independent sets of electrical contacts formed to contact the second and fourth areas respectively such that the electrical resistance observed between the sets of contacts comprises resistance provided by the second n-well resistor.

2. The ESD protection structure of claim 1 wherein the first and second active areas are covered with a silicide.

3. The ESD protection device of claim 1, wherein said second conductive layer is coupled to a chip I/O pad.

4. The ESD protection device of claim 3, wherein said fourth conductive layer is coupled to a power supply.

5. The ESD protection device of claim 1, wherein said first well resistor, said transistor, and said second well resistor are disposed substantially in a straight line.

6. The ESD protection device of claim 5, wherein said second and fourth conductive layers are also substantially disposed in said straight line.

7. An ESD protected CMOS semiconductor structure, comprising:

a lateral CMOS transistor having a source and a drain comprising first and second p+ doped active areas;

a first p-well resistor formed at least partially under the first active area and conductively coupled thereto;

a third p+ area formed adjacently spaced from the first active transistor area and conductively coupled to the first p-well resistor;

a first and a second independent conductive layer formed on top of the first and third areas respectively, and insulated therefrom by an insulating layer, said conductive layers having independent sets of electrical contacts formed to contact the first and third areas respectively such that the electrical resistance observed between the sets of contacts comprises resistance provided by the first p-well resistor;

a second p-well resistor formed at least partially under the second active transistor area and conductively coupled thereto;

a fourth p+ area formed adjacently spaced from the second active transistor area and conductively coupled to the second p-well resistor;

a third and a fourth independent conductive layer formed on top of the second and fourth areas respectively and insulated therefrom by and insulating layer, said conductive layers having independent sets of electrical contacts formed to contact the second and fourth areas respectively such that the electrical resistance observed between the sets of contacts comprises resistance provided by the second p-well resistor.

8. The ESD protection structure of claim 7 wherein the first and second active areas are covered with a silicide.

9. The ESD protection device of claim 7, wherein said second conductive layer is coupled to a chip I/O pad.

10. The ESD protection device of claim 9, wherein said fourth conductive layer is coupled to a power supply.

11. The ESD protection device of claim 7, wherein said first well resistor, said transistor, and said second well resistor are disposed substantially in a straight line.

12. The ESD protection device of claim 11, wherein said second and fourth conductive layers are also substantially disposed in said straight line.

13. An ESD protection structure formed in a semiconductor substrate, said structure comprising:

a lateral CMOS transistor having a source and a drain comprising first and second heavily doped silicided active areas;

a third heavily doped silicided area separated from the first active area of said CMOS transistor;

a first well resistor formed between and only partially under the first active area of said transistor and said heavily doped third area and conductively coupled thereto, said first well resistor having a higher sheet resistance than said first active transistor area and said third area;

a first conductive layer disposed over said third area and electrically coupled thereto;

area;

a fourth heavily doped silicides layer separated from the second active area of said CMOS transistor;

a second well resistor formed between and only partially under the second active area of said transistor and said fourth heavily doped area and conductively coupled thereto, said second well resistor having a higher sheet resistance than said second active transistor area and said fourth area, and being disposed in a substantially straight line with said transistor and said first well resistor; and

a second conductive layer disposed over said fourth area and conductively coupled thereto.

14. The ESD protection structure of claim 13, further comprising:

a first insulative layer disposed between the third heavily doped area and the first conductive layer; and

a first plurality of contacts electrically connecting said first conductive layer to said third area.

15. The ESD protection structure of claim 14, further comprising:

a second insulative layer disposed between the fourth heavily doped area and the second conductive layer; and

a second plurality of contacts electrically connecting said second conductive layer to said fourth area.

16. The ESD protection structure of claim 14, further comprising:

a third conductive layer disposed over said first transistor area;

a third insulative layer disposed between said first transistor area and said first conductive layer; and

a third plurality of contacts electrically coupling said third conductive layer to said first transistor area.

17. The ESD protection structure of claim 16, further comprising:

a fourth conductive layer disposed over said second transistor area;

a fourth insulative layer disposed between said second transistor area and said second conductive layer; and

a fourth plurality of contacts electrically coupling said fourth conductive layer to said second transistor area.

18. The ESD protection structure of claim 13, wherein the first well resistor is doped with N type impurities.

19. The ESD protection structure of claim 18, wherein the second well resistor is doped with N type impurities.