Optoelectronic package including photonic device mounted in flexible substrate

• US 5,768,456 A
• Filed: 11/22/1996
• Issued: 06/16/1998
• Est. Priority Date: 11/22/1996
• Status: Expired due to Fees

• Current Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Knapp, James H., Foley, Barbara M.
• Primary Examiner(s): Lee, John D.
• Application Number:
  US08/753,311
• Time in Patent Office: 571 Days
• Field of Search: 385/39, 385/49, 385/50, 385/52, 385/88-92
• US Class Current: 385/49
• CPC Class Codes: G02B 6/424 Mounting of the optical light guide
• CPC Class Codes: G02B 6/4249 comprising arrays of active devices and fibres
• CPC Class Codes: G02B 6/4257 having a supporting carrier or a mounting substrate or a mounting plate G02B6/3648 takes precedence
• CPC Class Codes: G02B 6/4261 Packages with mounting structures to be pluggable or detachable, e.g. having latches or rails
• CPC Class Codes: G02B 6/4274 Electrical aspects G02B6/4263 and G02B6/4265 take precedence
• CPC Class Codes: G02B 6/4292 the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements

Abstract

An optoelectronic package including an interconnect substrate having electronic components and carrying an optical fiber holder. The holder containing an end of an optical fiber and including an end surface in which is formed alignment openings. A flexible substrate having conductive traces, a first end, a second end, and alignment openings formed proximate the first end, interconnects the holder and the electronic components of the interconnect substrate. A photonic unit is mechanically and electrically coupled to the flexible substrate proximate the first end in precise relation to the alignment openings so as to be aligned with the optical fiber by inserting alignment pins extending concurrently through the alignment openings of the flexible substrate and the alignment openings of the optical fiber holder.

Claims

1. An optoelectronic mount for interconnecting fiber optics with electronic components comprising:

a flexible substrate including a layer of flexible insulation and electrical traces positioned in the layer of flexible insulation and extending from a first end to a second end, a mounting opening in the layer of flexible insulation exposing portions of the electrical traces adjacent the first end, and alignment openings formed in the flexible substrate proximate the first end and in precise relation to the mounting opening;

an optical fiber holder containing an end of an optical fiber and including an end surface in which is formed alignment openings, the optical fiber including an input surface substantially flush with the end surface;

a photonic unit including a photonic device, mechanically fixed in the layer of flexible insulation and electrically coupled to the electrical traces of the flexible substrate in the mounting opening proximate the first end in precise relation to the alignment openings in the flexible substrate; and

alignment pins extending concurrently through the alignment openings of the flexible substrate and the alignment openings of the optical fiber holder.

2. An optoelectronic mount as claimed in claim 1 wherein the a flexible substrate further includes a window with which the photonic device is aligned.

3. An optoelectronic mount as claimed in claim 2 wherein the photonic unit includes an array of photonic devices and the optical fiber holder contains a plurality of optical fibers, each corresponding to one of the array of photonic devices.

4. An optoelectronic mount as claimed in claim 3 further including a base having a plurality of optical elements formed therein, positioned between the optical fiber holder and the photonic unit such that each optical element is aligned with a corresponding one of the plurality of optical fibers and photonic devices.

5. An optoelectronic mount as claimed in claim 4 wherein the base includes alignment openings formed therethrough for receiving said alignment pins.

6. An optoelectronic mount as claimed in claim 4 wherein the optical fiber holder includes a receptacle extending from the end surface and defining a slot in which is carried the base such that each optical element is aligned with the corresponding optical fiber.

7. An optoelectronic mount as claimed in claim 2 further including an optical element positioned between the optical fiber holder and the photonic unit, and aligned with the optical fiber and the photonic device.

8. An optoelectronic mount as claimed in claim 7 wherein the optical element includes alignment openings formed therethrough for receiving said alignment pins.

9. An optoelectronic mount as claimed in claim 7 wherein the optical fiber holder includes a receptacle extending from the end surface and defining a slot in which is carried the optical element, aligned with the optical fiber.

10. An optoelectronic package comprising:

an interconnect substrate having electronic components;

an optical fiber holder carried by the interconnect substrate, the optical fiber holder containing an end of an optical fiber and including an end surface in which is formed alignment openings, and;

a flexible substrate having a layer of flexible insulation, conductive traces formed in the layer of flexible insulation, a first end, a second end, a mounting opening in the layer of flexible insulation exposing portions of the electrical traces adjacent the first end, and alignment openings formed proximate the first end, the flexible substrate interconnecting the optical fiber holder and the electronic components of the interconnect substrate;

a photonic unit including a photonic device, mechanically fixed in the layer of flexible insulation and electrically coupled to the electrical traces of the flexible substrate in the mounting opening proximate the first end in precise relation to the alignment openings in the flexible substrate; and

alignment pins extending concurrently through the alignment openings of the flexible substrate and the alignment openings of the optical fiber holder.

11. An optoelectronic package as claimed in claim 10 wherein the a flexible substrate further includes a window with which the photonic unit is aligned.

12. An optoelectronic package as claimed in claim 11 wherein the photonic unit includes an array of photonic devices and the optical fiber holder contains a plurality of optical fibers, each corresponding to one of the array of photonic devices.

13. An optoelectronic package as claimed in claim 12 further including a base having a plurality of optical elements formed therein, positioned between the optical fiber holder and the photonic unit such that each optical element is aligned with a corresponding one of the plurality of optical fibers and photonic devices.

14. An optoelectronic package as claimed in claim 13 wherein the base includes alignment openings formed therethrough for receiving said alignment pins.

15. An optoelectronic package as claimed in claim 13 wherein the optical fiber holder includes a receptacle extending from the end surface and defining a slot in which is carried the base such that each optical element is aligned with the corresponding optical fiber.

16. An optoelectronic package as claimed in claim 11 further including an optical element positioned between the optical fiber holder and the photonic unit, and aligned with the optical fiber and the photonic device.

17. An optoelectronic package as claimed in claim 16 wherein the optical element includes alignment openings formed therethrough for receiving said alignment pins.

18. An optoelectronic package as claimed in claim 10 wherein the optical fiber holder includes a receptacle extending from the end surface and defining a slot in which is carried the optical element, aligned with the optical fiber.