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Optoelectronic package including photonic device mounted in flexible substrate

  • US 5,768,456 A
  • Filed: 11/22/1996
  • Issued: 06/16/1998
  • Est. Priority Date: 11/22/1996
  • Status: Expired due to Fees
First Claim
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1. An optoelectronic mount for interconnecting fiber optics with electronic components comprising:

  • a flexible substrate including a layer of flexible insulation and electrical traces positioned in the layer of flexible insulation and extending from a first end to a second end, a mounting opening in the layer of flexible insulation exposing portions of the electrical traces adjacent the first end, and alignment openings formed in the flexible substrate proximate the first end and in precise relation to the mounting opening;

    an optical fiber holder containing an end of an optical fiber and including an end surface in which is formed alignment openings, the optical fiber including an input surface substantially flush with the end surface;

    a photonic unit including a photonic device, mechanically fixed in the layer of flexible insulation and electrically coupled to the electrical traces of the flexible substrate in the mounting opening proximate the first end in precise relation to the alignment openings in the flexible substrate; and

    alignment pins extending concurrently through the alignment openings of the flexible substrate and the alignment openings of the optical fiber holder.

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