Heat pipe with embedded wick structure

• US 5,769,154 A
• Filed: 01/29/1996
• Issued: 06/23/1998
• Est. Priority Date: 01/29/1996
• Status: Expired due to Fees

• Current Assignee: United States Department of Energy (Government of the United States of America), Sandia Corporation (Martin Marietta Corporation)
• Original Assignee: Sandia Corporation (Martin Marietta Corporation)
• Inventors: Palmer, David W., Grafe, V. Gerald, Adkins, Douglas Ray, Tuck, Melanie R., Shen, David S.
• Primary Examiner(s): Lazarus, Ira S.
• Assistant Examiner(s): ATKINSON, CHRISTOPHER MARK
• Application Number:
  US08/593,596
• Time in Patent Office: 876 Days
• Field of Search: 165/104.33, 165/104.26, 257/715, 361/700, 126/45, 126/96
• US Class Current: 165/104.26
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 15/04 with tubes having a capillary structure
• CPC Class Codes: F28D 15/046 characterised by the material or the construction of the capillary structure

Abstract

A heat pipe has an embedded wick structure that maximizes capillary pumping capability. Heat from attached devices such as integrated circuits evaporates working fluid in the heat pipe. The vapor cools and condenses on a heat dissipation surface. The condensate collects in the wick structure, where capillary pumping returns the fluid to high heat areas.

Claims

1. A wick structure comprising a substrate having a surface with a width and a length not less than the width, and a plurality of projections disposed on the surface in an arrangement so that no straight fluid communication path can be drawn across the surface that does not intersect at least one projection, wherein the surface defines an x axis disposed along the surface, and a y axis disposed along the surface at an angle to the x axis, and wherein the projections comprise:

a) a plurality of first projections extending from the surface, where each of the first projections has a length along the x-axis and extends from a first point (x1, y1) to a second point (x1, y2);

b) a plurality of second projections extending from the surface, where each of the second projections has a length along the y-axis and extends from a first point (x1, y1) to a second point (x2, y1); and

wherein the arrangement comprises;

c) each first projection separated from every other first projection by at least one of;

a first x-distance along the direction of the x axis, and a first y distance along the direction of the y axis;

d) each second projection separated from every other second projection by at least one of;

a second x-distance along the direction of the x axis, and a second y-distance along the direction of the y axis; and

e) where every line parallel to the y axis encounters at least one second projection and every line parallel to the x axis encounters at least one first projection.

2. The wick structure of claim 1 wherein each projection extends from the surface a distance at least one fourth the minimum of:

the first x-distance, the second x-distance, the first y-distance, and the second y-distance between neighboring projections.

3. The wick structure of claim 1 wherein the projections cover less than one half of the total surface area of the substrate.

4. The wick structure of claim 1 wherein:

a) the arrangement further comprises each second projection intersecting a corresponding first projection;

b) the distance parallel to the y axis from any first projection to the nearest second projection is less than one half the length of the first projection; and

c) the distance parallel to the x axis from any second projection to the nearest first projection is less than one half the length of the second projection.

5. The wick structure of claim 4 wherein each second projection intersects the corresponding first projection near the middle of the second projection and near the middle of the first projection.

6. The wick structure of claim 4 wherein each second projection intersects the corresponding first projection near the end of the second projection and near the middle of the first projection.

7. The wick structure of claim 4 wherein each second projection intersects the corresponding first projection near the end of the second projection and near the end of the first projection.

8. A heat pipe system for removing heat from a heat source comprising:

a) a wick structure comprising;

i) a substrate having a surface with a width and a length not less than the width and wherein the surface defines an x axis disposed along the surface, and a y axis disposed along the surface at an angle to the x axis; and

ii) a plurality of projections comprising;

a) plurality of x-projections from the surface, where each x-projection has a length and extends from a first point (x1, y1) to a second point (x1, y2);

b) a plurality of y-projections from the surface, where each y-projection has a length and extends from a first point (x1, y1) to a second point (x2, y1); and

iii) wherein the projections are disposed on the surface in an arrangement comprising;

a) each x-projection separated from every other x-projection by at least a first x-distance along the direction of the x axis and at least a first y distance along the direction of the y axis;

b) each y-projection separated from every other y-projection by at least a second x-distance along the direction of the x axis and at least a second y-distance along the direction of the y axis; and

c) where every line parallel to the y axis encounters at least one y-projection and every line parallel to the x axis encounters at least one x-projection

b) a cap sealably mounted with the wick structure substrate so that the wick structure and the cap enclose a volume, the cap further comprising a vapor channel that allows vapor to flow from one region of the cap to another region of the cap;

c) a fluid within the volume.

9. The heat pipe of claim 8 where the cap is mounted to the wick structure substrate by boron-phosphorous-silicate-glass bonding.

10. The heat pipe of claim 8 further comprising a plurality of vapor channels in the cap.

11. The heat pipe of claim 8 further comprising means for mounting a heat dissipation device to the cap.

12. The heat pipe of claim 8 wherein the fluid is chosen from:

alcohol, freon, water, acetone.