Control of etch selectivity

• US 5,770,097 A
• Filed: 06/11/1997
• Issued: 06/23/1998
• Est. Priority Date: 12/23/1994
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Singh, Jyothi, O'Neill, James Anthony
• Primary Examiner(s): Gorgos, Kathryn L.
• Assistant Examiner(s): Leader, William T.
• Application Number:
  US08/873,055
• Time in Patent Office: 377 Days
• Field of Search: 216/59, 216/60, 216/67, 216/68, 438/714, 438/719, 438/723
• US Class Current: 216/60
• CPC Class Codes: B24B 37/013 Devices or means for detecting lapping completion
• CPC Class Codes: G11B 5/84 Processes or apparatus specially adapted for manufacturing record carriers
• CPC Class Codes: G11B 5/855 Coating only part of a support with a magnetic layer
• CPC Class Codes: H01J 37/32935 Monitoring and controlling tubes by information coming from the object and/or discharge
• CPC Class Codes: H01J 37/3299 Feedback systems
• CPC Class Codes: H01L 21/3065 Plasma etching; Reactive-ion etching
• CPC Class Codes: H01L 21/31116 by dry-etching
• CPC Class Codes: H01L 22/26 Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement endpoint detection arrangements in CMP apparatus B24B37/013, in discharge apparatus H01J37/32

Abstract

Selective etching of separate materials in a manufacture of a device, such as a layer of silicon dioxide on a substrate of silicon in a semiconductor device, is accomplished in a reaction chamber having an RF electromagnetic field which interacts with plural etchants in gaseous phase to produce ions for etching the materials. The ratio of the concentration of etchants affect the relative rates of etching the respective materials. By pulsing the rf excitation waveform, intervals of deenergization of the field are produced repetitively wherein, during any one of these intervals, there is a decay in the concentration of each ionized etchant. Rates of decay and the resulting lifetimes differ for each of the etchants. Thereby, by adjustment of the duration of the deenergization interval, the average concentration of one etchant relative to the average concentration of a second etchant can be varied to attain selective etching of the materials. Continuous monitoring of etchant concentrations, as by ultraviolet absorption spectroscopy, permits automatic control of the modulation to attain a desired etch selectivity in real time.

Claims

1. A method for selectively etching a plurality of materials of a workpiece comprising steps of:

enveloping the workpiece with a plasma having first and second species of a reactant which are operative to etch said plurality of materials, said plasma being provided by interacting an RF electromagnetic field with said first and said second species;

modulating said field by pulse-width modulation to provide a sequence of field energization intervals interspersed among intervals of field deenergization, said first and said second species of reactant being characterized respectively by first and second rates of decay during one of said deenergization intervals, said first rate of decay being different from said second rate of decay resulting in an etchant concentration ratio of average values of concentrations of said first and said second species of reactant which varies in dependency on a duration of said one deenergization interval, and wherein an etching of said materials results in an etch selectivity ratio of a first etching rate of a first of said materials relative to a second etching rate of a second of said materials, the etch selectivity ratio depending on said etchant concentration ratio and on the duration of said one deenergization interval;

measuring concentrations of said first and said second species of said reactant in said plasma for providing said etchant concentration ratio;

based on said etchant concentration ratio, determining said etch selectivity ratio; and

wherein, in said modulating step, the durations of said deenergization intervals are adjusted to obtain a desired value of the etch selectivity ratio.

2. A method according to claim 1 wherein said measuring step is accomplished by use of ultraviolet absorption spectroscopy.

3. A method according to claim 2 wherein said measuring includes generating a beam of ultraviolet radiation, pulsing or chopping said beam, directing said beam through said plasma, and detecting said beam upon a propagation of said beam through said plasma.

4. A method according to claim 1 wherein said determining step includes storing etching rates of said first and said second materials as a function of said etchant concentration ratio for the outputting of said etch selectivity ratio.

5. A method according to claim 1 wherein said modulating is accomplished by repetitively energizing and deenergizing said electromagnetic field, and said determining step includes calculating said etchant concentration ratio in response to measurements of concentrations of said first and said second species of reactant, and said modulating step is accomplished in response to a value of the etchant concentration ratio outputted by said determining step to obtain a desired selective etching of said plurality of materials.