Spring clamp assembly for improving thermal contact between stacked electronic components
First Claim
1. A spring clamp device for clamping together a stack of electronic components, comprising:
- a spring member including at least one torsion spring coil;
a first component of said stack having peripheral sides;
coupling means including structure for latching to said peripheral sides of said first component of said stack, said spring member further including a first connecting member for operatively connecting said spring coil to said coupling means at one of said peripheral sides and a second connecting member for operatively connecting said spring coil to said coupling means at another of said peripheral sides for tensioning said at least one coil in a clamped configuration such that a peripheral edge of said at least one coil urges a second component of said stack against said first component.
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Accused Products
Abstract
A spring clamp device providing a compressive stress to a stack of components includes a spring member and a bracket having attachment structure for engaging mating structure near the bottom of the stack. The bracket is first engaged with the mating structure such that it straddles the stack. The spring member is then latched to the bracket under tension in an assembled configuration, thereby applying an upward reaction on the mating structure with the attachment structure of the bracket and applying a downward reaction force to the top of the stack with the spring member. The oppositely directed forces apply a compressive stress to the stack, which improves thermal contact between the components.
46 Citations
54 Claims
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1. A spring clamp device for clamping together a stack of electronic components, comprising:
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a spring member including at least one torsion spring coil; a first component of said stack having peripheral sides; coupling means including structure for latching to said peripheral sides of said first component of said stack, said spring member further including a first connecting member for operatively connecting said spring coil to said coupling means at one of said peripheral sides and a second connecting member for operatively connecting said spring coil to said coupling means at another of said peripheral sides for tensioning said at least one coil in a clamped configuration such that a peripheral edge of said at least one coil urges a second component of said stack against said first component. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A spring clamp device for improving thermal contact between members of a stack of electronic components in an clamped configuration with the stack, comprising:
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a torsion spring, including; a coil having a central axis transverse to the direction of the compressive stress in the assembled configuration; and a pair of spring arms extending outward from ends of the coil and defining an obtuse included angle; and a bracket having an approximately H-shaped profile, including; a cross member structured to span across a top component of the stack in the clamped configuration; a leg depending downward from each end of the cross member and next to a side of the stacked components when spanned by the cross member, each leg comprising a surface for engaging a lower component of the stack below the top component; and an upright arm extending upward from each end of the cross member, an upper end of each arm forming a spring engaging member for engaging a respective one of the spring arms, configured such that the spring is tensioned in the clamped configuration, in which the bracket spans the stacked components, the legs engage with the lower component and both spring arms engage with the spring engaging members, and such that a peripheral edge of the coil urges the top component toward the lower component to produce a compressive stress in the stack, whereby thermal contact between the components is improved. - View Dependent Claims (18, 19)
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20. A heat dissipating assembly, comprising:
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an electronic device generating thermal energy during operation; a heat sink mounted on top of the electronic device; a spring clamp device including a torsion spring member comprising at least one coil and coupling means comprising structure for latching to peripheral sides of one of the electronic device and a socket in which the electronic device is mounted and for tensioning the at least one coil in a clamped configuration such that a peripheral edge of the at least one coil urges the heat sink against the electronic device. - View Dependent Claims (21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33)
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34. A method of improving thermal contact between an electronic device and a heat sink, comprising:
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positioning the heat sink on top of the electronic device; attaching a bracket to opposite sides of the electronic device; linking a torsional spring member to the bracket under tension, producing an upward reaction on the electronic device and producing a downward reaction on the top of the heat sink.
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35. A method of improving thermal contact between an electronic device and a heat sink, comprising:
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mounting the electronic device in a socket having mounting bosses projecting from opposite peripheral sides; positioning the heat sink on top of the electronic device; straddling the heat sink with a bracket comprising a cross member, legs depending from the cross member, and spaced apart spring engaging members at opposite ends of the cross member; engaging the legs to the mounting bosses by pressing the bracket downwards toward a top of the heat sink; and latching a torsion spring member to the spring engaging members under tension, to apply an upward reaction force on the socket with the legs and to apply a downward reaction force to the top of the heat sink with the spring member. - View Dependent Claims (36, 37, 38, 39, 40)
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41. A spring clamp device for clamping together a stack of electronic components that includes a top component and a lower component below said top component, comprising:
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a torsion spring, including a coil having a central axis and arms extending outward from respective ends of said coil, said arms being in a first angular relation when said torsion spring is in a relaxed configuration; and coupling means including first structure for latching to opposite peripheral sides of said lower component and second structure for latching said torsion spring in an assembled configuration clamping said stack wherein said arms are in a second angular relation relatively rotated from said first angular relation, said coil in said assembled configuration urging said top component towards said lower component to thereby clamp together said stack of electronic components. - View Dependent Claims (42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54)
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Specification