Temperature and passive infrared sensor module

• US 5,772,326 A
• Filed: 08/30/1996
• Issued: 06/30/1998
• Est. Priority Date: 08/30/1996
• Status: Expired due to Term

• Current Assignee: Hubbell, Inc.
• Original Assignee: Hubbell, Inc.
• Inventors: Eckel, David P., Batko, Thomas J.
• Primary Examiner(s): GUTIERREZ, DIEGO F
• Application Number:
  US08/705,778
• Time in Patent Office: 669 Days
• Field of Search: 374/142, 374/138, 374/135, 236/51, 236/47, 236/DIG. 19, 250/342, 250/349, 250/DIG. 1, 250/339.04, 250/339.14, 340/567
• US Class Current: 374/142
• CPC Class Codes: G01K 1/16 Special arrangements for conducting heat from the object to the sensitive element
• CPC Class Codes: G08B 13/19 using infrared-radiation detection systems G08B13/194 takes precedence
• CPC Class Codes: H05K 1/0201 Thermal arrangements, e.g. for cooling, heating or preventing overheating
• CPC Class Codes: H05K 1/18 Printed circuits structurally associated with non-printed electric components H05K1/0201, H05K1/023, H05K1/0243, and H05K1/16 take precedence
• CPC Class Codes: Y10S 236/19 Ventilated thermostat
• CPC Class Codes: Y10S 250/01 Passive intrusion detectors

Abstract

A temperature and passive infrared sensor module comprising a sensor module housing having air flow vents therein in top and bottom or side surfaces to allow air to circulate through the sensor module housing. A temperature sensor is mounted in the sensor module housing in a position which is exposed to air circulating through the sensor module housing. A passive infrared sensor is also mounted in the sensor module housing in a manner in which it is not exposed to air circulating through the sensor module housing, such that it is not adversely affected thereby. In one embodiment, a foam block is positioned around to encase and isolate the passive infrared detector. In several embodiments, the passive infrared sensor and temperature sensor are mounted on opposite sides of the printed circuit board such that air circulates around the temperature sensor only on one side of the printed circuit board. In other embodiments, the passive infrared sensor and temperature are positioned on the same side of a printed circuit board, and a partition is positioned therebetween to prevent air circulating around the temperature sensor from reaching and circulating around the passive infrared sensor.

Claims

1. A temperature and passive infrared sensor module comprising:

a. a sensor module housing having air flow vents therein to allow air to circulate through the sensor module housing;

b. a temperature sensor mounted in the sensor module housing in a position which is exposed to air circulating through the sensor module housing;

c. a passive infrared sensor mounted in the sensor module housing, with a layer of insulating material surrounding the passive infrared sensor such that the passive infrared sensor is not exposed to air circulating through the sensor module housing and is not adversely affected thereby.

2. A temperature and passive infrared sensor module as claimed in claim 1, wherein the air flow vents are provided in a top surface and a bottom surface of the sensor module housing to provide a circulating air flow around the temperature sensor.

3. A temperature and passive infrared sensor module as claimed in claim 2, wherein the air flow vents are provided in opposite side surfaces of the sensor module housing to provide a circulating air flow around the temperature sensor.

4. A temperature and passive infrared sensor module as claimed in claim 1, wherein the layer of insulating material includes a foam block positioned on four sides surrounding the passive infrared detector.

5. A temperature and passive infrared sensor module as claimed in claim 4, wherein the passive infrared sensor includes electrical leads extending thereto and the foam block is also positioned around the electrical leads.

6. A temperature and passive infrared sensor module as claimed in claim 4, including a lens positioned on a fifth side of the passive infrared detector to focus infrared radiation thereon and which also prevents air which is circulating through the module housing from circulating around the passive infrared sensor.

7. A temperature and passive infrared sensor module as claimed in claim 6, including a lens retainer element for retaining the lens securely in place, wherein the foam block is positioned between the lens retainer element and a printed circuit board on which the passive infrared sensor is mounted.

8. A temperature and passive infrared sensor module as claimed in claim 6, including a photocell mounted adjacent to the passive infrared sensor for detecting ambient light.

9. A temperature and passive infrared sensor module as claimed in claim 1, wherein the temperature sensor and the passive infrared sensor are mounted on a printed circuit board.

10. A temperature and passive infrared sensor module as claimed in claim 9, wherein a plurality of electrical components of the sensor module are mounted on a first side of the printed circuit, the temperature sensor is mounted on the first side of the printed circuit board, and the passive infrared sensor is mounted on a second opposite side of the printed circuit board.

11. A temperature and passive infrared sensor module as claimed in claim 9, wherein the passive infrared sensor includes electrical leads extending through the printed circuit board, and a layer of insulating material is positioned around the electrical leads extending through the printed circuit board.

12. A temperature and passive infrared sensor module as claimed in claim 1, wherein the passive infrared sensor and temperature sensor are mounted on opposite sides of a printed circuit board and air circulates around the temperature sensor on one side of the printed circuit board but does not circulate around the passive infrared sensor on the opposite side of the printed circuit board.

13. A temperature and passive infrared sensor module as claimed in claim 1, wherein the passive infrared sensor and temperature sensor are positioned on the same side of a printed circuit board, and a partition between the passive infrared sensor and the temperature sensor prevents air circulating around the temperature sensor from circulating around the passive infrared sensor.

14. A temperature and passive infrared sensor module as claimed in claim 1, wherein the passive infrared sensor includes electrical leads extending thereto and the insulating material is also positioned around the electrical leads.

15. A temperature and passive infrared sensor module comprising:

a. a sensor module housing having air flow vents therein to allow air to circulate through the sensor module housing;

b. a temperature sensor mounted in the sensor module housing in a position which is exposed to air circulating through the sensor module housing;

c. at least one air duct extending between the air flow vents and the temperature sensor to channel the flow of air from the air flow vents to the temperature sensor.

d. a passive infrared sensor mounted in the sensor module housing in a position in which the passive infrared sensor is not exposed to air circulating through the sensor module housing and is not adversely affected thereby.

16. A temperature and passive infrared sensor module as claimed in claim 15, including a plurality of air ducts extending from the top of the sensor module housing to the bottom of the sensor module housing, and wherein the temperature sensor is mounted centrally within the plurality of air ducts.

17. A temperature and passive infrared sensor module as claimed in claim 15, wherein the air flow vents in the sensor module housing include air flow vents in a top and in a bottom of the sensor module housing, and wherein the temperature sensor is mounted on a first side of a printed circuit board on which a plurality of electrical components are mounted, and the air duct is mounted in a position covering the temperature sensor, and extends from the air flow vents in the top of the sensor module housing to the air flow vents in the bottom of the sensor module housing.

18. A temperature and passive infrared sensor module as claimed in claim 17, wherein a layer of foam insulating material is placed around the temperature sensor in an aperture in the air duct in which the temperature sensor is positioned.

19. A temperature and passive infrared sensor module as claimed in claim 17, wherein the air duct covers substantially the entire side of the printed circuit board on which the temperature sensor is mounted.

20. A temperature and passive infrared sensor module as claimed in claim 17, wherein the passive infrared sensor is mounted on an opposite side of the printed circuit board from the temperature sensor, and the printed circuit board is pivoted about a first end to adjust the angular field of view of the passive infrared sensor, and the temperature sensor is positioned nearer to the first end of the printed circuit board than a second opposite end of the printed circuit board.

21. A temperature and passive infrared sensor module as claimed in claim 20, wherein the air duct is secured to a back housing member of the sensor module housing.

22. A temperature and passive infrared sensor module as claimed in claim 15, wherein the temperature sensor is mounted in a small enclosure within the sensor module housing and the small enclosure includes air flow vents in a bottom surface of the small enclosure and also near the top of the small enclosure to allow air to circulate therein and around the temperature sensor.

23. A temperature and passive infrared sensor module as claimed in claim 15, wherein the air flow vents in the sensor module housing include air flow vents in a bottom surface and air flow vents in opposite side surfaces of the sensor module housing, and the temperature sensor is positioned in the sensor module housing centrally between the air flow vents in the bottom surface and the air flow vents in the opposite side surfaces.

24. A temperature and passive infrared sensor module as claimed in claim 15, wherein the temperature sensor is mounted on a separate temperature sensor printed circuit board which is positioned in the sensor module housing centrally between air flow vents in a bottom surface of the sensor module housing and air flow vents near the top of the sensor module housing.